Page 91 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Luo Xiaobing 1-7-1 IPACK2017-74196
Luo Yihua 5-2-1 Optimization of Filling Mass Fraction for Composite PCMs Based Thermal IPACK2017-74325
Luo Yihua 6-1-1 Management System IPACK2017-74326
Lutsch Yvonne 8-5-1 Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics under IPACK2017-74363
Luttrell Jeffrey 6-1-1 Operation at High Voltage and High Temperature IPACK2017-74327
MacDonald Bill 3-2-1 Measurements of Cu-Al Intermetallic Polarization Curves for Modeling of IPACK2017-74314
maeda jun 1-5-1 Corrosion Multiphysics in Copper-Aluminum Wirebonds IPACK2017-74010
Mahajan Ravi 6-2-1 Challenges and Opportunities of Cooperating with Fast Moving Startups in the IPACK2017-74185
Maitra Tanmoy 1-2-1 Automotive Space IPACK2017-74090
Maitra Tanmoy 6-1-1 Enhancing Direct / Indirect Evaporative Heat Exchanger in Data Center Cooling in IPACK2017-74089
Major Joshua 5-5-2 Harsh Climates by using a compression refrigeration cycle IPACK2017-74215
Malatkar Pramod 5-5-1 Polyester Film Substrates for Flexible Electronics IPACK2017-74190
Malatkar Pramod 6-2-1 IPACK2017-74185
Mallampati Sandeep 4-2-1 Investigation of peeling behavior of UV curable pressure sensitive adhesive for IPACK2017-74169
Mallow Anne 4-4-2 bump-wafer IPACK2017-74244
Mandel Raphael 2-3-1 Mechanical Testing for Stretchable Electronics IPACK2017-74158
Manoharan Subramani 5-2-1 IPACK2017-74286
Mantooth H. Alan 4-1-1 Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer IPACK2017-74213
Mantooth H. Alan 8-5-1 IPACK2017-74362
Marbut Cody 6-1-1 Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces IPACK2017-74240
Marcinichen Jackson Braz 2-1-1 IPACK2017-74020
Marcinichen Jackson Braz 2-1-1 Continuous Lifetime Estimation of Vehicle Power Electronics IPACK2017-74030
Marconnet Amy 1-7-3 IPACK2017-74224
Marconnet Amy 4-4-2 Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in IPACK2017-74236
Marek Jiri 7-5-1 Electronic Components IPACK2017-74356
Marsh Jason 7-3-1 Mechanical Testing for Stretchable Electronics IPACK2017-74355
Marthinuss Jim 1-7-3 IPACK2017-74080
Martin Quinn 7-4-1 High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Tempera- IPACK2017-74346
Marty Valerie 9-3-1 ture Electronics IPACK2017-74407
Maruya Yuki 6-1-1 Optimization of Graphite Composite Latent Heat Storage Systems IPACK2017-74036

Effect of Bonding Structure and Heater Design on Performance Enhancement of 91
FEEDS Embedded Manifold-Microchannel Cooling
Advancements in Silver Wire Bonding

3D Wire Bondless Integration - the Future of SiC Packaging

High Performance Silicon Carbide Power Packaging?Past Trends, Present
Practices, and Future Directions
Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based
Interconnects
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for
Electronics: Experimental Analysis
Two-Phase Mini-thermosyphon for Cooling of Datacenters: Experiments,
Modeling and Simulations
Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Tempera-
ture Sensor Location in Microchips
Thermal Transport in Lithium Ion Battery Cells

Trends in Automotive Electronics and Sensors

Flexible Future: How Flexible Hybrid Electronics Changes the Shape of Medical,
Structural Health, Asset Monitoring and Soft Robotics Applications
State of the Art of Electronics Cooling for Radar Antenna Applications

Packaging Solutions to Enable High Power RF Gallium Nitride Products and
Advanced Technologies
Integration of Technology, Sub-systems and Capabilities.

Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point
Joint Using Sn-57Bi-1Ag