Page 85 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Jung Ki Wook 6-1-1 IPACK2017-74009
Overcoming Challenges in Microfabrication of Si and SiC-based "Embedded
Kabakchiev Alexander 5-7-1 Microchannel-3D manifold" Cooling Module for High Heat Flux (1 kW/cm2) Power IPACK2017-74416
Electronics Application
Kaliappan Mathan 2-1-4 IPACK2017-74260
Kaliappan Kumar 6-1-1 Towards Improvement of Lifetime Prediction of Solder Joints under Field IPACK2017-74431
Kang Mathan 4-3-2 Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic IPACK2017-74015
Kang Kumar 9-2-1 BGA-Geometry IPACK2017-74403
Kao Sukhvinder 4-1-1 IPACK2017-74153
Kaplar Sukhvinder 4-1-2 Rack-Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74110
Kaplar Tsung-Ting 6-1-1 Variable Pumping For Centralized Coolant System IPACK2017-74427
Kapusta Robert 6-2-1 Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74428
Kara Robert 4-1-3 Variable Pumping For Centralized Coolant System IPACK2017-74125
Kardemir Christopher 2-1-4 Transient and Steady State Thermal Response of a System with Thermoelectric IPACK2017-74184
Kasukurthy Dogacan 2-1-2 Coolers IPACK2017-74019
kathait Ertugrul 2-3-2 Track 2 - Panel IPACK2017-74119
Kaulgud Rajesh 2-1-1 IPACK2017-74207
Kaur Pawan Singh 4-4-1 Thermal Characterization of GaN based Vertical Power Electronic Devices IPACK2017-74418
Kawakami Pavan 1-3-3 IPACK2017-74099
Kawakami Sumanjeet 6-1-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74094
Keblinski Takashi 1-2-3 High Electron Mobility Transistor IPACK2017-74204
Kelestemur Takashi 3-2-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74178
Keller Pawel 2-3-1 High Electron Mobility Transistor IPACK2017-74122
Kempe Yusuf 4-3-1 POL-kw Modules for High Power Applications IPACK2017-74296
Kempe Jürgen 8-4-1 IPACK2017-74343
Kenny Michael 5-7-2 Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs with SiO2 IPACK2017-74056
Keontaek Michael 1-5-1 Passivation IPACK2017-74026
Khalili Thomas 2-2-2 Thermo-Mechanical Study of AlN Thin Films as Heat Spreaders in III-V Photonic IPACK2017-74105
Khalili Kang 2-2-2 Devices IPACK2017-74339
Khanna Sadegh 4-1-2 NiyanTron - An Approach to Develop a Control System App for Data Center IPACK2017-74171
Kharangate Sadegh 2-2-2 Cooling IPACK2017-74188
Sumeer Experimental Investigation of Parameters Affecting Performance of Pulsating Heat
Chirag pipes
Thermal Mixing of Ambient Air and Return Air Streams in a Mixing Chamber for
Data Center Cooling 8855
In-Situ Thermal Characterization of Lithium-Ion Batteries

Stress-based Design Standard for 3216 Type of Multilayer Ceramic Capacitor

A Study on Low Cycle Fatigue Test with Hourglass Test Piece for Lead-Free Solder
Material
Heat and Interfaces in Electronic Materials

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with
Embedded Fluid Channels
Quantifying Water Vapor Transmission Rates through Barriers and Edge Seals for
Photovoltaic and Other Demanding Applications
Packaging Needs and Considerations for Photovoltaic Modules

Three-dimensional Flow and Heat Transfer Simulation of a MEMS-based Thermal
Accelerometer
Large Flip Chip Assembly Challenges and Risk Mitigation Process

Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi-
ronment
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Thermal Design Optimization of novel "contact" structure for Heat Removal in
Semiconductor Power Amplifiers (PAs)
CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air
Cooling Systems