Page 41 - ASME InterPACK 2017 Program
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WEDNESDAY, AUGUST 30 Technical Sessions
TRACK 2 SERVERS OF THE FUTURE TWO-PHASE MINI-THERMOSYPHON FOR COOLING OF
DATACENTERS: EXPERIMENTS, MODELING AND SIMULA-
Track Chair: Reza Khiabani, Google, Mountain View, CA, United States TIONS
Technical Paper Publication. IPACK2017-74030
Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Yogendra Joshi, Georgia Inst Of Tech, Atlanta, GA, United States, Ryan Chin Lee Ong, Raffaele Luca Amalfi, Jackson Braz Marcinichen, Nicolas
Enright, Bell Labs Ireland, Dublin, Ireland Lamaison, John Richard Thome, Ecole Polytechnique Federale de
Lausanne, Lausanne, Switzerland
2-1
DATA CENTERS AND ENERGY EFFICIENT HPC CONCEPTS TRACK 3 STRUCTURAL AND PHYSICAL HEALTH
MONITORING
2-1-1 7:30am – 9:00am
DATA CENTER COOLING Track Chair: Hendrik Hamann, IBM, Yorktown Heights, NY, United States
Second Floor, Mason II
Track Co-Chairs: Li Sun, Intel, Phoenix, AZ, United States, E. Yegan
Session Chair: Pablo Hidalgo, Aavid Thermacore, Lancaster, PA, United Erdem, Bilkent University, Ankara, Cankaya, Turkey, Benjamin Leever, Air
Force Research Laboratory, Wright-Patterson AFB, OH, United States
States, Sruti Chigullapalli, Intel, Phoenix, AZ, United States
3-2
THERMAL MIXING OF AMBIENT AIR AND RETURN AIR MECHANICAL RELIABILITY ISSUES IN FLEXIBLE AND
STREAMS IN A MIXING CHAMBER FOR DATA CENTER PRINTED ELECTRONICS
COOLING
Technical Presentation. IPACK2017-74207
Pavan Kaulgud, Ashwin Siddarth, Jaykishankumar Patel, Dereje 3-2-1
Agonafer, University of Texas Arlington, Arlington, TX, United States,
Abhishek Guhe, Mestex, Dallas, TX, United States MECHANICAL RELIABILITY ISSUES IN FLEXIBLE AND PRINTED
DESIGN ANALYSIS AND PERFORMANCE EVALUATION OF A ELECTRONICS
DATA CENTER WITH INDIRECT EVAPORATIVE COOLING
Technical Paper Publication. IPACK2017-74295 Second Floor, Sansome 7:30am – 9:00am
Fatemeh Tavakkoli, Baidu USA, Sunnyvale, CA, United States, Siavash Session Chair: Steven Klein, Intel Corp, Chandler, AZ, United States
Ebrahimi, Yan Cui, Xiaogang Sun, Ali Heydari, Baidu, Sunnyvale, CA,
United States Session Co-Chair: Valerie Marty, Connected Micro LLC, Corvallis, OR,
United States
TRANSIENT THERMAL PERFORMANCE OF REAR DOOR HEAT
EXCHANGER WITH LOCAL CONTAINED COLD AISLE DURING MECHANICAL RELIABILITY OF PECVD SINX BARRIER FILMS
WATER SIDE FAILURES FOR FLEXIBLE ELECTRONICS
Technical Paper Publication. IPACK2017-74148 Technical Presentation. IPACK2017-74146
Kourosh Nemati, Future Facilities, San Jose, CA, United States, Husam A. Kyungjin Kim, Hao Luo, Olivier Pierron, Ting Zhu, Samuel Graham,
Alissa, Microsoft, Redmond, WA, United States, Mohammad Tradat, Georgia Institute of Technology, Atlanta, GA, United States
Bahgat Sammakia, SUNY Binghamton, Binghamton, NY, United States
DESIGN AND DEVELOPMENT OF BIOMETRIC SENSOR
ROLE OF A LIQUID ACCUMULATOR IN A PASSIVE TWO-PHASE WEARABLE BAND USING FLEXIBLE ELECTRONICS
LIQUID COOLING SYSTEM FOR ELECTRONICS: EXPERIMEN- Technical Paper Publication. IPACK2017-74232
TAL ANALYSIS
Technical Paper Publication. IPACK2017-74020 Pradeep Lall, Hao Zhang, Auburn University, Auburn, AL, United States,
Rahul Lall, Stanford University, Stanford, CA, United States
Nicolas Lamaison, Raffaele Luca Amalfi, Jackson Braz Marcinichen,
John Richard Thome, Ecole Polytechnic Federale de Lausanne, Laus- RELIABILITY OF SAC 305 SOLDER INTERCONNECTS ON
anne, Switzerland, Todd Salamon, Nokia Bell Labs, Murray Hill, NJ, United DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD USING
States X-RAY MICRO-CT
Technical Paper Publication. IPACK2017-74264
Pradeep Lall, Kartik Goyal, Auburn University, Auburn, AL, United States
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