Page 89 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Lall Pradeep 6-1-1 IPACK2017-74326
Lall Pradeep 6-1-1 Measurements of Cu-Al Intermetallic Polarization Curves for Modeling of IPACK2017-74238
Lall Rahul 3-2-1 Corrosion Multiphysics in Copper-Aluminum Wirebonds IPACK2017-74232
Lall Rahul 3-2-1 Finite Element and Experimental Study of the Influence of Poisson's Ratio on the IPACK2017-74255
Lamaison Nicolas 2-1-1 Reliability of SAC Lead Free Solders IPACK2017-74020
Lamaison Nicolas 2-1-1 Design and Development of Biometric Sensor Wearable Band using Flexible IPACK2017-74030
Lee Eon Soo 3-3-2 Electronics IPACK2017-74298
Lee Eon Soo 6-1-1 Performance and Operational Reliability of Flexible Power Sources In Foldable IPACK2017-74297
Lee Hyoungsoon 1-2-1 Wearable Electronics Under Stresses Of Daily Motion IPACK2017-74090
Lee Hyoungsoon 2-2-1 Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for IPACK2017-74088
Lee Hyoungsoon 2-3-2 Electronics: Experimental Analysis IPACK2017-74014
Lee Hyoungsoon 4-1-4 Two-Phase Mini-thermosyphon for Cooling of Datacenters: Experiments, IPACK2017-74008
Lee Hyoungsoon 6-1-1 Modeling and Simulations IPACK2017-74368
Lee Hyoungsoon 6-1-1 Point Of Care Micro Biochip For Health Care Monitoring IPACK2017-74091
Lee Hyoungsoon 6-1-1 IPACK2017-74009
Point Of Care Micro Biochip For Health Care Monitoring
Lee Hyoungsoon 6-1-1 IPACK2017-74089
Lee Jaewook 6-1-1 Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer IPACK2017-74209
Lee Joseph 3-3-2 IPACK2017-74150
Lee Soo Il 6-1-1 Comprehensive Modeling of Single Bubble Evaporation in Microchannel IPACK2017-74206
Lee Tae-Kyu 1-2-1 IPACK2017-74308
Lee Y.C. 2-3-1 Experimental study of single/two-phase heat transfer for 3D-chip embedded IPACK2017-74292
Lee Yung Cheng 1-7-3 cooling with micro-pin-fin arrays IPACK2017-74123
leever benjamin 3-4-1 Thermofluidic Characterization of An "Embedded Microchannel-3D manifold" IPACK2017-74311
leever benjamin 9-3-1 Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application IPACK2017-74409
Lei Shenghui 2-1-4 Thin Film Evaporation within Microscale Pores IPACK2017-74184
Lei Shenghui 2-1-4 IPACK2017-74181
Lei Shenghui 6-2-1 Thermal performance evaluation and design optimization of full geometries of IPACK2017-74217
Lewis Ryan 1-7-3 manifold microchannel heat sinks IPACK2017-74123
Lewis Ryan 2-3-1 Overcoming Challenges in Microfabrication of Si and SiC-based ?Embedded IPACK2017-74292
Microchannel-3D manifold? Cooling Module for High Heat Flux (1 kW/cm2) Power
Electronics Application

Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces

Efficient Loss Calculation in Permanent Magnet Synchronous Motors

RF Energy Harvesting Peel-and-Stick Sensors

Preload Effect of Ultrasonic Wire Bonding Transducers with Impedance Analysis
Using Butterworth-van Dyke Circuit Model and Finite Element Method
Effect of Interfacial Incompatibility on Copper Pumping and Reliability of 3D
Electronic Devices
Capillary Evaporation in 4-layer Copper Mesh Structure

Thin Thermal Ground Planes for High Power-Density Applications

Printed Electronics for Aerospace Applications

Aerospace perspective on challenges and opportunities related to flexible hybrid
electronics.
Thermo-Mechanical Study of AlN Thin Films as Heat Spreaders in III-V Photonic
Devices
Thermo-optic Tuning Efficiency of Micro Ring Resonators on Low Thermal
Resistance Silicon Photonics Substrates
Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition
Thin Thermal Ground Planes for High Power-Density Applications

Capillary Evaporation in 4-layer Copper Mesh Structure

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