Page 97 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
RAHANG- UNIQUE 6-1-1 IPACK2017-74430
DALE Varun 2-1-2 Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4 IPACK2017-74019
Rahul PAVAN 1-3-2 Printed Circuit Boards IPACK2017-74265
PAVAN 1-3-2 NiyanTron - An Approach to Develop a Control System App for Data Center IPACK2017-74278
RAJMANE PAVAN 1-3-2 Cooling IPACK2017-74279
PAVAN 6-1-1 Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4 IPACK2017-74425
RAJMANE PAVAN 6-1-1 Printed Circuit Boards IPACK2017-74430
Dave 8-3-1 A Computational Approach to Study the Impact of PCB Thickness on QFN IPACK2017-74446
RAJMANE Bharath 2-1-2 Assembly Under Drop Testing with Package Power Supply IPACK2017-74174
Bharath 2-3-1 Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package IPACK2017-74180
RAJMANE suriyakala 1-1-1 on Varying Structural Parameter Under Thermal Loading IPACK2017-74342
Ganpati 1-6-1 A Computational Approach to Study the Impact of PCB Thickness on QFN IPACK2017-74218
RAJMANE V. N. N. 5-7-2 Assembly Under Drop Testing with Package Power Supply IPACK2017-74073
Trilochan 6-2-1 Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4 IPACK2017-74217
Ramahi David A. L. 1-2-2 Printed Circuit Boards IPACK2017-74335
Rampi 4-3-1 Additive Manufacturing for Direct Integration of 3D Sensors for IoT Applications IPACK2017-74296
Ramakrish- Matthew 4-3-2 IPACK2017-74248
nan Matthew 9-1-1 Cooling Failure in Direct Liquid Cooling System (DLCS) IPACK2017-74448
Ramakrish- Gamal 6-2-1 IPACK2017-74217
nan Heiko 2-3-2 Experimental Characterization of Cold Plates used in Cooling Multi Chip Server IPACK2017-74154
ramalingam Michelle 4-1-3 Modules (MCM) IPACK2017-74374
David 9-4-1 Evaluation and Selection of Adhesives for Opto-Electronic Components IPACK2017-74378
Ramanath David 4-1-5 IPACK2017-74132
Bradley 5-7-1 Molecularly-tailored Nanomaterials and Interfaces for Next Generation Device IPACK2017-74312
Rambhatla Jordan 6-1-1 Metallization ad Packaging IPACK2017-74313
Jordan 6-1-1 Methods for Theoretical Assessment of Delamination Risks in Electronic IPACK2017-74246
Ramos Jordan 6-2-1 Packaging IPACK2017-74217
Nicolas P. 5-7-1 Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74416
Ramprasad Mike Fabrication by Template-Assisted Electrochemical Deposition
2-2-1 Rational Computation-Guided Design of Polymer Dielectrics IPACK2017-74021
Reese
Quantifying Water Vapor Transmission Rates through Barriers and Edge Seals for
Reese Photovoltaic and Other Demanding Applications
Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics
Re-
fai-Ahmed 3D Packaging - Key Drivers, Opportunities and Challenges
Reith
Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Rentauskas Fabrication by Template-Assisted Electrochemical Deposition
Steerable Jumping-Droplet Phase-Change Electronics Cooling
Reusch
Thermal Evaluation of Chip-Scale Packaged Gallium Nitride Transistors
Reusch
GaN Transistors - Enabling the Next Generation of Power Electronics
Richard
Integrated Vapor Chamber Heat Spreader for Power Module Applications
Roberts
Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to
Roberts Various Moisture Conditions
Moisture Induced Stresses in PBGA Packages
Roberts
Characterization of Moisture Induced Die Stresses in Flip Chip Packaging
Rodriguez
Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Roellig Fabrication by Template-Assisted Electrochemical Deposition
Towards Improvement of Lifetime Prediction of Solder Joints under Field
Roessle Andreas Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic
BGA-Geometry

Mechanical Behavior of Thermal Interface Materials in Electronic Components
under Dynamic Loading Conditions

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