Page 77 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Dallas James 4-1-4 IPACK2017-74155
Dallas James 5-4-1 Thermal Management of Large Periphery Gallium Nitride Power Electronics Using IPACK2017-74149
Dallas James 5-7-2 3-D Multi-Metallization Structures IPACK2017-74156
Dallas James 6-1-1 Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes IPACK2017-74426
Dallas James 6-1-1 IPACK2017-74427
Dameron Arrelaine 4-3-1 Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays IPACK2017-74296
Dames Chris 5-4-1 IPACK2017-74305
Daniel Claus 4-4-2 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74197
Daniel George 3-3-2 Diodes IPACK2017-74150
Darekar Anay 2-1-2 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74019
Das Siddhartha 1-4-1 High Electron Mobility Transistor IPACK2017-74220
Dasgupta Abhijit 1-4-1 Quantifying Water Vapor Transmission Rates through Barriers and Edge Seals for IPACK2017-74210
Dasgupta Abhijit 1-4-1 Photovoltaic and Other Demanding Applications IPACK2017-74220
Dasgupta Abhijit 1-5-2 Regulating Battery Temperature Using a Passive Thermal Switch Based on Shape IPACK2017-74133
Davis Eric 6-1-1 Memory Alloys IPACK2017-74375
Davis Lynn 6-1-1 Pushing the Envelope on Batteries: New Advanced Cathode Materials and their IPACK2017-74259
Dawson Bruce 2-2-2 Problems IPACK2017-74105
Dawson-Elli Neal 4-4-2 RF Energy Harvesting Peel-and-Stick Sensors IPACK2017-74078
Dede Ercan M. 4-1-4 IPACK2017-74008
Dede Ercan M. 4-3-1 NiyanTron - An Approach to Develop a Control System App for Data Center IPACK2017-74112
Dede Ercan M. 6-1-1 Cooling IPACK2017-74009
3D Printing of Compliant BGA Pads
Dee Jeffery 3-4-1 IPACK2017-74382
Deep John 3-3-1 Aerosol-Jet Printed Fillets for Well-Formed Electrical connections Between IPACK2017-74269
Deep John 5-2-1 Different Leveled Surfaces IPACK2017-74322
3D Printing of Compliant BGA Pads
Deep John 6-1-1 IPACK2017-74271
Deep John 6-1-1 Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders going to Pose a IPACK2017-74323
Deisenroth David 2-3-1 Challenge for Heterogeneous Integration? IPACK2017-74287
Deisenroth David 6-1-1 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74437
DeLaCruz Javier 9-1-1 Systems IPACK2017-74452
Analysis of Color Shift and Life-Modeling of High Power Warm White pc-LED
Operating in High Temperature-Humidity
Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi-
ronment
Minimizing Capacity Fade through Optimal Model-based Control - Theory and
Experimental Validation
Thermofluidic Characterization of An ?Embedded Microchannel-3D manifold?
Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application
Thermal Metamaterials for Heat Flow Control in Electronics

Overcoming Challenges in Microfabrication of Si and SiC-based ?Embedded
Microchannel-3D manifold? Cooling Module for High Heat Flux (1 kW/cm2) Power
Electronics Application

Printed Metallization for Consumer Electronic Applications

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock
using X-ray Digital Volume Correlation
Interfacial Delamination and Fracture Properties of Potting Compounds and Epoxy
Interfaces under High Strain Rate Loading after Exposure to High Temperature
Storage

Finite Element Modeling Creation from X-ray Micro-CT Data for Fuze Assemblies

Methods for Survivability Assurance of Fine Pitch Electronics subjected to
Mechanical Shock up to 25,000g
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap
Channel
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap
Channel
3D Packaging: Key Drivers, Opportunities and Challenges

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