Page 93 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Momen Ayyoub 4-3-1 IPACK2017-74147
Montazeri Kimia 6-1-1 High Performance Microchannels Development Using Magnetic Stabilization IPACK2017-74368
Montazeri Mahsa 6-1-1 IPACK2017-74240
Morgan Adam 1-6-1 Thin Film Evaporation within Microscale Pores IPACK2017-74222
Mori Hiroyuki 1-3-2 IPACK2017-74097
Mori Hiroyuki 2-2-1 Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based IPACK2017-74098
Mori Takao 1-3-2 Interconnects IPACK2017-74177
Moriwaki Takeshi 1-4-1 Numerical and Experimental Determination of Temperature Distribution in 3D IPACK2017-74092
Mroßko Raúl 2-3-1 Stacked Power Devices IPACK2017-74122
Mukherjee Sibasish 2-2-2 The Mechanism of the Low-K Stress Reduction by Shorter Solder Bump Height in IPACK2017-74081
Mukherjee Sibasish 5-5-2 Chip Assembly IPACK2017-74194
Murai Yuki 6-1-1 Effects Of Build-up Material Properties On Warpage Dispersion Of Organic IPACK2017-74094
Muralidhar Ramachan- 3-3-1 Substrates Caused By Manufacturing Variations IPACK2017-74191
Muralidhar dran 3-3-2 In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue IPACK2017-74225
Murthy Ramachan- 1-7-2 Cracks at Die-attached Joints under Cyclic Energization Loading IPACK2017-74137
Murthy dran 6-1-1 Relationship between threshold current density of electromigration damage IPACK2017-74424
Nagarkar Jayathi 6-2-1 considering void and hillock formation and reservoir shape in interconnect line IPACK2017-74428
Nagarkar Jayathi 6-1-1 Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with IPACK2017-74375
Nagisetty Kaustubh 9-3-1 Embedded Fluid Channels IPACK2017-74410
Nair Kaustubh 3-3-1 Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling IPACK2017-74191
Nair Ramune 3-3-2 (TC) Qualification IPACK2017-74304
Nakaido Dhruv 1-3-3 BGA Temperature Cycling Reliability in Automotive Applications: Knowledge IPACK2017-74041
Nakajo Dhruv 2-1-3 Based Qualification IPACK2017-74341
Narumanchi Hiroshi 4-2-1 A Study on Low Cycle Fatigue Test with Hourglass Test Piece for Lead-Free Solder IPACK2017-74214
Ndao Yusuke 4-3-1 Material IPACK2017-74212
Ndao Sreekant 6-1-1 Monitoring Fugitive Methane Gas Emission from Natural Gas Pads IPACK2017-74429
Neely Sidy 2-3-2 IPACK2017-74154
Nemati Sidy 2-1-1 A Robust Low-cost Particulate Sensing System IPACK2017-74148
Nemati Jason 2-2-2 IPACK2017-74105
Nemati Kourosh 2-2-2 Advanced Cooling of 3D ICs with Nanoparticle Packings IPACK2017-74339
Kourosh
Kourosh Advanced Cooling of 3D ICS with Nanoparticle Packings

POL-kw Modules for High Power Applications

Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording
Systems
Opportunities for Applications of Biosensing in Wearable Form Factors

Monitoring Fugitive Methane Gas Emission from Natural Gas Pads

Edge Computing and Contextual information for the Internet of Things Sensors

Reliability evaluation of an interface between encapsulation resin and substrate
for power devices during thermal cycle test
Temperature-Based Request Distribution for Effective CRAC and Equipment
Life-cycle Extension
Thermomechanical Modeling and Material Characterization of Sintered Silver

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across
Variable Nano/Micro Gap
Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across
Variable Nano/Micro Gap
Steerable Jumping-Droplet Phase-Change Electronics Cooling

Transient Thermal Performance of Rear Door Heat Exchanger with Local
Contained Cold Aisle During Water Side Failures
Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi-
ronment
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

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