Page 92 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Maruyama Benji 3-4-1 Printed Electronics for Aerospace Applications IPACK2017-74311
Mathai Sagi 1-1-1
Matsumoto Keiji 1-3-2 CWDM Transceiver for Mid-board Optics IPACK2017-74199
Mayer Dirk 3-3-2
McCloskey David 2-1-4 The Mechanism of the Low-K Stress Reduction by Shorter Solder Bump Height in IPACK2017-74097
McCluskey Patrick 4-2-1 Chip Assembly IPACK2017-74058
McCluskey Patrick 4-1-2 IPACK2017-74184
McCluskey Patrick 5-2-1 Piezoresistive Silicon Stress Sensor as a Tool To Monitor Health of an Electronic IPACK2017-74138
McCluskey Patrick 5-2-1 System IPACK2017-74171
McGinn Pat 2-1-4 IPACK2017-74286
McGinn Pat 6-1-1 Thermo-Mechanical Study of AlN Thin Films as Heat Spreaders in III-V Photonic
McNutt Ty 4-1-5 Devices
McNutt Ty 9-4-1
Melz Tobias 3-3-2 Prediction and Mitigation of Vertical Cracking in High-Temperature Transient
Metasch René 5-7-1 Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

5-5-1 Thermal Design Optimization of novel "contact" structure for Heat Removal in
2-3-2 Semiconductor Power Amplifiers (PAs)
5-5-2
4-1-2 Advancements in Silver Wire Bonding
1-3-2
1-3-2 Making and Qualifying Reliable Extreme Environment Electronics IPACK2017-74351
1-3-2
6-1-1 Rack-Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74260
6-1-1 Variable Pumping For Centralized Coolant System IPACK2017-74431
4-1-3 IPACK2017-74388
6-1-1 Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74387
4-2-1 Variable Pumping For Centralized Coolant System
9-3-1
6-2-1 Advanced SiC power packaging and thermal management for increased system
performance

System Considerations for Full Utilization of SiC Power Modules

Meyyappan Karumbu Piezoresistive Silicon Stress Sensor as a Tool To Monitor Health of an Electronic IPACK2017-74058
Miljkovic Nenad System IPACK2017-74416
Miller Eric
Miner Steven Towards Improvement of Lifetime Prediction of Solder Joints under Field IPACK2017-74190
Misrak Abel Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic IPACK2017-74154
Misrak Abel BGA-Geometry
Misrak Abel
Misrak Abel Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in
Misrak Abel Electronic Components
Miyazaki Noriyuki
Mizutani Yoshikazu Steerable Jumping-Droplet Phase-Change Electronics Cooling
Moeini S. Ali
Mohammed Anwar Continuous Lifetime Estimation of Vehicle Power Electronics IPACK2017-74215
Mohn Melanie
Power Packaging Thermal and Stress Model for Quick Parametric Analyses IPACK2017-74130

Reliability Assessment Of Solder Joint Using BGA Package - Megtron 6 Versus IPACK2017-74265
FR4 Printed Circuit Boards IPACK2017-74278
IPACK2017-74279
A Computational Approach to Study the Impact of PCB Thickness on QFN IPACK2017-74425
Assembly Under Drop Testing with Package Power Supply IPACK2017-74430
IPACK2017-74176
Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package IPACK2017-74038
on Varying Structural Parameter Under Thermal Loading IPACK2017-74138
IPACK2017-74413
A Computational Approach to Study the Impact of PCB Thickness on QFN
Assembly Under Drop Testing with Package Power Supply

Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards

Effect of Material Non-linearity on Thermal Fatigue Reliability for Aluminum Wire
Bonds of Power Module

Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene
Glycol with Rust Inhibitor

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient
Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Manufacturing Capabilities for Emerging Flexible Technologies

Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74217
Fabrication by Template-Assisted Electrochemical Deposition

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