Page 70 - ASME InterPACK 2017 Program
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Technical Sessions FRIDAY, SEPTEMBER 01
TEMPERATURE-DEPENDENT THERMOELECTRIC PROPERTIES
OF ALGAN/GAN FILMS GROWN ON INVERTED PYRAMID SI
STRUCTURES
Technical Presentation. IPACK2017-74318
Ananth Saran Yalamarthy, Hongyun So, Stanford University, Stanford,
CA, United States, Debbie Senesky, Stanford University, Berkeley, CA,
United States
THERMOELECTRIC CLOTHES DRYER DEVELOPMENT AND
PERFORMANCE EVALUATION
Technical Paper Publication. IPACK2017-74243
Viral Patel, ORNL, Oak Ridge, TN, United States, Kyle Gluesenkamp, Oak
Ridge National Laboratory, Oak Ridge, TN, United States
TRANSIENT AND STEADY STATE THERMAL RESPONSE OF A
SYSTEM WITH THERMOELECTRIC COOLERS
Technical Paper Publication. IPACK2017-74015
Kayvan Abbasi, Sukhvinder Kang, Aavid Thermalloy, Laconia, NH, United
States
TRACK 9 PANELS
9-1
TRACK 1 - PANEL
9-1-1
3D PACKAGING: KEY DRIVERS, OPPORTUNITIES AND
CHALLENGES
Second Floor, Mason I & II 11:00am – 12:30pm
Session Chair: Bill Bottoms, 3MTS, Palo Alto, CA, United States
Session Co-Chair: Kaushik Mysore, AMD, Austin, TX, United States
Keynote Presentation. IPACK2017-74439
Eric Beyne, IMEC, Leuven, Belgium
Keynote Presentation. IPACK2017-74440
Rama Alapati, Amkor Technology, San Jose, CA, United States
Keynote Presentation. IPACK2017-74448
Gamal Refai-Ahmed, Xilinx, USA, CA, United States
Keynote Presentation. IPACK2017-74452
Javier DeLaCruz, Xperi, San Francisco, CA, United States
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