Page 71 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Abbasi Kayvan 4-3-2 IPACK2017-74015
Abdelaziz Omar 4-4-2 Transient and Steady State Thermal Response of a System with Thermoelectric IPACK2017-74244
Abrol Amrit 1-1-1 Coolers IPACK2017-74252
Abrol Amrit 6-1-1 IPACK2017-74250
Abuklam Ahmed 6-1-1 Optimization of Graphite Composite Latent Heat Storage Systems IPACK2017-74327
adachi Tadaharu 1-3-3 IPACK2017-74099
Adstedt Katarina 3-3-1 Effects of Sustained Exposure to Temperature and Humidity on the Reliability and IPACK2017-74143
Agonafer Dereje 1-3-2 Performance of MEMS microphone IPACK2017-74265
Agonafer Dereje 1-3-2 IPACK2017-74278
Agonafer Dereje 1-3-2 Failure Mechanisms of MEMS Gyroscopes Subjected to Operation Under IPACK2017-74279
Agonafer Dereje 2-1-1 Simultaneous Temperature and Vibration IPACK2017-74207
Agonafer Dereje 2-1-2 IPACK2017-74028
Agonafer Dereje 2-1-2 Enhancing Direct / Indirect Evaporative Heat Exchanger in Data Center Cooling in IPACK2017-74019
Agonafer Dereje 2-1-3 Harsh Climates by using a compression refrigeration cycle IPACK2017-74254
Agonafer Dereje 2-1-3 IPACK2017-74331
Agonafer Dereje 2-1-3 Stress-Based Design Standard for 3216 Type of Multilayer Ceramic Capacitor IPACK2017-74288
Agonafer Dereje 2-1-4 IPACK2017-74260
Agonafer Dereje 2-2-2 ALD Barrier Films for Protecting Electronics in Harsh Environments IPACK2017-74016
Agonafer Dereje 6-1-1 IPACK2017-74370
Agonafer Dereje 6-1-1 Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4 IPACK2017-74425
Agonafer Dereje 6-1-1 Printed Circuit Boards IPACK2017-74430
Agonafer Dereje 6-1-1 IPACK2017-74431
Agonafer Dereje 6-1-1 A Computational Approach to Study the Impact of PCB Thickness on QFN IPACK2017-74432
Agonafer Dereje 6-1-1 Assembly Under Drop Testing with Package Power Supply IPACK2017-74327
Agonafer Dereje 6-1-1 IPACK2017-74433
Agonafer Dereje 6-1-1 Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package IPACK2017-74434
Ahmed Sudan 1-2-1 on Varying Structural Parameter Under Thermal Loading IPACK2017-74121
Ahmed Sudan 1-5-1 IPACK2017-74266
Ahmed Sudan 1-5-1 Thermal Mixing of Ambient Air and Return Air Streams in a Mixing Chamber for IPACK2017-74270
Ahmed Sudan 6-1-1 Data Center Cooling IPACK2017-74231

Characterization of an Isolated Hybrid Cooled Server with Failure Scenarios Using 71
Warm Water Cooling

NiyanTron - An Approach to Develop a Control System App for Data Center
Cooling

CFD Optimization of the Cooling of Yosemite Open Compute Server

CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn-
ing “BIG SUR” Server

Impact of Static Pressure Differential between Supply Air and Return Exhaust on
Server Level Performance

Rack-Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With
Variable Pumping For Centralized Coolant System

Performance Evaluation of Three Types of Novel End-Of-Aisle Cooling Systems

CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn-
ing “BIG SUR” Server

A Computational Approach to Study the Impact of PCB Thickness on QFN
Assembly Under Drop Testing with Package Power Supply

Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards

Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With
Variable Pumping For Centralized Coolant System

Experimental and Computational Study of Multi-Level Cooling Systems at High
Ambient Coolant Temperatures

Enhancing Direct / Indirect Evaporative Heat Exchanger in Data Center Cooling in
Harsh Climates by using a compression refrigeration cycle

CFD Optimization of the Cooling of Yosemite Open Compute Server

Impact of Static Pressure Differential Between Supply Air and Return Exhaust on
Server Level Performance

Effects of Aging on the Microstructural Evolution of Lead Free SACN05 and
Doped SAC Alloys

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead
Free Solder

Measurement of Elevated Temperature Mechanical Properties of Intermetallic
Compounds in SAC Solder Joints

The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop
Evolution of SAC+X Solder Materials