Page 86 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Kharangate Chirag 2-3-2 IPACK2017-74014
Kharangate Chirag 4-1-4 Experimental Study of Single/Two-Phase Heat Transfer For 3D-Chip Embedded IPACK2017-74008
Kharangate Chirag 6-1-1 Cooling with Micro-Pin-Fin Arrays IPACK2017-74009

Kharangate Chirag 6-1-1 Thermofluidic Characterization of An "Embedded Microchannel-3D manifold" IPACK2017-74189
Khattar Mukesh 9-2-1 Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application IPACK2017-74404

Overcoming Challenges in Microfabrication of Si and SiC-based ?Embedded
Microchannel-3D manifold? Cooling Module for High Heat Flux (1 kW/cm2) Power
Electronics Application

CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air
Cooling Systems

Track 2 - Panel

Kikuchi Hiroki 1-4-1 Analysis for Evaluation of Threshold Current Density of Electromigration Damage IPACK2017-74059
Kilgo Alice 1-5-1 in Taper-shaped Metal Line IPACK2017-74436

Metallurgical Analyses of Pin-to-Flex Circuit Solder Joints

Kim Dae-Suk 5-7-2 Crack Detection in Flexible Cables Using Time-Domain Reflectometry IPACK2017-74047

Kim Hyun Gon 4-1-4 Performance Enhancement of a Heat Pipe for Power Electronics Cooling with Aa IPACK2017-74095

Partially Applied Hybrid Wick

Kim Jeomoh 4-1-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74153

Kim Kyungjin 3-2-1 Mechanical Reliability of PECVD SiNx Barrier Films for Flexible Electronics IPACK2017-74146

Kim Sung Jin 1-7-1 Experimental Investigation of Artificial Cavities on the Thermal Performance of a IPACK2017-74007

Pulsating Heat Pipe

Kim Sung Jin 1-7-1 Pressure Drop and Heat Transfer Characteristics of Wavy Plate Fins for the IPACK2017-74057

Low-Reynolds Number flow

Kim Tae Kyoung 4-1-4 Thermal Management of Large Periphery Gallium Nitride Power Electronics Using IPACK2017-74155

3-D Multi-Metallization Structures

Kim Tae Kyoung 5-7-2 Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays IPACK2017-74156

Kim Wookyoung 1-7-1 Experimental Investigation of Artificial Cavities on the Thermal Performance of a IPACK2017-74007
King Liu Tsu-Jae 9-6-1 Pulsating Heat Pipe IPACK2017-74443

Women in STEM Education Panel (Tsu-Jae King Liu)

Kini Rahul 6-1-1 CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher- IPACK2017-74120
Kinoshita Takahiro 1-3-3 moelectric Generator (µTEG) Devices IPACK2017-74099

Stress-based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

Kinoshita Takahiro 6-1-1 A Study on Low Cycle Fatigue Test with Hourglass Test Piece for Lead-Free Solder IPACK2017-74094
Kitada Yu 6-1-1 Material IPACK2017-74094
Kizilyalli Isik 4-1-2 IPACK2017-74373
Kizilyalli Isik 9-4-1 A Study on Low Cycle Fatigue Test with Hourglass Test Piece for Lead-Free Solder IPACK2017-74377
Kleff Jessica 2-3-1 Material IPACK2017-74122
Klein Levente 3-3-1 IPACK2017-74191
Current and Future Directions in Power Electronic Devices and Circuits Based on
Wide-Bandgap Semiconductors

Current and Future Directions in Power Electronic Devices and Circuits based on
Wide Band-Gap Semiconductors

Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with
Embedded Fluid Channels

Monitoring Fugitive Methane Gas Emission from Natural Gas Pads

Klein Levente 3-3-2 Edge Computing and Contextual Information for The Internet of Things Sensors IPACK2017-74304

Klein Steven 6-2-1 Mechanical Testing for Stretchable Electronics IPACK2017-74185

Koganema- Masaaki 1-3-3 Reliability Evaluation of an Interface between Encapsulation Resin and Substrate IPACK2017-74041
ru Sayuri 2-2-1 for Power Devices during Thermal Cycle Test IPACK2017-74098

Kohara Effects of Build-up Material Properties on Warpage Dispersion Of Organic
Substrates Caused By Manufacturing Variations

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