Page 88 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Lall Pradeep 3-3-1 IPACK2017-74239
Lall Pradeep 3-2-1 PCA and ICA based Prognostic Health Monitoring of Electronic Assemblies IPACK2017-74264
Lall Pradeep 3-3-1 subjected to Simultaneous Temperature-Vibration Loads IPACK2017-74269
Lall Pradeep 3-2-1 Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed IPACK2017-74255
Lall Pradeep 5-2-1 Circuit Board Using X-Ray Micro-CT IPACK2017-74253
Lall Pradeep 5-2-1 Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock IPACK2017-74322
using X-ray Digital Volume Correlation
Lall Pradeep 5-2-1 Performance and Operational Reliability of Flexible Power Sources In Foldable IPACK2017-74325
Lall Pradeep 5-5-2 Wearable Electronics Under Stresses Of Daily Motion IPACK2017-74273
Lall Pradeep 5-7-1 High Temperature Mechanical Behavior of Lead Free Solders IPACK2017-74300
Lall Pradeep 5-7-1 IPACK2017-74272
Lall Pradeep 5-7-1 Interfacial Delamination and Fracture Properties of Potting Compounds and Epoxy IPACK2017-74312
Lall Pradeep 5-7-1 Interfaces under High Strain Rate Loading after Exposure to High Temperature IPACK2017-74258
Lall Pradeep 6-1-1 Storage IPACK2017-74267
Lall Pradeep 6-1-1 IPACK2017-74259
Lall Pradeep 6-1-1 Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics under IPACK2017-74234
Lall Pradeep 6-1-1 Operation at High Voltage and High Temperature IPACK2017-74271
Lall Pradeep 6-1-1 The Dependence of Moisture Induced Die Stresses on the Moisture Properties of IPACK2017-74231
Lall Pradeep 6-1-1 Polymeric Components in Electronic Packages IPACK2017-74274
Lall Pradeep 6-1-1 Anand Parameters for SAC305 Alloys after Prolonged Storage Upto 1-Year IPACK2017-74228
Lall Pradeep 6-1-1 IPACK2017-74237
Lall Pradeep 6-1-1 The Poisson's Ratio of Lead Free Solder and its Effect on Solder Joint Reliability IPACK2017-74250
Lall Pradeep 6-1-1 IPACK2017-74241
Lall Pradeep 6-1-1 Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to IPACK2017-74229
Lall Pradeep 6-1-1 Various Moisture Conditions IPACK2017-74323
Lall Pradeep 6-1-1 Improved Finite Element Simulation Strategy with Submodeling for BGA Packages IPACK2017-74313
Lall Pradeep 6-1-1 Subjected to Thermal Cycling IPACK2017-74257
Lall Pradeep 6-1-1 Deformation and Warpage of the Double-Sided Flexible Printed Circuit BGA IPACK2017-74246
Lall Pradeep 6-1-1 Assemblies Through Reflow Using DIC IPACK2017-74230
Lall Pradeep 6-1-1 Analysis of Color Shift and Life-Modeling of High Power Warm White pc-LED IPACK2017-74247
88 Operating in High Temperature-Humidity
Experimental Characterization and Constitutive Modeling of Underfill Materials
Exposed To Different Moisture Conditions
Finite Element Modeling Creation from X-ray Micro-CT Data for Fuze Assemblies

The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop
Evolution of SAC+X Solder Materials
Reliability of SAC Solders under Combined Temperature-Vibration Automotive
Environments
Effects of Test Temperature and Prior Aging Conditions on the Creep Properties of
SAC305 Solder Joints
Characterization of IMCs in Sn-Ag-Cu Solder Joints using Nanoindentation

Failure Mechanisms of MEMS Gyroscopes Subjected to Operation Under
Simultaneous Temperature and Vibration
Quantitative Analysis of Aging Induced Evolution of IMCs in SAC305 Lead Free
Solder
Mechanical Behavior of Lead Free Solders at High Temperatures

Methods for Survivability Assurance of Fine Pitch Electronics subjected to
Mechanical Shock up to 25,000g
Moisture Induced Stresses in PBGA Packages

Development of Anand Viscoplasticity Parameters for High Strain Rate Mechani-
cal Behavior of SACQ Solder
Characterization of Moisture Induced Die Stresses in Flip Chip Packaging

Improved Finite Element Modeling Strategies for BGA Packages Subjected to
Thermal Cycling
High Strain-Rate Stress-Strain Behavior of SAC305 Solders Operating at
Automotive Underhood Temperatures