Page 63 - ASME InterPACK 2017 Program

THURSDAY, AUGUST 31 Technical Sessions

EXPERIMENTAL CHARACTERIZATION AND CONSTITUTIVE PRELOAD EFFECT OF ULTRASONIC WIRE BONDING TRANS-
MODELING OF UNDERFILL MATERIALS EXPOSED TO DIFFER- DUCERS WITH IMPEDANCE ANALYSIS USING BUTTER-
ENT MOISTURE CONDITIONS WORTH-VAN DYKE CIRCUIT MODEL AND FINITE ELEMENT
Poster Presentation. IPACK2017-74234 METHOD
Poster Presentation. IPACK2017-74206
Promod Chowdhury, Jeffrey Suhling, Pradeep Lall, Auburn University,
Auburn, AL, United States Jae Woong Jang, University of Seoul, Seoul, Korea (Republic), Gihong Ha,
Samsung Electronics, Asan, Korea (Republic), Soo Il Lee, University of
FINITE ELEMENT MODELING CREATION FROM X-RAY MI- Seoul, Seoul, Korea (Republic)
CRO-CT DATA FOR FUZE ASSEMBLIES
Poster Presentation. IPACK2017-74271 EFFECTS OF TEST TEMPERATURE AND PRIOR AGING CONDI-
TIONS ON THE CREEP PROPERTIES OF SAC305 SOLDER
Pradeep Lall, Nakul Kothari, Auburn University, Auburn, AL, United States, JOINTS
John Deep, Air Force Research Laboratory, Eglin, FL, United States Poster Presentation. IPACK2017-74228

THE EFFECTS OF AGING ON THE CYCLIC STRESS-STRAIN Sudan Ahmed, Jeffrey Suhling, Pradeep Lall, Auburn University, Auburn,
BEHAVIOR AND HYSTERESIS LOOP EVOLUTION OF SAC+X AL, United States
SOLDER MATERIALS
Poster Presentation. IPACK2017-74231 EFFECT OF ENVIRONMENT ON CARBON NANOTUBE THIN
FILM TRANSISTORS BASED GAS SENSORS
Md Mahmudur R. Chowdhury, Nianjun Fu, Sudan Ahmed, Auburn Poster Presentation. IPACK2017-74049
University, Auburn, AL, United States, Jeffrey Suhling, Auburn University,
Auburn University, AL, United States, Pradeep Lall, Auburn University, Jialuo Chen, Peter Hesketh, Satish Kumar, Georgia Institute of Technolo-
Auburn, AL, United States gy, Atlanta, GA, United States

A STUDY ON LOW CYCLE FATIGUE TEST WITH HOURGLASS CHARACTERIZATION OF IMCS IN SN-AG-CU SOLDER JOINTS
TEST PIECE FOR LEAD-FREE SOLDER MATERIAL USING NANOINDENTATION
Poster Presentation. IPACK2017-74094 Poster Presentation. IPACK2017-74237

Yuki Murai, Yu Kitada, Tasuku Kousaka, Takashi Kawakami, Takahiro Abdullah Fahim, Sudan Ahmed, Jeffrey Suhling, Pradeep Lall, Auburn
Kinoshita, Toyama Prefectural University, Imizu, Japan University, Auburn, AL, United States

PLANAR STRAIN MAPPING OF BALL GRID ARRAY INTERCON- FAILURE MECHANISMS OF MEMS GYROSCOPES SUBJECTED
NECTS USING AU THIN FILM DIFFRACTION GRATINGS TO OPERATION UNDER SIMULTANEOUS TEMPERATURE AND
Poster Presentation. IPACK2017-74161 VIBRATION
Poster Presentation. IPACK2017-74250
Todd Houghton, Hongbin Yu, Arizona State University, Tempe, AZ, United
States Pradeep Lall, Amrit Abrol, Jeffrey Suhling, Auburn University, Auburn,
AL, United States, David Locker, US Army RDECOM, Huntsville, AL, United
RELIABILITY OF SAC SOLDERS UNDER COMBINED TEMPERA- States
TURE-VIBRATION AUTOMOTIVE ENVIRONMENTS
Poster Presentation. IPACK2017-74274 QUANTITATIVE ANALYSIS OF AGING INDUCED EVOLUTION
OF IMCS IN SAC305 LEAD FREE SOLDER
Pradeep Lall, Vikas Yadav, Di Zhang, Tony Thomas, Auburn University, Poster Presentation. IPACK2017-74241
Auburn, AL, United States, Jeffrey Suhling, Auburn University, Auburn
University, AL, United States Jing Wu, Nianjun Fu, Jeffrey Suhling, Pradeep Lall, Auburn University,
Auburn, AL, United States
EFFECT OF SURFACE FINISH OF CU ELECTRODE ON CHAR-
ACTERISTICS OF HIGH MELTING POINT JOINT USING SN- THERMAL PERFORMANCE EVALUATION AND DESIGN
57BI-1AG OPTIMIZATION OF FULL GEOMETRIES OF MANIFOLD MICRO-
Poster Presentation. IPACK2017-74036 CHANNEL HEAT SINKS
Poster Presentation. IPACK2017-74091
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Gunma Universi-
ty, Kiryu, Gunma, Japan Daeyoung Kong, Hyoungsoon Lee, Chung-Ang University, Seoul, Korea
(Republic)

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