Page 56 - ASME InterPACK 2017 Program
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Technical Sessions THURSDAY, AUGUST 31
4-1-2 9-5-1
WIDE-BANDGAP DEVICES AND PACKAGING - II NEXT-GENERATION AUTOMOTIVE ELECTRONICS: RELIABILITY
Second Floor, Mason II 11:00am – 12:30pm CHALLENGES
Session Chair: Dinesh Thanu, Intel Corporation, Chandler, AZ, United Second Floor, Jackson 11:00am – 12:30pm
States
Session Chair: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,
Germany
Session Co-Chair: Chirag Kharangate, Stanford, Stanford, CA, United Session Co-Chair: Pradeep Lall, Auburn University, Auburn, AL, United
States States, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States
CURRENT AND FUTURE DIRECTIONS IN POWER ELECTRONIC
DEVICES AND CIRCUITS BASED ON WIDE-BANDGAP SEMI- Technical Presentation. IPACK2017-74395
CONDUCTORS
Sven Rzepka, Fraunhofer ENAS, Chemnitz, Germany
Keynote Presentation. IPACK2017-74373
Isik Kizilyalli, Advanced Research Projects Agency - Energy, Washington, Technical Presentation. IPACK2017-74396
D.C., DC, United States
THERMAL CHARACTERIZATION AND MODELING OF AN Bongtae Han, University of Maryland, College Park, MD, United States
ULTRA-WIDE BANDGAP ALGAN CHANNEL HIGH ELECTRON
MOBILITY TRANSISTOR Technical Presentation. IPACK2017-74397
Technical Presentation. IPACK2017-74110 Shalabh Tandon, Intel Corporation, Chandler, AZ, United States
James Spencer Lundh, Bikramjit Chatterjee, James Dallas, Sukwon Technical Presentation. IPACK2017-74398
Choi, Pennsylvania State University, University Park, PA, United States Matt Romig, Texas Instruments, Dallas, TX, United States
Albert Baca, Robert Kaplar, Andrew Armstrong, Andrew Allerman, Technical Presentation. IPACK2017-74400
Sandia National Laboratories, Albuquerque, NM, United States Mohak Shah, Robert Bosch LLC, Palo Alto, CA, United States
Technical Presentation. IPACK2017-74401
POWER PACKAGING THERMAL AND STRESS MODEL FOR Azeem Sarwar, General Motors, Warren, MI, United States
QUICK PARAMETRIC ANALYSES Technical Presentation. IPACK2017-74414
Technical Paper Publication. IPACK2017-74130
Steven Miner, United States Naval Academy, Annapolis, MD, United
States, Lauren M. Boteler, U.S. Army Research Laboratory, Adelphi, MD,
United States
THERMAL DESIGN OPTIMIZATION OF NOVEL ‘CONTACT’ Yoshikazu Takahashi, Fuji Electric Co., Ltd, Japan
STRUCTURE FOR HEAT REMOVAL IN SEMICONDUCTOR
POWER AMPLIFIERS (PAS) TRACK 7 KEYNOTES
Technical Presentation. IPACK2017-74171
Sumeer Khanna, Patrick McCluskey, University of Maryland, College 7-6
Park, College Park, MD, United States PLENARY LUNCHEON TALKS
TRACK 9 PANELS 7- 6 -2 12:30pm – 2:00pm
INTERPACK ACHIEVEMENT AWARD
9-5 Third Floor, Grand Ballroom
TRACK 5 - PANEL
Session Chair: Ravi Mahajan, Intel Corporation, Chandler, AZ, United
States
Session Co-Chair: Sandeep Tonapi, Anveshak Technology and Knowl-
edge Solutions, Pune, Maharashtra, India
METAMATERIALS FOR THERMAL MANAGEMENT
Keynote Presentation. IPACK2017-74454
Kenneth Goodson, Stanford University, Stanford, CA, United States
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