Page 76 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Cheng Zhe 6-1-1 IPACK2017-74167
Chiarot Paul R. 2-3-1 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74180
Cho Eunho 2-2-1 for use in Power Electronics IPACK2017-74088

Experimental Characterization of Cold Plates used in Cooling Multi Chip Server
Modules (MCM)

Comprehensive Modeling of Single Bubble Evaporation in Microchannel

Cho Junghyun 4-2-1 High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Tempera- IPACK2017-74169

ture Electronics

Cho Moon Uk 4-1-4 Thermal Management of Large Periphery Gallium Nitride Power Electronics Using IPACK2017-74155

3-D Multi-Metallization Structures

Cho Moon Uk 5-7-2 Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays IPACK2017-74156

Choi Sukwon 4-1-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74153

Choi Sukwon 4-1-1 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74128
Choi Sukwon 4-1-2 Diodes IPACK2017-74110
Choi Sukwon 4-1-4 IPACK2017-74155
Choi Sukwon 5-4-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74149
High Electron Mobility Transistor

Thermal Management of Large Periphery Gallium Nitride Power Electronics Using
3-D Multi-Metallization Structures

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Choi Sukwon 5-7-2 Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays IPACK2017-74156

Choi Sukwon 6-1-1 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74426
Choi Sukwon 6-1-1 Diodes IPACK2017-74427
Choobineh Leila 1-6-1 IPACK2017-74222
Chow Eugene 3-4-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74357
High Electron Mobility Transistor

Numerical and Experimental Determination of Temperature Distribution in 3d
Stacked Power Devices

Electronic Chip MicroAssembly Printer

Chowdhury Md 1-3-1 Effects of Fatigue Cycling on the Microstructure of SAC305 Lead Free Solder IPACK2017-74263
Chowdhury Mahmudur R. 6-1-1 IPACK2017-74231
Chowdhury 1-2-1 The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop IPACK2017-74261
Md Evolution of SAC+X Solder Materials
Mahmudur R. Mechanical Characterization of Solder Mask at Different Temperatures

Promod

Chowdhury Promod 6-1-1 Experimental Characterization and Constitutive Modeling of Underfill Materials IPACK2017-74234
Uschas 2-1-2 Exposed To Different Moisture Conditions IPACK2017-74028
Chowdhury Deborah 4-3-2 IPACK2017-74248
Jane 6-1-1 Characterization of an Isolated Hybrid Cooled Server with Failure Scenarios Using IPACK2017-74120
Clayton- Yan 2-1-1 Warm Water Cooling IPACK2017-74295
Warwick Michael A 1-6-1 IPACK2017-74173
Cornett Graeme 6-2-1 Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics IPACK2017-74217
Matthew 4-3-2 IPACK2017-74248
Cui CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher-
moelectric Generator (µTEG) Devices
Cullinan
Design Analysis and Performance Evaluation of a Data Center with Indirect
Cunning- Evaporative Cooling
ham
Dabney Preliminary Results on the Fabrication of Interconnect Structures Using Microscale
Selective Laser Sintering

Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition

Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

Dallas James 4-1-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74153

Dallas James 4-1-1 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74128
James 4-1-2 Diodes IPACK2017-74110
Dallas
76 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
High Electron Mobility Transistor