Page 101 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Sood Aditya 4-1-3 IPACK2017-74163
Aditya 6-1-1 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74167
Sood Norma 3-3-1 use in Electronics Thermal Management IPACK2017-74191
Jesus 2-3-2 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74154
Sosa Ananthavi- 2-1-3 for use in Power Electronics IPACK2017-74254
jayan 6-1-1 Monitoring Fugitive Methane Gas Emission from Natural Gas Pads IPACK2017-74433
Sotelo Ananthavi- 2-3-1 IPACK2017-74122
jayan 6-1-1 Steerable Jumping-Droplet Phase-Change Electronics Cooling IPACK2017-74375
Sridhar Wolfram 1-1-1 IPACK2017-74262
Nancy 1-3-1 CFD Optimization of the Cooling of Yosemite Open Compute Server IPACK2017-74201
Sridhar Jason 2-2-1 IPACK2017-74129
Ganesh 1-5-1 CFD Optimization of the cooling of Yosemite Open Compute Server IPACK2017-74026
Steller Ganesh 4-4-2 IPACK2017-74078
Suresh 6-2-1 Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with IPACK2017-74185
Stoffel Venkat 1-3-2 Embedded Fluid Channels IPACK2017-74183
Vijay 1-3-1 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74233
Strader Ephraim 1-3-1 Systems IPACK2017-74263
Jeffrey 1-2-1 Extending the Performance of High Heat Flux 2.5D and 3D Packaging from IPACK2017-74121
Subbarayan Jeffrey 1-2-1 Component - System Interaction. IPACK2017-74261
Jeffrey 1-5-1 Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder IPACK2017-74266
Subbarayan Jeffrey 1-5-1 Alloy IPACK2017-74270
Jeffrey 5-2-1 Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal IPACK2017-74253
Subramani- Jeffrey 5-2-1 Interface Materials (TIMs) by a Random Network Model IPACK2017-74322
am Jeffrey Large Flip Chip Assembly Challenges and Risk Mitigation Process
Subramani- Jeffrey 5-5-2 IPACK2017-74273
an 5-7-1 Minimizing Capacity Fade through Optimal Model-based Control ? Theory and IPACK2017-74300
Subramani- 5-7-1 Experimental Validation IPACK2017-74272
an 5-7-1 Mechanical Testing for Stretchable Electronics IPACK2017-74312
Suhir 5-7-1 IPACK2017-74258
6-1-1 Could a Second Level Solder Joint Interconnection be Designed in Such a Way IPACK2017-74234
Suhling that the Inelastic Strains in it are Avoided?
Effect of Alloy Composition and Aging on the Survivability of Lead Free Solders in
Suhling High Temperature Vibration in Automotive Environments
Effects of Fatigue Cycling on the Microstructure of SAC305 Lead Free Solder
Suhling
Effects of Aging on the Microstructural Evolution of Lead Free SACN05 and
Suhling Doped SAC Alloys
Mechanical Characterization of Solder Mask at Different Temperatures
Suhling
Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead
Suhling Free Solder
Measurement of Elevated Temperature Mechanical Properties of Intermetallic
Suhling Compounds in SAC Solder Joints
High Temperature Mechanical Behavior of Lead Free Solders
Suhling
Interfacial Delamination and Fracture Properties of Potting Compounds and Epoxy
Suhling Jeffrey Interfaces under High Strain Rate Loading after Exposure to High Temperature
Suhling Jeffrey Storage
Suhling Jeffrey
Suhling Jeffrey The Dependence of Moisture Induced Die Stresses on the Moisture Properties of
Suhling Jeffrey Polymeric Components in Electronic Packages
Suhling Jeffrey Anand Parameters for SAC305 Alloys after Prolonged Storage Upto 1-Year

The Poisson?s Ratio of Lead Free Solder and its Effect on Solder Joint Reliability

Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to
Various Moisture Conditions
Improved Finite Element Simulation Strategy with Submodeling for BGA Packages
Subjected to Thermal Cycling
Experimental Characterization and Constitutive Modeling of Underfill Materials
Exposed To Different Moisture Conditions

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