Page 45 - ASME InterPACK 2017 Program
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WEDNESDAY, AUGUST 30 Technical Sessions
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- INVESTIGATION OF AGING INDUCED EVOLUTION OF THE
SYSTEMS WITH DIVERSE FUNCTIONALITY MICROSTRUCTURE OF SAC305 LEAD FREE SOLDER
Technical Paper Publication. IPACK2017-74266
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States
Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey Suhling, Pradeep Lall,
Track Co-Chairs: Winston Zhang, Novark Technology Inc., Shenzhen, Auburn University, Auburn, AL, United States
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
TX, United States MEASUREMENT OF ELEVATED TEMPERATURE MECHANICAL
PROPERTIES OF INTERMETALLIC COMPOUNDS IN SAC
1-5 SOLDER JOINTS
ADVANCED PACKAGING, INTERCONNECTS AND Technical Presentation. IPACK2017-74270
SUBSTRATE TECHNOLOGIES
Abdullah Fahim, Sudan Ahmed, Jeffrey Suhling, Pradeep Lall, Auburn
1-5-1 University, Auburn, AL, United States
ADVANCES IN PACKAGING, INTERCONNECTS AND SUBSTRATE
TECHNOLOGIES - I TRACK 2 SERVERS OF THE FUTURE
Second Floor, Mason I 11:00am – 12:30pm
Session Chair: Tse Wong, Raytheon Company, Los Alamitos, CA, United Track Chair: Reza Khiabani, Google, Mountain View, CA, United States
States
Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Session Co-Chair: Edward Jih, Ford Motor Co, Dearborn, MI, United States Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United
States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland
INVESTIGATION OF PEELING BEHAVIOR OF UV CURABLE
PRESSURE SENSITIVE ADHESIVE FOR BUMP-WAFER 2-1
Technical Paper Publication. IPACK2017-74010 DATA CENTERS AND ENERGY EFFICIENT HPC CONCEPTS
Naoya Saiki, Yuichiro Komasu, Jun Maeda, Kazuto Aizawa, Lintec 2-1-2 11:00am – 12:30pm
Corporation, Saitama, Japan SERVER COOLING 1
Second Floor, Mason II
COMPARISON OF BENDING STRENGTHS OF SI INTERPOSERS
DETERMINED BY POEF AND LOEF TESTS ASSOCIATED WITH Session Chair: Shlomo Novotny, Novotny, Wayland, MA, United States
ACOUSTIC EMISSION METHOD
Technical Presentation. IPACK2017-74012 Session Co-Chair: Betsegaw Gebrehiwot, Intel, Phoenix, AZ, United
States, Jeremy Rice, JR Thermal, Austin, TX, United States
Ming-Yi Tsai, Chang Gung University, Kwei-shan, Taiwan, C. Y. Huang,
Siliconware Precision Industries Co., Taichung, Taiwan CHARACTERIZATION OF AN ISOLATED HYBRID COOLED
SERVER WITH FAILURE SCENARIOS USING WARM WATER
LARGE FLIP CHIP ASSEMBLY CHALLENGES AND RISK MITIGA- COOLING
TION PROCESS
Technical Paper Publication. IPACK2017-74026 Technical Paper Publication. IPACK2017-74028
Nokibul Islam, StatsChipPAC Co., Tempe, AZ, United States, Jeremy Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer,
Plunkett, Suresh Subramaniam, Applied Micro Corporation, Santa Clara, University of Texas at Arlington, Arlington, TX, United States, Steve
CA, United States, Kang Keontaek, Gu Seonmo, StatsChipPAC Co., Inc., Branton, Data Center Solution at Asetek, San José, CA, United States
Incheon, Korea (Republic), Eric Ouyang, StatsChipPAC Co., Inc., Fremont,
CA, United States IMPROVEMENT IN SERVER COMPUTE PERFORMANCE USING
ADVANCED AIR COOLED THERMAL SOLUTIONS
METALLURGICAL ANALYSES OF PIN-TO-FLEX CIRCUIT Technical Paper Publication. IPACK2017-74055
SOLDER JOINTS
Technical Presentation. IPACK2017-74436 Devdatta Kulkarni, Sandeep Ahuja, Sanjoy Saha, Intel, Hillsboro, OR,
United States
Donald Susan, Jerome Norris, Alice Kilgo, Shelley Williams, Lisa
Lowery, Sandia National Laboratories, Albuquerque, NM, United States COOLING FAILURE IN DIRECT LIQUID COOLING SYSTEM
(DLCS)
Technical Paper Publication. IPACK2017-74174
Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia,
Binghamton University, Binghamton, NY, United States
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