Page 96 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Pathak Manan 4-4-2 IPACK2017-74078
Patterson Michael 7-2-1 Minimizing Capacity Fade through Optimal Model-based Control - Theory and IPACK2017-74354
Experimental Validation
A Systems Perspective: Making Thermal Management a 1st Class Citizen

Pavlidis Georges 4-1-3 Impact of Buffer Layers on the Reliability of GaN on Si HEMTs for Power IPACK2017-74152
Pavlidis Georges 5-4-1 Electronics IPACK2017-74149

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Pavlidis Georges 6-1-1 Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes IPACK2017-74151

Peddle Thomas M. 2-2-2 Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi- IPACK2017-74105
Pei Min 1-3-1 ronment IPACK2017-74082
Pei Min 2-2-2 IPACK2017-74081
Pei Min 5-5-2 Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in IPACK2017-74194
Philofsky Brian 1-1-1 BGA Components IPACK2017-74262
Pierron Olivier 3-2-1 IPACK2017-74146
Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling
(TC) Qualification

BGA Temperature Cycling Reliability in Automotive Applications: Knowledge
Based Qualification

Extending the Performance of High Heat Flux 2.5D and 3D Packaging from
Component - System Interaction.

Mechanical Reliability of PECVD SiNx Barrier Films for Flexible Electronics

Pilawa-Pod- Robert C.N. 2-3-2 Steerable Jumping-Droplet Phase-Change Electronics Cooling IPACK2017-74154
gurski Jeremy 1-5-1 Large Flip Chip Assembly Challenges and Risk Mitigation Process IPACK2017-74026

Plunkett

Poonjolai Erasenthiran 1-1-1 Evaluation and selection of Adhesives for Opto-Electronic Components IPACK2017-74342
Poshtan Raaja 2-2-1 IPACK2017-74021
Prakash Emad A. 1-1-1 Mechanical Behavior of Thermal Interface Materials in Electronic Components IPACK2017-74342
under Dynamic Loading Conditions
Anna Evaluation and selection of Adhesives for Opto-Electronic Components

Prasher Ravi 4-4-1 In-Situ Thermal Characterization of Lithium-Ion Batteries IPACK2017-74418

Prasher Ravi 4-3-1 A Photonic Near Infrared Radiative Heater IPACK2017-74415

Prasher Ravi 8-1-1 Manipulating Interfacial Thermal Transport Using Surface Chemistry IPACK2017-74389

Prisacaru Alexandru 3-3-2 Piezoresistive Silicon Stress Sensor as a Tool to Monitor Health of an Electronic IPACK2017-74058
Puckett Waylon 4-1-5 System IPACK2017-74235

Integrated Substrate - Cold Plate for Compact Power Electronics Modules

Pullins Clayton 1-7-3 State of the Art of Electronics Cooling for Radar Antenna Applications IPACK2017-74080

Quintero Pedro O. 4-4-1 Voiding Effects on the Thermal Response of Metallic Phase Change Materials IPACK2017-74118
6-1-1 Under Pulsed Power Loading IPACK2017-74419
Quintero Pedro O. 1-1-1 IPACK2017-74262
4-4-1 Voiding Effects on the Thermal Response of Metallic Phase Change Materials IPACK2017-74275
Ra- Gamal 1-3-2 Under Pulsed Power Loading IPACK2017-74265
fai-ahmed Ajay 1-3-2 IPACK2017-74278
1-3-2 Extending the Performance of High Heat Flux 2.5D and 3D Packaging from IPACK2017-74279
Raghavan 6-1-1 Component - System Interaction. IPACK2017-74425

RAHANG- UNIQUE Embedded Fiber-Optic Sensing for Low-Cost, High Resolution Monitoring in
DALE Advanced Batteries and IoT-Connected Systems

RAHANG- UNIQUE Reliability Assessment Of Solder Joint Using BGA Package - Megtron 6 Versus
DALE FR4 Printed Circuit Boards

RAHANG- UNIQUE A Computational Approach to Study the Impact of PCB Thickness on QFN
DALE Assembly Under Drop Testing with Package Power Supply

RAHANG- UNIQUE Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package
on Varying Structural Parameter Under Thermal Loading
96 DALE
A Computational Approach to Study the Impact of PCB Thickness on QFN
Assembly Under Drop Testing with Package Power Supply