Page 46 - ASME InterPACK 2017 Program
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Technical Sessions WEDNESDAY, AUGUST 30
AN ADVANCED ENERGY EFFICIENT RACK SERVER DESIGN THERMAL CHARACTERIZATION OF GaN BASED VERTICAL
WITH DISTRIBUTED BATTERY SUBSYSTEM POWER ELECTRONIC DEVICES
Technical Paper Publication. IPACK2017-74033 Technical Presentation. IPACK2017-74153
Jun Zhang, Intel, Shanghai, China, Nishi Ahuja, Intel, Phoenix, AZ, United James Dallas, Bikramjit Chatterjee, James Spencer Lundh, Sukwon
States, Chun Wang, Baidu, Beijing, China, Xiaoguang Sun, Baidu Online Choi, Pennsylvania State University, University Park, PA, United States,
Network Technology (Beijing) Co., Ltd, Beijing, China Mi-Hee Ji, Theeradetch Detchprohm, Russell Dupuis, Shyh-Chiang
Shen, Georgia Institute of Technology, Atlanta, GA, United States, Jeomoh
NIYANTRON - AN APPROACH TO DEVELOP A CONTROL Kim, LG Electronics, Seoul, Korea (Republic), Tsung-Ting Kao, Intel,
SYSTEM APP FOR DATA CENTER COOLING Atlanta, GA, United States
Technical Presentation. IPACK2017-74019
ELECTRO-THERMAL ANALYSIS OF GA2O3 BASED UL-
Anay Darekar, Varun Rahul, Rajesh Kasukurthy, Dereje Agonafer, Sohil TRA-WIDE BANDGAP SCHOTTKY BARRIER DIODES
Shah, University of Texas at Arlington, Arlington, TX, United States Technical Presentation. IPACK2017-74128
TRACK 4 ENERGY CONVERSION & STORAGE Bikramjit Chatterjee, James Spencer Lundh, James Dallas, Sukwon
Choi, Pennsylvania State University, University Park, PA, United States,
Track Chair: Sreekant Narumanchi, National Renewable Energy Labora- Asanka Jayawardena, Sarit Dhar, Auburn University, Auburn, AL, United
tory, Golden, CO, United States States
Track Co-Chairs: Lauren M. Boteler, U.S. Army Research Laboratory, TRACK 5 TRANSPORTATION: AUTONOMOUS &
Adelphi, MD, United States, Patrick McCluskey, University of Maryland, ELECTRIC VEHICLES
College Park, College Park, MD, United States, Martin Kuball, HH Wills
Physics Laboratory, Bristol, United Kingdom Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
States
4-1
POWER ELECTRONICS WIDE BAND GAP Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,
SEMICONDUCTORS, PACKAGING, MODULE ASSEMBLY Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
AND THERMAL MANAGEMENT Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL,
United States
4-1-1
5-5
WIDE-BANDGAP DEVICES AND PACKAGING - I DEVICE TO SYSTEM LEVEL RELIABILITY
Second Floor, Sansome 11:00am – 12:30pm
Session Chair: Hannes Greve, University of Maryland, Hyattsville, MD, 5-5-2
United States DEVICE, SYSTEM RELIABILITY - II
Second Floor, Columbus I
Session Co-Chair: Marc Dunham, Analog Devices, San Jose, CA, United 11:00am – 12:30pm
States
Session Chair: Bongtae Han, University of Maryland, College Park, MD,
CHARACTERIZATION OF NOVEL MATERIALS FOR THIN United States
FLEXIBLE POWER SUBSTRATES FOR HIGH-DENSITY POWER
ELECTRONICS Session Co-Chair: Karumbu Meyyappan, Intel Corp, Portland, OR, United
States
Keynote Presentation. IPACK2017-74381
Douglas Hopkins, NC State University, Raleigh, NC, United States BGA TEMPERATURE CYCLING RELIABILITY IN AUTOMOTIVE
APPLICATIONS: KNOWLEDGE BASED QUALIFICATION
3D WIRE BONDLESS INTEGRATION - THE FUTURE OF SIC Technical Presentation. IPACK2017-74194
PACKAGING
Technical Paper Publication. IPACK2017-74213 Ru Han, Intel, Chandler, AZ, United States, Min Pei, Intel, Hillsboro, OR,
United States, Sibasish Mukherjee, Intel Corporation, Chandler, AZ,
Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth, United States, Milena Vujosevic, Intel Corporation, San Jose, CA, United
University of Arkansas, Fayetteville, AR, United States States
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