Page 61 - ASME InterPACK 2017 Program
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THURSDAY, AUGUST 31 Technical Sessions
5-7 TRACK 6 POSTERS
SIMULATION AND TEST METHODS
5-7-2 4:15pm – 6:00pm Track Chair: Banafsheh Barabadi, MIT, Cambridge, MA, United States
SIMULATION AND TEST METHODS, SESSION 2
Second Floor, Mason I Track Co-Chairs: Joshua Gess, Oregon State University, Corvallis, OR,
United States, Jin Yang, Intel Corporation, Hillsboro, OR, United States
Session Chair: Sven Rzepka, Fraunhofer ENAS, Chemnitz, Germany
6-1
Session Co-Chair: Ilko Schmadlak, NXP Semiconductors Germany GmbH, ACADEMIC POSTER SESSION
Munich, Germany
6-1-1
DEVELOPMENT OF MULTI-CHIP POWER PACKAGE SUPPORT- STUDENT POSTER SESSION/COMPETITION 6:00pm – 8:30pm
ED BY SIMULATION DRIVEN DESIGN Third Floor, Grand Ballroom
Technical Presentation. IPACK2017-74200
Session Chair: Jaeho Lee, University of California, Irvine, Irvine, CA, United
Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen, Germany States
METHODS FOR THEORETICAL ASSESSMENT OF DELAMINA- ADVANCED COOLING OF 3D ICS WITH NANOPARTICLE
TION RISKS IN ELECTRONIC PACKAGING PACKINGS
Technical Paper Publication. IPACK2017-74073 Poster Presentation. IPACK2017-74424
Torsten Hauck, Ilko Schmadlak, NXP Semiconductors Germany GmbH, Anil Yuksel, Paul Ho, University of Texas at Austin, Austin, TX, United
Munich, Germany, Sandeep Shantaram, Nishant Lakhera, NXP Semicon- States, Jayathi Murthy, UCLA, Los Angeles, CA, United States
ductor, Austin, TX, United States, Suresh Sitaraman, Georgia Institute of
Technology, Atlanta, GA, United States David Samet, V. N. N. Trilochan ELECTRO-THERMAL ANALYSIS OF GA2O3 BASED UL-
Rambhatla, Georgia Institute of Technology, Atlanta, GA, United States TRA-WIDE BANDGAP SCHOTTKY BARRIER DIODES
Poster Presentation. IPACK2017-74426
MODELING THERMO-MECHANICALLY DRIVEN FRACTURE Bikramjit Chatterjee, James Spencer Lundh, James Dallas, Sukwon
PROCESSES IN BULK MOLD MATERIAL OF ELECTRO ME- Choi, Pennsylvania State University, University Park, PA, United States
CHANICAL COMPONENTS Asanka Jayawardena, Sarit Dhar, Auburn University, Auburn, AL, United
States
Technical Presentation. IPACK2017-74104
Fabian Welschinger, Przemyslaw Gromala, Robert Bosch Gmbh, THERMAL CHARACTERIZATION AND MODELING OF AN
Reutlingen, Germany ULTRA-WIDE BANDGAP ALGAN CHANNEL HIGH ELECTRON
MOBILITY TRANSISTOR
THREE-DIMENSIONAL FLOW AND HEAT TRANSFER SIMULA-
TION OF A MEMS-BASED THERMAL ACCELEROMETER Poster Presentation. IPACK2017-74427
Technical Presentation. IPACK2017-74056
James Spencer Lundh, Bikramjit Chatterjee, James Dallas, Sukwon
Heungdong Kwon, Mehdi Asheghi, Thomas Kenny, Kenneth Goodson, Choi, Pennsylvania State University, University Park, PA, United States,
Stanford University, Stanford, CA, United States Albert Baca, Robert Kaplar, Andrew Armstrong, Andrew Allerman,
Sandia National Laboratories, Albuquerque, NM, United States
INTEGRATED TEMPERATURE MAPPING OF GALLIUM NITRIDE MESHED PHOTONIC CRYSTALS FOR MANIPULATING NEAR-
MICRO-LED ARRAYS FIELD THERMAL RADIATION ACROSS VARIABLE NANO/
Technical Presentation. IPACK2017-74156 MICRO GAP
Bikramjit Chatterjee, James Spencer Lundh, James Dallas, Sukwon Poster Presentation. IPACK2017-74429
Choi, Pennsylvania State University, University Park, PA, United States,
Tae Kyoung Kim, Moon Uk Cho, Joon Seop Kwak, Sunchon National Mahmoud Elzouka, Sidy Ndao, University of Nebraska-Lincoln, Lincoln,
University, Suncheon, Korea (Republic) NE, United States
CRACK DETECTION IN FLEXIBLE CABLES USING TIME-DO- GEOMETRY EFFECTS ON TWO-PHASE FLOW REGIMES IN A
MAIN REFLECTOMETRY DIABATIC MANIFOLDED MICROGAP CHANNEL
Technical Presentation. IPACK2017-74047 Poster Presentation. IPACK2017-74437
Dae-Suk Kim, University of Maryland, College Park, MD, United States, David Deisenroth, Avram Bar-Cohen, Michael Ohadi, University of
Bongtae Han, Univ Of Maryland, College Park, MD, United States Maryland, College Park, MD, United States
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