Page 94 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Newport Seth 4-3-1 High Performance Microchannels Development Using Magnetic Stabilization IPACK2017-74147

Nguyen Luu 1-7-3 Thin Thermal Ground Planes for High Power-Density Applications IPACK2017-74123

Nguyen Luu 2-3-1 Capillary Evaporation in 4-layer Copper Mesh Structure IPACK2017-74292

Nguyen Luu 5-2-1 Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics under IPACK2017-74325
Nguyen Luu 6-1-1 Operation at High Voltage and High Temperature IPACK2017-74326
Nguyen Quang 5-5-2 IPACK2017-74273
Nguyen Quang 5-7-1 Measurements of Cu-Al Intermetallic Polarization Curves for Modeling of IPACK2017-74312
Nguyen Quang 6-1-1 Corrosion Multiphysics in Copper-Aluminum Wirebonds IPACK2017-74313

The Dependence of Moisture Induced Die Stresses on the Moisture Properties of
Polymeric Components in Electronic Packages

Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to
Various Moisture Conditions

Moisture Induced Stresses in PBGA Packages

Nguyen Quang 6-1-1 Characterization of Moisture Induced Die Stresses in Flip Chip Packaging IPACK2017-74246

Nichols Rick 1-2-1 A Study of the Initiation Speed of the Palladium, within an Electroless Nickel, IPACK2017-74345
Electroless Palladium and Immersion Gold (Enepig) System, with Regard to Solder
Nielsch Kornelius 6-2-1 Joint Reliability IPACK2017-74217
Nikdoost Arsalan 3-2-1 IPACK2017-74178
Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Nim- Amulya 4-4-2 Thermal Transport in Lithium Ion Battery Cells IPACK2017-74236
magadda Hiroaki 2-1-3 IPACK2017-74341
Nishi Yuling 1-3-3 Temperature-Based Request Distribution for Effective CRAC and Equipment IPACK2017-74017
Tsuyoshi 4-3-1 Life-cycle Extension IPACK2017-74112
Niu An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC
Package During Solder Reflow
Nomura Thermal Metamaterials for Heat Flow Control in Electronics

Norris Jerome 1-5-1 Metallurgical Analyses of Pin-to-Flex Circuit Solder Joints IPACK2017-74436

Nunna Bharath Babu 3-3-2 Point of Care Micro Biochip For Health Care Monitoring IPACK2017-74298

Nunna Bharath Babu 6-1-1 Point of Care Micro Biochip For Health Care Monitoring IPACK2017-74297

Oenick John 4-2-1 Application of WBG Power Inverters to Vehicle Systems for Harsh Environments IPACK2017-74405

Oenick John 9-4-1 Application of WBG Power Inverters to Vehicle Systems for Harsh Environments IPACK2017-74406

Oh Junho 2-3-2 Steerable Jumping-Droplet Phase-Change Electronics Cooling IPACK2017-74154

Ohadi Michael 2-3-1 Effect of Bonding Structure and Heater Design on Performance Enhancement of IPACK2017-74158
Ohadi Michael 2-3-1 FEEDS Embedded Manifold-Microchannel Cooling IPACK2017-74287
Ohadi Michael 6-1-1 IPACK2017-74437
Okamoto Keishi 1-3-2 Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap IPACK2017-74097
Okamoto Keishi 2-2-1 Channel IPACK2017-74098
Okamoto Yoshiyuki 1-3-2 IPACK2017-74177
Ong Chin Lee 2-1-1 Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap IPACK2017-74030
Channel

The Mechanism of the Low-K Stress Reduction by Shorter Solder Bump Height in
Chip Assembly

Effects of Build-up Material Properties On Warpage Dispersion Of Organic
Substrates Caused By Manufacturing Variations

In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue
Cracks at Die-attached Joints under Cyclic Energization Loading

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments,
Modeling and Simulations

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