Page 51 - ASME InterPACK 2017 Program
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WEDNESDAY, AUGUST 30 – THURSDAY, AUGUST 31 Technical Sessions
PROF. RONALD WARZOHA – UNITED STATES NAVAL ELECTRONIC CHIP MICROASSEMBLY PRINTER
ACADEMY Technical Presentation. IPACK2017-74357
Keynote Presentation. IPACK2017-74444
Eugene Chow, PARC, Palo Alto, CA, United States
Ronald Warzoha, United States Naval Academy, Annapolis, MD, United
States ACCELERATING DEVELOPMENT OF PCBS BY 3D PRINTING
CIRCUITS
DR. PATRICIA E. GHARAGOZLOO - SANDIA NATIONAL LABO- Technical Presentation. IPACK2017-74358
RATORIES
Keynote Presentation. IPACK2017-74445 Simon Fried, Nano Dimension Ltd., Ness Ziona, Israel
Patricia Gharagozloo, Sandia National Laboratories, Oakland, CA, United PRINTED METALLIZATION FOR CONSUMER ELECTRONIC
States APPLICATIONS
Technical Presentation. IPACK2017-74382
PROF. ANKUR JAIN - UNIVERSITY OF TEXAS AT ARLINGTON
Keynote Presentation. IPACK2017-74447 Ken-Hsuan (Kirby) Liao, Jeffery Dee, Homer Antoniadis, DuPont,
Sunnyvale, CA, United States
Ankur Jain, University of Texas at Arlington, Arlington, TX, United States
TRACK 3 STRUCTURAL AND PHYSICAL HEALTH THURSDAY, AUGUST 31
MONITORING
TRACK 2 SERVERS OF THE FUTURE
Track Chair: Hendrik Hamann, IBM, Yorktown Heights, NY, United States Track Chair: Reza Khiabani, Google, Mountain View, CA, United States
Track Co-Chairs: Li Sun, Intel, Phoenix, AZ, United States, E. Yegan Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Erdem, Bilkent University, Ankara, Cankaya, Turkey, Benjamin Leever, Air Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United
Force Research Laboratory, Wright-Patterson AFB, OH, United States States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland
3-4 2-1
PRINTABLE ELECTRONICS AND INTERCONNECTS DATA CENTERS AND ENERGY EFFICIENT HPC CONCEPTS
3-4-1
PRINTABLE ELECTRONICS AND INTERCONNECTS 2-1-4
Second Floor, Sansome 4:15pm – 6:00pm SERVER: COOLING & HIGH-BANDWIDTH/EFFICIENT
Session Chair: Hongbin Yu, Arizona State University, Tempe, AZ, United INTERCONNECTS
States
Second Floor, Mason I 7:30am – 9:00am
Session Chair: Ryan Enright, Nokia Bell Labs, Dublin, Ireland
Session Co-Chair: Janos Veres, Parc, Palo Alto, CA, United States Session Co-Chair: Terence Graham, Ciena, Ottawa, ON, Canada
PRINTED ELECTRONICS FOR AEROSPACE APPLICATIONS CONCURRENT DWDM SILICON PHOTONIC INTERCONNECT
Technical Presentation. IPACK2017-74311 DRIVEN BY A QUANTUM DOT COMB LASER
Technical Paper Publication. IPACK2017-74337
Benjamin Leever, Michael F. Durstock, Benji Maruyama, John D.
Berrigan, Christoper E. Tabor, Air Force Research Laboratory, Wright-Pat- Ashkan Seyedi, Marco Fiorentino, Raymond Beausoleil, Hewlett
terson AFB, OH, United States Packard Enterprise, Palo Alto, CA, United States
INKJET PRINTING OF ELECTROCHROMIC FILMS ON FLEXIBLE THERMO-MECHANICAL STUDY OF ALN THIN FILMS AS HEAT
AND STRETCHABLE SUBSTRATE FOR WEARABLE ELECTRON- SPREADERS IN III-V PHOTONIC DEVICES
ICS APPLICATIONS Technical Paper Publication. IPACK2017-74184
Technical Presentation. IPACK2017-74320
Shenghui Lei, Nokia Bell Labs, Dublin, Ireland, Ertugrul Kardemir, David
Ebraheem Azhar, Hongbin Yu, Arizona State University, Tempe, AZ, McCloskey, John F. Donegan, Trinity College Dublin, Dublin, Ireland,
United States Ryan Enright, Bell Labs Ireland, Dublin, Ireland
INTEGRATED CIRCUITS POST-MOORE’S LAW SCALING 51
Technical Presentation. IPACK2017-74352
Jayna Sheats, Terecircuits Corporation, Palo Alto, CA, United States
