Page 57 - ASME InterPACK 2017 Program
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THURSDAY, AUGUST 31 Technical Sessions
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- 1-7-2
SYSTEMS WITH DIVERSE FUNCTIONALITY
THERMAL MANAGEMENT FOR HETEROGENEOUS INTEGRATION
- II
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States Second Floor, Montgomery 2:15pm – 3:45pm
Track Co-Chair: Winston Zhang, Novark Technology Inc., Shenzhen, Session Chair: Hemanth Dhavaleswarapu, Intel, Chandler, AZ, United
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington, States
TX, United States
Session Co-Chair: Sidy Ndao, UNL, UNL, NE, United States
1-6
2.5D/3D INTEGRATION PERFORMANCE CHARACTERIZATION OF AN INNOVATIVE
MICRO-SCALE ELECTROHYDRODYNAMIC CONDUCTION
1-6-1 PUMPING DEVICE
2.5D/3D INTEGRATION
Second Floor, Washington Technical Paper Publication. IPACK2017-74107
2:15pm – 3:45pm Michal Talmor, Worcester Polytechnic Institute, Worcester, MA, United
States, Jamal Yagoobi, WPI-ME Department, Worcester, MA, United States
Session Chair: Hoa Do, Xilinx, Sunnyvale, CA, United States
MOLECULARLY-TAILORED NANOMATERIALS AND INTERFAC- ADVANCED COOLING OF 3D ICS WITH NANOPARTICLE
ES FOR NEXT GENERATION DEVICE METALLIZATION AND PACKINGS
PACKAGING Technical Paper Publication. IPACK2017-74137
Technical Presentation. IPACK2017-74218 Anil Yuksel, Paul Ho, University of Texas at Austin, Austin, TX, United
States, Jayathi Murthy, UCLA, Los Angeles, CA, United States
Ganpati Ramanath, Rensselaer Polytechnic Institute, Troy, NY, United
States MICRON SCALE SPATIAL RESOLUTION OF THE THERMAL
CONDUCTIVITY ACROSS GRAIN BOUNDARIES OF BULK
EMBEDDED 3D RF PACKAGE WITH SUPERIOR COOLING AND DIAMOND USING TIME-DOMAIN THERMOREFLECTANCE
LOAD CARRYING MECHANISMS
Technical Presentation. IPACK2017-74002 Technical Presentation. IPACK2017-74175
Tse Wong, Raytheon Company, Los Alamitos, CA, United States Ramez Cheaito, Aditya Sood, Mehdi Asheghi, Kenneth Goodson,
Stanford University, Stanford, CA, United States, Mark Goorsky, University
NUMERICAL AND EXPERIMENTAL DETERMINATION OF of California, Los Angeles, Los Angeles, CA, United States
TEMPERATURE DISTRIBUTION IN 3D STACKED POWER
DEVICES THERMAL CONDUCTIVITY MEASUREMENTS OF NON-METALS
VIA COMBINED TIME- AND FREQUENCY-DOMAIN THER-
Technical Paper Publication. IPACK2017-74222 MOREFLECTANCE WITHOUT A METAL FILM TRANSDUCER
Adam Morgan, Douglas Hopkins, North Carolina State University, Technical Presentation. IPACK2017-74310
Raleigh, NC, United States, Leila Choobineh, David Fresne, SUNY
Polytechnic Institute, Utica, NY, United States Patrick Hopkins, Lei Wang, Ramez Cheaito, Ashutosh Giri, Jeffrey
Braun, University of Virginia, Charlottesville, VA, United States
PRELIMINARY RESULTS ON THE FABRICATION OF INTERCON- TRACK 2 SERVERS OF THE FUTURE
NECT STRUCTURES USING MICROSCALE SELECTIVE LASER
SINTERING Track Chair: Reza Khiabani, Google, Mountain View, CA, United States
Technical Paper Publication. IPACK2017-74173 Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United
Nilabh Kumar Roy, Obehi Dibua, Michael A Cullinan, University of Texas States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland
at Austin, Austin, TX, United States, Chee S Foong, NXP Semiconductors,
Austin, TX, United States 2-2
MODELING AND SIMULATION
1-7
THERMAL MANAGEMENT FOR HETEROGENEOUS
INTEGRATION
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