Page 78 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Demir Hilmi Volkan 3-2-1 Silica Nanoparticle Formation by Using Droplet-Based Microreactor IPACK2017-74178

Deshpande Abhishek 1-5-2 Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders going to Pose a IPACK2017-74133
Deshpande Shantanu 5-2-1 Challenge for Heterogeneous Integration? IPACK2017-74325
Detchprohm Theeradetch 4-1-1 IPACK2017-74153
Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics under
Operation at High Voltage and High Temperature

Thermal Characterization of GaN based Vertical Power Electronic Devices

DeVoto Douglas 4-2-1 Thermomechanical Modeling and Material Characterization of Sintered Silver IPACK2017-74214

DeVoto Douglas 5-5-2 Continuous Lifetime Estimation of Vehicle Power Electronics IPACK2017-74215

Dhadve Mangesh M. 2-1-3 CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn- IPACK2017-74331
Dhadve Mangesh M. 6-1-1 ing “BIG SUR” Server IPACK2017-74370
Dhar Sarit 4-1-1 IPACK2017-74128
Dhar Sarit 6-1-1 CFD Simulation and Optimization of the Cooling of Open Compute Machine Learn- IPACK2017-74426
Dibua Obehi 1-6-1 ing “BIG SUR” Server IPACK2017-74173
Do Hoa 1-1-1 IPACK2017-74262
DOIPHODE ANIRUDDHA 1-3-2 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74265
DOIPHODE ANIRUDDHA 6-1-1 Diodes IPACK2017-74430
Donegan John F. 2-1-4 IPACK2017-74184
Donmezer F. Nazli 4-1-3 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74125
Akgun Kalyan 5-2-1 Diodes IPACK2017-74322
Dornala
Preliminary results on the fabrication of interconnect structures using microscale IPACK2017-74323
Dornala Kalyan 6-1-1 selective laser sintering IPACK2017-74315
Dowling Karen 6-1-1 IPACK2017-74208
Dudek Rainer 5-7-1 Extending the Performance of High Heat Flux 2.5D and 3D Packaging from IPACK2017-74120
Dunham Marc 6-1-1 Component - System Interaction. IPACK2017-74153
Dupuis Russell 4-1-1
Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards

Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards

Thermo-Mechanical Study of AlN Thin Films as Heat Spreaders in III-V Photonic
Devices

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs with SiO2
Passivation

Interfacial Delamination and Fracture Properties of Potting Compounds and Epoxy
Interfaces under High Strain Rate Loading after Exposure to High Temperature
Storage

Methods for Survivability Assurance of Fine Pitch Electronics subjected to
Mechanical Shock up to 25,000g

Rapid Prototyping of High-temperature Multi-functional AlGaN/GaN Sensors using
Laser Ablation and Direct Wire Bonding

Application Driven Reliability Research of Next Generation for Automotive
Electronics: Challenges and Approaches

CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher-
moelectric Generator (µTEG) Devices

Thermal Characterization of GaN based Vertical Power Electronic Devices

Durstock Michael F. 3-4-1 Printed Electronics for Aerospace Applications IPACK2017-74311

Dutta Indranath 1-2-1 Effect of Interfacial Incompatibility on Copper Pumping and Reliability of 3D IPACK2017-74308
Ebrahimi Siavash 2-1-1 Electronic Devices IPACK2017-74295
Eiland Richard 2-1-3 IPACK2017-74288
Eiland Richard 6-1-1 Design Analysis and Performance Evaluation of a Data Center with Indirect IPACK2017-74434
El-Wardany Tahany 1-4-1 Evaporative Cooling IPACK2017-74306

Impact of Static Pressure Differential between Supply Air and Return Exhaust on
Server Level Performance

Impact of Static Pressure Differential Between Supply Air and Return Exhaust on
Server Level Performance

Challenges in 3D Printing of High Conductivity Copper

Elzouka Mahmoud 4-3-1 Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across IPACK2017-74212
Variable Nano/Micro Gap

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