Page 75 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Campbell Joe 1-7-1 IPACK2017-74309
Courtenay 9-6-1 Thermal Boundary Resistance-limited Performance of High-frequency Photodi- IPACK2017-74420
Carr Heuer Sriram 2-3-1 odes IPACK2017-74025
Sriram 6-1-1 IPACK2017-74340
Chandrase- Fu-Kuo 9-3-1 Women in STEM Education IPACK2017-74412
karan Bikramjit 4-1-1 IPACK2017-74153
Chandrase- Bikramjit 4-1-1 Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid IPACK2017-74128
karan Bikramjit 4-1-2 Immersion Cooled Server Model IPACK2017-74110
Chang Bikramjit 4-1-4 IPACK2017-74155
Bikramjit 5-7-2 Liquid Immersion Cooling: A Smarter Path to Data Center Thermal Management IPACK2017-74156
Chatterjee Bikramjit 6-1-1 IPACK2017-74426
Bikramjit 6-1-1 Computational Modeling of Multi-functional Structures IPACK2017-74427
Chatterjee MUGDHA 1-3-2 IPACK2017-74265
MUGDHA 6-1-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74430
Chatterjee Ramez 1-7-1 IPACK2017-74309
Ramez 1-7-2 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74175
Chatterjee Ramez 1-7-2 Diodes IPACK2017-74310
Ramez 4-1-3 IPACK2017-74163
Chatterjee Ramez 6-1-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74050
Ramez 6-1-1 High Electron Mobility Transistor IPACK2017-74167
Chatterjee Baoxing 6-1-1 IPACK2017-74120
Chienchih 5-7-1 Thermal Management of Large Periphery Gallium Nitride Power Electronics Using IPACK2017-74258
Chatterjee Chienchih 6-1-1 3-D Multi-Metallization Structures IPACK2017-74230
Deng Yun 1-3-1 IPACK2017-74249
CHAUD- Jialuo 3-3-1 Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays IPACK2017-74069
HARI Jialuo 6-1-1 IPACK2017-74049
CHAUD- Jun 5-7-1 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74312
HARI Jun 6-1-1 Diodes IPACK2017-74313
Cheaito Yanhua 1-1-1 IPACK2017-74195
Zhe 4-1-3 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74163
Cheaito High Electron Mobility Transistor

Cheaito Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards
Cheaito
Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Cheaito Printed Circuit Boards

Cheaito Thermal Boundary Resistance-limited Performance of High-frequency Photodi-
odes
Chen
Micron Scale Spatial Resolution of the Thermal Conductivity across Grain
Chen Boundaries of Bulk Diamond Using Time-Domain Thermoreflectance

Chen Thermal Conductivity Measurements of Non-metals via Combined Time- and
Frequency-domain Thermoreflectance without a Metal Film Transducer
Chen
Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for
Chen use in Electronics Thermal Management

Chen Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel
Junction Characterized by Picosecond Time-domain Thermoreflectance
Chen
Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond
Chen for use in Power Electronics

Cheng CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher-
moelectric Generator (µTEG) Devices
Cheng
Improved Finite Element Simulation Strategy with Submodeling for BGA Packages
Subjected to Thermal Cycling 7755

Improved Finite Element Modeling Strategies for BGA Packages Subjected to
Thermal Cycling

Effect of Corner Staking on the Fatigue Life of BGA under Thermal Cycling

Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas
Sensors

Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas
Sensors

Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to
Various Moisture Conditions

Moisture Induced Stresses in PBGA Packages

Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape
Phosphor Layer

Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for
use in Electronics Thermal Management