Page 90 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Li Jianlin 4-4-2 IPACK2017-74197
Li Jiran 1-7-3 Pushing the Envelope on Batteries: New Advanced Cathode Materials and their IPACK2017-74123
Problems
Thin Thermal Ground Planes for High Power-Density Applications

Li Yiran 1-3-1 Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder IPACK2017-74201
Liao 3-4-1 Alloy IPACK2017-74382
Libeer Ken-Hsuan 2-2-2 Printed Metallization for Consumer Electronic Applications IPACK2017-74188
Libeer (Kirby) 6-1-1 IPACK2017-74189
Liehr, William 7-6-1 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74453
Cooling Systems
William CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air
Cooling Systems
Michael Challenges to Integrated Photonics Manufacturing

Lingamneni Srilakshmi 2-2-2 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74188
Lingamneni Srilakshmi 6-1-1 Cooling Systems IPACK2017-74189
Liou Joe 1-4-1 IPACK2017-74306
CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air
Cooling Systems

Challenges in 3D Printing of High Conductivity Copper

Liu Jing 4-4-1 Numerical Investigation of Low Melting Point Metal Based Latent Thermal Energy IPACK2017-74103
Liu Jing 4-1-4 Storage System IPACK2017-74064
Liu Jing 6-1-1 IPACK2017-74065
Fabrication and Characterization of Metallic Paste as Highly Conductive Thermal
Interface Material

Self-Driving Cooling Loop Using Liquid Metal and Volatile Fluid as Hybrid Coolant

Liu Jing 6-1-1 Experimental Evaluation on Cooling Capacity of Electrically Driven Hybrid Liquid IPACK2017-74102
Locker David 1-1-1 Metal and Water Cooling IPACK2017-74252
Locker David 5-7-1 IPACK2017-74300
Effects of Sustained Exposure to Temperature and Humidity on the Reliability and
Performance of MEMS microphone

Anand Parameters for SAC305 Alloys after Prolonged Storage Upto 1-Year

Locker David 6-1-1 Failure Mechanisms of MEMS Gyroscopes Subjected to Operation Under IPACK2017-74250
Locker David 6-1-1 Simultaneous Temperature and Vibration IPACK2017-74257
Locker David 6-1-1 IPACK2017-74247
Lowery Lisa 1-5-1 Development of Anand Viscoplasticity Parameters for High Strain Rate Mechani- IPACK2017-74436
cal Behavior of SACQ Solder

High Strain-Rate Stress-Strain Behavior of SAC305 Solders Operating at
Automotive Underhood Temperatures

Metallurgical Analyses of Pin-to-Flex Circuit Solder Joints

Lubner Sean 4-4-1 In-Situ Thermal Characterization of Lithium-Ion Batteries IPACK2017-74418

Lundh James 4-1-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74153
Lundh Spencer 4-1-1 IPACK2017-74128
Lundh 4-1-2 Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier IPACK2017-74110
Lundh James 4-1-4 Diodes IPACK2017-74155
Lundh Spencer 5-7-2 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74156
Lundh 6-1-1 High Electron Mobility Transistor IPACK2017-74426
Lundh James 6-1-1 Thermal Management of Large Periphery Gallium Nitride Power Electronics Using IPACK2017-74427
Luo Spencer 3-2-1 3-D Multi-Metallization Structures IPACK2017-74146
Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays
James
Spencer Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier
Diodes
James Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
Spencer High Electron Mobility Transistor
Mechanical Reliability of PECVD SiNx Barrier Films for Flexible Electronics
James
Spencer

James
Spencer

Hao

Luo Xiaobing 1-1-1 Color Uniformity Enhancement of White Light-emitting Diodes with Bell Shape IPACK2017-74195
90 Phosphor Layer