Page 83 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Hesketh Peter 6-1-1 IPACK2017-74049
Hessney Peter 3-4-1 Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas IPACK2017-74359
Heydari Ali 2-1-1 Sensors IPACK2017-74295
Heydari Ali 8-2-1 Advanced Manufacturing Systems for Flexible Hybrid Electronics IPACK2017-74364
Higuchi Kazunari 6-1-1 IPACK2017-74038
Hill Charles 5-5-1 Design Analysis and Performance Evaluation of a Data Center with Indirect IPACK2017-74190
Hinds Nigel 3-3-2 Evaporative Cooling IPACK2017-74304
Ho Paul 1-7-2 Driving Innovations in Hyperscale AI-Enabled Data Centers IPACK2017-74137
Ho Paul 6-1-1 IPACK2017-74424
Hobt Alexander 5-7-1 Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene IPACK2017-74416
Glycol with Rust Inhibitor
Hokazono Hiroaki 6-1-1 Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in IPACK2017-74032
Hopkins Douglas 1-6-1 Electronic Components IPACK2017-74222
Hopkins Douglas 4-1-1 Edge computing and contextual information for the Internet of Things sensors IPACK2017-74381
Hopkins Douglas 9-4-1 IPACK2017-74380
Hopkins Patrick 1-7-1 Advanced Cooling of 3D ICs with Nanoparticle Packings IPACK2017-74309
Hopkins Patrick 1-7-2 IPACK2017-74310
Hopkins Patrick 8-1-1 Advanced Cooling of 3D ICS with Nanoparticle Packings IPACK2017-74390
Hose Clayton 4-1-5 IPACK2017-74132
Hoshino Masato 1-3-2 Towards Improvement of Lifetime Prediction of Solder Joints under Field IPACK2017-74177
Hou Xiaoxiao 6-1-1 Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic IPACK2017-74375
Houghton Todd 6-1-1 BGA-Geometry IPACK2017-74161
Hu Anming 1-5-2 IPACK2017-74111
Hu Jinyan 1-7-1 Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its IPACK2017-74196
Huang C. Y. 1-5-1 Degradation Mechanism under Aging IPACK2017-74012
Huitink David 5-5-1 Numerical and Experimental Determination of Temperature Distribution in 3D IPACK2017-74245
Huitink David 6-1-1 Stacked Power Devices IPACK2017-74240
Ibitayo Dimeji 4-4-1 Characterization of Novel Materials for Thin Flexible Power Substrates for IPACK2017-74118
Ibitayo Dimeji 4-1-5 High-Density Power Electronics IPACK2017-74132
Ibitayo Dimeji 6-1-1 True 3D Power Packaging - Higher Densities Through Orthogonality IPACK2017-74419

Thermal Boundary Resistance-limited Performance of High-Frequency Photodi-
odes
Thermal Conductivity Measurements of Non-metals Via Combined Time- and
Frequency-Domain Thermoreflectance without a Metal Film Transducer
Interfacial imperfection effects on thermal boundary resistance in electronic mate-
rials and devices
Integrated Vapor Chamber Heat Spreader for Power Module Applications

In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue
Cracks at Die-attached Joints under Cyclic Energization Loading
Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording
Systems
Planar Strain Mapping of Ball Grid Array Interconnects Using Au Thin Film
Diffraction Gratings
A Molecular Dynamics Study of Geometrical and Temperature Effects on Sintering
of Two Cu-Ag Core-Shell Nanoparticles
Optimization of Filling Mass Fraction for Composite PCMs Based Thermal
Management System
Comparison of Bending Strengths of Si Interposers Determined by PoEF and LoEF
Tests Associated with Acoustic Emission Method
Thermomechanical Reliability Challenges & Goals and Design for Reliability
Methodologies for EV Systems
Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based
Interconnects
Voiding Effects on the Thermal Response of Metallic Phase Change Materials
Under Pulsed Power Loading
Integrated Vapor Chamber Heat Spreader for Power Module Applications

Voiding Effects on the Thermal Response of Metallic Phase Change Materials
Under Pulsed Power Loading

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