Page 73 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Asheghi Mehdi 1-7-2 IPACK2017-74175
Asheghi Mehdi 2-2-1 Micron Scale Spatial Resolution of the Thermal Conductivity across Grain IPACK2017-74088
Asheghi Mehdi 2-2-2 Boundaries of Bulk Diamond Using Time-Domain Thermoreflectance IPACK2017-74188
Asheghi Mehdi 2-3-2 Comprehensive Modeling of Single Bubble Evaporation in Microchannel IPACK2017-74014
Asheghi Mehdi 4-1-3 IPACK2017-74163
Asheghi Mehdi 4-1-4 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74008
Asheghi Mehdi 5-7-2 Cooling Systems IPACK2017-74056
Asheghi Mehdi 6-1-1 Experimental Study of Single/Two-Phase Heat Transfer For 3D-Chip Embedded IPACK2017-74009
Cooling with Micro-Pin-Fin Arrays
Asheghi Mehdi 6-1-1 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74050
Asheghi Mehdi 6-1-1 use in Electronics Thermal Management IPACK2017-74089
Asheghi Mehdi 6-1-1 Thermofluidic Characterization of an "Embedded Microchannel-3D manifold" IPACK2017-74120
Asheghi Mehdi 6-1-1 Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application IPACK2017-74167
Asheghi Mehdi 6-1-1 Three-dimensional Flow and Heat Transfer Simulation of a MEMS-based Thermal IPACK2017-74189
Athavale Jayati 2-1-4 Accelerometer IPACK2017-74108
Azhar Ebraheem 3-4-1 Overcoming Challenges in Microfabrication of Si and SiC-based "Embedded IPACK2017-74320
Baca Albert 4-1-2 Microchannel-3D manifold" Cooling Module for High Heat Flux (1 kW/cm2) Power IPACK2017-74110
Baca Albert 6-1-1 Electronics Application IPACK2017-74427
Back Doosan 1-7-3 IPACK2017-74360
Bae Daniel 2-3-1 Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel IPACK2017-74158
Bahk Je-Hyeong 1-7-3 Junction Characterized by Picosecond Time-domain Thermoreflectance IPACK2017-74360
Bahk Je-Hyeong 6-1-1 Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces IPACK2017-74361
Barako Michael T. 1-2-1 IPACK2017-74090
Barako Michael T. 6-1-1 CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher- IPACK2017-74089
Bar-Cohen Avram 2-3-1 moelectric Generator (µTEG) Devices IPACK2017-74287
Bar-Cohen Avram 6-1-1 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74437
Bar-Cohen Avram 8-5-2 for use in Power Electronics IPACK2017-74386
Bar-Cohen Avram 9-4-1 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74379
Barnes Teresa 4-3-2 Cooling Systems IPACK2017-74248
Basit Munshi 5-7-1 Experimentally Validated Computational Fluid Dynamics Model for Data Center IPACK2017-74272
with Active Tiles
Inkjet Printing of Electrochromic Films On Flexible and Stretchable Substrate for
Wearable Electronics Applications
Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
High Electron Mobility Transistor
Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
High Electron Mobility Transistor
Quasi ballistic thermal transport in InGaAs alloy

Effect of Bonding Structure and Heater Design on Performance Enhancement of
FEEDS Embedded Manifold-Microchannel Cooling
Quasi Ballistic Thermal Transport in InGaAs Alloy

Sub-diffraction Thermoreflectance Imaging of Nanoscale Metal interconnects

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap
Channel
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap
Channel
Wireless Power Beaming - History, Applications, and Challenges

Thermal Management of WBG Devices - Challenges and Options

Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

The Poisson's Ratio of Lead Free Solder and its Effect on Solder Joint Reliability

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