Page 38 - ASME InterPACK 2017 Program
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Technical Sessions TUESDAY, AUGUST 29
TUESDAY, AUGUST 29 KNOWLEDGE BASED QUALIFICATION METHODOLOGY TO
EVALUATE SHOCK INDUCED RISKS IN BGA COMPONENTS
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- Technical Paper Publication. IPACK2017-74082
SYSTEMS WITH DIVERSE FUNCTIONALITY
Min Pei, Intel, Hillsboro, OR, United States, Guru Arakere, Intel, Chandler,
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States AZ, United States, Milena Vujosevic, Intel Corporation, San Jose, CA,
United States
Track Co-Chairs: Winston Zhang, Novark Technology Inc., Shenzhen, TRACK 5 TRANSPORTATION: AUTONOMOUS &
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington, ELECTRIC VEHICLES
TX, United States
1-3 Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
FRACTURE, FATIGUE AND THERMOMECHANICAL States
RELIABILITY OF DEVICES & PACKAGES
1-3-1 Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,
Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
FRACTURE, FATIGUE AND THERMOMECHANICAL RELIABILITY - I Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL,
United States
Second Floor, Montgomery 4:00pm – 5:30pm
5-2
Session Chair: Qian Jiang, University of Maryland, College Park, MD, HIGH TEMPERATURE ELECTRONICS
United States
Session Co-Chair: Subhasis Mukherjee, San Disk, a Western Digital 5-2-1
Brand, Milpitas, CA, United States HIGH TEMPERATURE ELECTRONICS
Second Floor, Washington
EFFECT OF STATIC AND DYNAMIC AGING ON FATIGUE 4:00pm – 5:30pm
BEHAVIOR OF SN3.0AG0.5CU SOLDER ALLOY
Technical Paper Publication. IPACK2017-74201 Session Chair: Chandradip Patel, Schlumberger Technology Corporation,
Houston, TX, United States
Yiran Li, Yuvraj Singh, Ganesh Subbarayan, Purdue University, West Session Co-Chair: Vibhash Jha, NXP, Austin, TX, United States
Lafayette, IN, United States
EFFECT OF ALLOY COMPOSITION AND AGING ON THE HIGH TEMPERATURE MECHANICAL BEHAVIOR OF LEAD FREE
SURVIVABILITY OF LEADFREE SOLDERS IN HIGH TEMPERA- SOLDERS
TURE VIBRATION IN AUTOMOTIVE ENVIRONMENTS Technical Presentation. IPACK2017-74253
Technical Paper Publication. IPACK2017-74233 Mohammad Alam, Jeffrey Suhling, Pradeep Lall, Auburn University,
Auburn, AL, United States
Pradeep Lall, Vikas Yadav, Di Zhang, Jeffrey Suhling, Auburn University,
Auburn, AL, United States ADVANCEMENTS IN SILVER WIRE BONDING
Technical Paper Publication. IPACK2017-74286
EFFECT OF CORNER STAKING ON THE FATIGUE LIFE OF BGA
UNDER THERMAL CYCLING Subramani Manoharan, Patrick McCluskey, Chandradip Patel, University
Technical Paper Publication. IPACK2017-74249 of Maryland, College Park, MD, United States
Deng Yun Chen, Michael Osterman, The Center for Advanced Life Cycle INTERFACIAL DELAMINATION AND FRACTURE PROPERTIES
Engineering, College Park, MD, United States OF POTTING COMPOUNDS AND EPOXY INTERFACES UNDER
HIGH STRAIN RATE LOADING AFTER EXPOSURE TO HIGH
Effects of Fatigue Cycling on the Microstructure of SAC305 TEMPERATURE STORAGE
Lead Free Solder
Technical Presentation. IPACK2017-74263 Technical Paper Publication. IPACK2017-74322
Nianjun Fu, Md Mahmudur R. Chowdhury, Jeffrey Suhling, Sa’d Pradeep Lall, Kalyan Dornala, Jeffrey Suhling, Auburn University, Auburn
Hamasha, Pradeep Lall, Auburn University, Auburn, AL, United States University, AL, United States, John Deep, Air Force Research Laboratory,
Eglin, FL, United States
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