Page 34 - ASME InterPACK 2017 Program

Workshops

HETEROGENEOUS INTEGRATION TECHNOLOGY
ROADMAP WORKSHOP

FRIDAY, SEPTEMBER 1, 2017 8:00 am – 12:00 pm
Room: Mason I & II, Second Floor

The 2017 InterPACK Conference is please to host the Heterogeneous Integration Roadmap
workshop. We invite all the InterPACK participants to attend this important working session
for our profession and for our industry. The workshop is open to all. It is FREE for Inter-
PACK’17 attendees but there will be a $50 fee for attendance outside InterPACK 2017.

Advanced registration is required!

Abstract
Our Industry has reinvented itself through multiple disruptive changes in technologies,
products and markets. With the rapid migration of logic, memory and applications to the
Cloud infrastructures, the Internet of Things (IoT) to internet of everything (IOE), smart
devices every where, and autonomous automotive, the pace of innovation is increasing to
meet these challenges. The Heterogeneous Integration Technology Roadmap (HIR), is
sponsored by the IEEE CPMT Society, the Electron Devices Society (EDS), Photonics
Society together with SEMI and ASME EPPD. It will address the future directions of
heterogeneous integration technologies and applications serving the future markets and
applications, so very crucial to our societies’ fields of interest and to our industries and
academic and research communities. In addition to Heterogeneous Integration Roadmap
(HIR) two other Roadmaps are under development within IEEE: International Technology
Roadmap for Wide Band-Gap Semiconductors (ITRW) sponsored by the IEEE Power
Electronics Society (PELS), and International Technology Roadmap for Devices & Systems
(IRDS), an IEEE Standards Association Industry Connection Program sponsored by the
Rebooting Computing Initiative. Coordination initiative is underway for collaboration and
harmonization among the roadmaps.

Bill Chen Biographies
ASE Fello, ASE William T. Chen (M’92, SM‘03, F’06) received his engineering education at University of
Group London (B.Sc), Brown University (M.Sc) and Cornell University (PhD). He joined IBM
Corporation at Endicott New York in 1963. At IBM he worked in a broad range of IBM
34 microelectronic packaging products. He received IBM Division President Award for his
leadership and innovation in Predictive Modelling on IBM products. He was elected to the
IBM Academy of Technology for his contributions to IBM Products and Packaging
Technologies. He retired from IBM in 1997. He joined the Institute of Materials Research
and Engineering (IMRE) in Singapore, to initiate research in microelectronic packaging
materials and processes. He was appointed to the position Director of the Institute (IMRE)
steering the growth in people, funding and research facilities and research direction for
IMRE to become the leading materials science and engineering research center in the
ASEAN region. In 2001 he joined ASE Group, where he holds the position of ASE Fellow
and Senior Technical Advisor. In this assignment he has responsibilities for guidance to
technology strategic directions for ASE Group. He is Senior Past President of the IEEE/
CPMT Society. He is the Co-Chair of the ITRS Assembly and Packaging Roadmap
Technical Working Group. He is chair of the Semicon West Packaging Committee. He has
been elected to a member of the iNEMI Board. He is a member of the Technology
Committee of GSA. He has been elected to Fellow of IEEE and Fellow of ASME. He has
served as an Associate Editor of ASME Journal of Electronic Packaging, and IEEE/CPMT
Transactions.