Page 98 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Romig Matt 9-5-1 Next-Generation Automotive Electronics: Reliability Challenges IPACK2017-74398
Rosler David 6-1-1
Roy Nilabh Kumar 1-6-1 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74375
Rzepka Sven 5-7-1 Systems IPACK2017-74173
Rzepka Sven 9-5-1 IPACK2017-74208
Saha Sanjoy 2-1-2 Preliminary Results on the Fabrication Of Interconnect Structures using IPACK2017-74395
Sahini Manasa 2-1-2 Microscale Selective Laser Sintering
Sahini Manasa 2-1-4
Sahini Manasa 2-2-2 Application Driven Reliability Research of Next Generation for Automotive
Sahini Manasa 6-1-1 Electronics: Challenges and Approaches
Sahini Manasa 6-1-1
Saiki Naoya 1-5-1 Next-Generation Automotive Electronics: Reliability Challenges
Sajadi Seyed 4-1-5
Salamon Mohammad 2-1-1 Improvement in Server Compute Performance Using Advanced Air Cooled IPACK2017-74055
Samet Todd 5-7-2 Thermal Solutions IPACK2017-74028
Sammakia David 2-1-1 IPACK2017-74260
Sammakia Bahgat 2-1-2 Characterization of an Isolated Hybrid Cooled Server with Failure Scenarios Using IPACK2017-74016
Sammakia Bahgat 2-2-2 Warm Water Cooling
Sammakia Bahgat 2-2-2
Sammakia Bahgat 2-3-1 Rack-Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With
Santhana- Bahgat 4-4-2 Variable Pumping For Centralized Coolant System
gopalan Shriram 5-5-2
Sarwar Azeem 9-5-1 Performance Evaluation of Three Types of Novel End-Of-Aisle Cooling Systems
Sarwar Azeem 1-4-1
Sasagawa Kazuhiko 1-4-1 Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74431
Sasagawa Kazuhiko 6-1-1 Variable Pumping For Centralized Coolant System IPACK2017-74432
Sato Noriyuki 1-3-2 IPACK2017-74010
Sayama Toshihiko 5-7-1 Experimental and Computational Study of Multi-Level Cooling Systems at High IPACK2017-74139
Schafet Natalja Ambient Coolant Temperatures

Schappert Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for
Bump-Wafer

Decoupled Hierarchical Structures for High-Heat Flux Cooling Systems

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for IPACK2017-74020
Electronics: Experimental Analysis IPACK2017-74073
IPACK2017-74148
Methods for Theoretical Assessment of Delamination Risks in Electronic IPACK2017-74174
Packaging

Transient Thermal Performance of Rear Door Heat Exchanger with Local
Contained Cold Aisle During Water Side Failures

Cooling Failure in Direct Liquid Cooling System (DLCS)

Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi- IPACK2017-74105
ronment IPACK2017-74339

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Experimental Characterization of Cold Plates used in Cooling Multi Chip Server IPACK2017-74180
Modules (MCM) IPACK2017-74078
IPACK2017-74449
Minimizing Capacity Fade through Optimal Model-based Control ? Theory and
Experimental Validation

Challenges and Opportunities in Connected Vehicles

Next-Generation Automotive Electronics: Reliability Challenges IPACK2017-74401

Michael 3-3-2 Analysis for Evaluation of Threshold Current Density of Electromigration Damage IPACK2017-74059
in Taper-shaped Metal Line IPACK2017-74092
IPACK2017-74050
Relationship between Threshold Current Density of Electromigration Damage IPACK2017-74177
Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line IPACK2017-74416

Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel IPACK2017-74225
Junction Characterized by Picosecond Time-domain Thermoreflectance

In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue
Cracks at Die-attached Joints under Cyclic Energization Loading

Towards Improvement of Lifetime Prediction of Solder Joints under Field
Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic
BGA-Geometry

A Robust Low-cost Particulate Sensing System

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