Page 50 - ASME InterPACK 2017 Program
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Technical Sessions WEDNESDAY, AUGUST 30
Institute (JASRI), Sayo-cho Hyogo, Japan, Junya Ooi, Toyama Prefectural Session Co-Chair: Andy Seo, ASE US INC, SUNNYVALE, CA, United
University, Imizu-Shi, Toyama, Japan, Takao Mori, Toyama Prefectural States, E. Yegan Erdem, Bilkent University, Ankara, Cankaya, Turkey
University, Imizu-Shi Toyama, Japan
RF ENERGY HARVESTING PEEL-AND-STICK SENSORS
COULD A SECOND LEVEL SOLDER JOINT INTERCONNECTION Technical Paper Publication. IPACK2017-74150
BE DESIGNED IN SUCH A WAY THAT THE INELASTIC STRAINS
IN IT ARE AVOIDED? Christopher Lalau Keraly, George Daniel, Joseph Lee, David Schwartz,
Technical Presentation. IPACK2017-74183 PARC, Palo Alto, CA, United States
Ephraim Suhir, ERS Co. and Portland State University, Los Altos, CA, A ROBUST LOW-COST PARTICULATE SENSING SYSTEM
United States Technical Presentation. IPACK2017-74225
RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA Ramachandran Muralidhar, Ted van Kessel, Hendrik Hamann, Michael
PACKAGE - MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT Schappert, IBM, Yorktown Heights, NY, United States
BOARDS
Technical Presentation. IPACK2017-74265 EDGE COMPUTING AND CONTEXTUAL INFORMATION FOR
THE INTERNET OF THINGS SENSORS
Mugdha Chaudhari, Unique Rahangdale, Pavan Rajmane, Abel Misrak, Technical Paper Publication. IPACK2017-74304
Aniruddha Doiphode, Dereje Agonafer, University of Texas At Arlington,
Arlington, TX, United States, Jeff Forbus, NetVia Group, LLC, Irving, TX, Lavanya Turlapati, Nigel Hinds, IBM, Yorktown Heights, NY, United
United States States, Dhruv Nair, Levente Klein, IBM TJ Watson Research Center,
Yorktown Heights, NY, United States
A COMPUTATIONAL APPROACH TO STUDY THE IMPACT OF
PCB THICKNESS ON QFN ASSEMBLY UNDER DROP TESTING POINT OF CARE MICRO BIOCHIP FOR HEALTH CARE MONI-
WITH PACKAGE POWER SUPPLY TORING
Technical Paper Publication. IPACK2017-74278 Technical Presentation. IPACK2017-74298
Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer, Bharath Babu Nunna, New Jersey Institute of Technology, Randolph, NJ,
University of Texas at Arlington, Arlington, TX, United States United States, Shiqiang Zhuang, NJIT, Harrison, NJ, United States, Eon
Soo Lee, New Jersey Institute of Technology (NJIT), Newark, NJ, United
RELIABILITY ANALYSIS OF ULTRA-LOW-K LARGE-DIE States
PACKAGE & WIRE BOND CHIP PACKAGE ON VARYING
STRUCTURAL PARAMETER UNDER THERMAL LOADING PIEZORESISTIVE SILICON STRESS SENSOR AS A TOOL TO
Technical Paper Publication. IPACK2017-74279 MONITOR HEALTH OF AN ELECTRONIC SYSTEM
Technical Paper Publication. IPACK2017-74058
Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer,
University of Texas at Arlington, Arlington, TX, United States Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Robert
Bosch GmbH, Reutlingen, Germany, Bongtae Han, University Of Mary-
TRACK 3 STRUCTURAL AND PHYSICAL HEALTH land, College Park, MD, United States, Dirk Mayer, Tobias Melz, Fraun-
MONITORING hofer LBF, Darmstadt, Germany
Track Chair: Hendrik Hamann, IBM, Yorktown Heights, NY, United States TRACK 10 WORKSHOPS
Track Co-Chairs: Li Sun, Intel, Phoenix, AZ, United States, E. Yegan 1 0 -3
Erdem, Bilkent University, Ankara, Cankaya, Turkey, Benjamin Leever, Air GRADUATE STUDENT CAREER PATH WORKSHOP
Force Research Laboratory, Wright-Patterson AFB, OH, United States
3-3 1 0 -3 -1
NOVEL SENSORS AND PACKAGING FOR STRUCTURAL
AND HEALTH MONITORING GRADUATE STUDENT CAREER PATH WORKSHOP
Fourth Floor, Columbus I-III 4:15pm – 5:45pm
3-3-2 Session Chair: Amy Marconnet, Purdue University, West Lafayette, IN,
United States
NOVEL SENSORS AND PACKAGING FOR HEALTH MONITORING
Second Floor, Mason II 4:15pm – 5:45pm
Session Chair: Levente Klein, IBM TJ Watson Research Center, Yorktown
Heights, NY, United States
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