Page 66 - ASME InterPACK 2017 Program
P. 66
Technical Sessions THURSDAY, AUGUST 31 – FRIDAY, SEPTEMBER 01
MICRO-PACKAGING PLATFORM FOR HERMETIC, WIRELESS, FRIDAY, SEPTEMBER 01
IMPLANTABLE NEURAL RECORDING SYSTEMS
Poster Presentation. IPACK2017-74375 TRACK 2 SERVERS OF THE FUTURE
Xiaoxiao Hou, Brown University, Providence RI, United States, Craig P. Track Chair: Reza Khiabani, Google, Mountain View, CA, United States
Galligan, Jason Benyeda, Eric Davis, Nancy Stoffel, GE Global Research
Center, Niskayuna, NY, United States, David Rosler, Center for Neurores- Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
toration and Neurotechnology, RR&D Service, VA Medical Center, Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United
Providence, RI, United States, Kaustubh Nagarkar, Jeffrey M. Ashe, GE States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland
Global Research Center, Niskayuna, NY, United States, David A. Borton,
Brown University, the Brown Institute for Brain Science (BIBS), Providence 2-3
Veterans Affairs Center, Providence, RI, United States THERMAL MANAGEMENT AND ADVANCED HEAT
SPREADING CONCEPTS FOR 2D, 2.5D, AND 3D
PERFORMANCE AND OPERATIONAL RELIABILITY OF FLEXI- ARCHITECTURES
BLE POWER SOURCES IN FOLDABLE WEARABLE ELECTRON-
ICS UNDER STRESSES OF DAILY MOTION 2-3-1 7:30am – 9:00am
Poster Presentation. IPACK2017-74255 EMBEDDED PACKAGE COOLING
Second Floor, Jackson
Pradeep Lall, Hao Zhang, Auburn University, Auburn, AL, United States,
Rahul Lall, Stanford University, Stanford, CA, United States Session Chair: Jungwan Cho, Kyunghee University, Yongin, Gyeonggi-do,
Korea (Republic)
6-2
INDUSTRY POSTER EXHIBITION Session Co-Chair: Gisuk Hwang, Wichita State University, Wichita, KS,
6-2-1 6:00pm – 8:30pm United States
INDUSTRY POSTER EXHIBITION
Third Floor, Grand Ballroom FLOW DISTRIBUTION AND NUCLEATION SUPPRESSION IN A
SMALL FORM FACTOR LIQUID IMMERSION COOLED SERVER
Session Chair: Jin Yang, Intel Corporation, Hillsboro, OR, United States MODEL
Technical Paper Publication. IPACK2017-74025
Session Co-Chair: Yoonjin Won, University of California, Irvine, Irvine, CA,
United States Sriram Chandrasekaran, Sushil Bhavnani, Auburn University, Auburn, AL,
United States
MECHANICAL TESTING FOR STRETCHABLE ELECTRONICS
Poster Presentation. IPACK2017-74185 DUAL-SIDE HEAT REMOVAL BY MICRO-CHANNEL COLD
PLATE AND SILICON-INTERPOSER WITH EMBEDDED FLUID
Steven Klein, Intel Corp, Chandler, AZ, United States, Aleksandar CHANNELS
Aleksov, Vijay Subramanian, Pramod Malatkar, Ravi Mahajan, Intel Technical Presentation. IPACK2017-74122
Corporation, Chandler, AZ, United States
POL-KW MODULES FOR HIGH POWER APPLICATIONS Gerd Schlottig, IBM Research, Zurich, Rueschlikon, Switzerland, Wolfram
Poster Presentation. IPACK2017-74428 Steller, Fraunhofer IZM-ASSID, Moritzburg, Germany, Hermann Op-
permann, Jessica Kleff, Fraunhofer IZM, Berlin, Germany, Raúl Mroßko,
Kaustubh Nagarkar, Christopher Kapusta, GE Global Research Center, Jürgen Keller, AMIC Angewandte Micro-Messtechnik GmbH, Berlin,
Niskayuna, NY, United States, Risto Tuominen, GE, Niskayuna, NY, United Germany, Douglas Bremner, Optocap Ltd, Livingston, United Kingdom,
States, Shingo Hayashibe, Hitoshi Ito, Tadashi Arai, SHINKO Electric Özgür Özsun, Swiss Federal Institute of Technology in Zurich (ETHZ),
Industries Co. Ltd., Nagano-shi, Nagano, Japan Zurich, Switzerland, Thomas Brunschwiler, IBM Zurich Research Labora-
tory - Advanced Thermal Packaging, Rueschlikon, Switzerland
INTEGRATED MICRO-THERMOELECTRIC COOLING FOR EFFECT OF BONDING STRUCTURE AND HEATER DESIGN ON
SILICON PHOTONICS: MODELING AND FABRICATION BY PERFORMANCE ENHANCEMENT OF FEEDS EMBEDDED
TEMPLATE-ASSISTED ELECTROCHEMICAL DEPOSITION MANIFOLD-MICROCHANNEL COOLING
Poster Presentation. IPACK2017-74217 Technical Paper Publication. IPACK2017-74158
Javier García Fernández, David A. L. Ramos, Melanie Mohn, Heike Daniel Bae, University of Maryland College Park, College Park, MD,
Schlorb, Nicolas P. Rodriguez, Kornelius Nielsch, Gabi Schierning, United States, Raphael Mandel, University of Maryland, College Park,
Heiko Reith, Leibniz Institute for Solid State and Materials Research College Park, MD, United States, Michael Ohadi, University of Maryland,
Dresden, Dresden, Germany, Shenghui Lei, Graeme Cunningham, Ronan College Park, MD, United States
Frizzell, Nokia Bell Labs, Dublin, Ireland, Lewis Akinsinde, Institute of
66 Nanostructure and Sokid State Physics, University of Hamburg, Hamburg,
Germany, Alexandre Shen, Nokia Bell Labs, Marcoussis, France, Ryan
Enright, Bell Labs Ireland, Dublin, Ireland
