Page 84 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Ibrahim Mahmoud 2-2-2 IPACK2017-74105
Ikeda Toru 1-3-3 Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi- IPACK2017-74041
Inoue Kotaro 1-3-3 ronment IPACK2017-74041
Inoue Yukio 6-1-1 Reliability Evaluation of an Interface between Encapsulation Resin and Substrate IPACK2017-74038
Iradukunda Ange 6-1-1 for Power Devices during Thermal Cycle Test IPACK2017-74240
Irajizad Peyman 4-1-5 Reliability Evaluation of an Interface between Encapsulation Resin and Substrate IPACK2017-74139
Islam Nokibul 1-5-1 for Power Devices during Thermal Cycle Test IPACK2017-74026
Ito Hitoshi 6-2-1 Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene IPACK2017-74428
Jaeger Richard 5-5-2 Glycol with Rust Inhibitor IPACK2017-74273
Jaeger Richard 5-7-1 Effects of Cyclic Thermal and Mechanical Loading on Reliability of Solder Based IPACK2017-74312
Jaeger Richard 6-1-1 Interconnects IPACK2017-74313
Jaeger Richard 6-1-1 Decoupled Hierarchical Structures for High-Heat Flux Cooling Systems IPACK2017-74246
Jagdale Vijay 1-4-1 IPACK2017-74306
Jain Ankur 10-3-1 Large Flip Chip Assembly Challenges and Risk Mitigation Process IPACK2017-74447
Jang Jae Woong 6-1-1 IPACK2017-74206
Jankowski Nicholas R. 4-4-1 POL-kw Modules for High Power Applications IPACK2017-74118
Jankowski Nicholas R. 6-1-1 IPACK2017-74419
Janssen John 5-4-1 The Dependence of Moisture Induced Die Stresses on the Moisture Properties of IPACK2017-74096
Jayawarde- Asanka 4-1-1 Polymeric Components in Electronic Packages IPACK2017-74128
na Asanka 6-1-1 Characterization of Die Stresses in Plastic Ball Grid Array Packages Subjected to IPACK2017-74426
Jayawarde- SeungBoong 4-1-4 Various Moisture Conditions IPACK2017-74164
na Vibhash 5-4-1 Moisture Induced Stresses in PBGA Packages IPACK2017-74096
Jeong Mi-Hee 4-1-1 IPACK2017-74153
Jha Qian 1-5-2 Characterization of Moisture Induced Die Stresses in Flip Chip Packaging IPACK2017-74133
Ji Hyeoncheol 6-1-1 IPACK2017-74209
Jiang Shailesh 4-2-1 Challenges in 3D Printing of High Conductivity Copper IPACK2017-74138
Jin Yogendra 2-1-4 IPACK2017-74108
Joshi Ki Wook 2-3-2 Prof. Ankur Jain - The University of Texas at Arlington IPACK2017-74014
Joshi Ki Wook 4-1-4 IPACK2017-74008
Jung Preload Effect of Ultrasonic Wire Bonding Transducers with Impedance Analysis
Jung Using Butterworth-van Dyke Circuit Model and Finite Element Method
Voiding Effects on the Thermal Response of Metallic Phase Change Materials
Under Pulsed Power Loading
Voiding Effects on the Thermal Response of Metallic Phase Change Materials
Under Pulsed Power Loading
Electro-thermal Simulation of Interconnected Systems at Transient Operating
Conditions
Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier
Diodes
Electro-Thermal Analysis of Ga2O3 Based Ultra-Wide Bandgap Schottky Barrier
Diodes
Design of the Cooling Device with Heat Pipes for Power Electronics Cooling

Electro-thermal Simulation of Interconnected Systems at Transient Operating
Conditions
Thermal Characterization of GaN based Vertical Power Electronic Devices

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders going to Pose a
Challenge for Heterogeneous Integration?
Efficient Loss Calculation in Permanent Magnet Synchronous Motors

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient
Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
Experimentally Validated Computational Fluid Dynamics Model for Data Center
with Active Tiles
Experimental Study of Single/Two-Phase Heat Transfer For 3D-Chip Embedded
Cooling with Micro-Pin-Fin Arrays
Thermofluidic Characterization of An "Embedded Microchannel-3D manifold"
Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application

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