Page 81 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Goodson Kenneth 6-1-1 IPACK2017-74167
Goodson Kenneth 6-1-1 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74189
Goodson Kenneth 7-6-2 for use in Power Electronics IPACK2017-74454
Goorsky Mark 1-7-2 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74175
Goorsky Mark 4-1-3 Cooling Systems IPACK2017-74163
Goorsky Mark 6-1-1 MetaMaterials for Thermal Management IPACK2017-74167
Gordon Scott 3-2-1 IPACK2017-74314
Goyal Kartik 3-2-1 Micron Scale Spatial Resolution of the Thermal Conductivity across Grain IPACK2017-74264
Goyal Kartik 6-1-1 Boundaries of Bulk Diamond Using Time-Domain Thermoreflectance IPACK2017-74267
Graham Samuel 3-3-1 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74143
Graham Samuel 3-2-1 use in Electronics Thermal Management IPACK2017-74146
Graham Samuel 4-1-5 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74235
Graham Samuel 4-4-2 for use in Power Electronics IPACK2017-74244
Graham Samuel 4-1-3 Polyester Film Substrates for Flexible Electronics IPACK2017-74152
Graham Samuel 4-1-3 IPACK2017-74163
Graham Samuel 5-4-1 Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed IPACK2017-74149
Graham Samuel 6-1-1 Circuit Board Using X-Ray Micro-CT IPACK2017-74151
Graham Samuel 6-1-1 Deformation and Warpage of the Double-Sided Flexible Printed Circuit BGA IPACK2017-74167
Greve Hannes 4-2-1 Assemblies Through Reflow Using DIC IPACK2017-74138
Gromala Przemyslaw 3-3-2 ALD Barrier Films for Protecting Electronics in Harsh Environments IPACK2017-74058
Gromala Przemyslaw 5-5-1 IPACK2017-74307
Gromala Przemyslaw 5-7-2 Mechanical Reliability of PECVD SiNx Barrier Films for Flexible Electronics IPACK2017-74200
Gromala Przemyslaw 5-7-2 IPACK2017-74104
Gu Yuan 1-4-1 Integrated Substrate - Cold Plate for Compact Power Electronics Modules IPACK2017-74210
Guhe Abhishek 2-1-1 IPACK2017-74207
Gupta Aditya 2-1-3 Optimization of Graphite Composite Latent Heat Storage Systems IPACK2017-74254
Gupta Aditya 6-1-1 IPACK2017-74433
Ha Gihong 6-1-1 Impact of Buffer Layers on the Reliability of GaN on Si HEMTs for Power IPACK2017-74206
Haegel Nancy 4-3-2 Electronics IPACK2017-74248
Hall George 1-7-3 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74080
use in Electronics Thermal Management
Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond
for use in Power Electronics
Prediction and Mitigation of Vertical Cracking in High-Temperature Transient
Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
Piezoresistive Silicon Stress Sensor as a Tool To Monitor Health of an Electronic
System
Novel PHM Concept for Future Use in Safety Relevant Electronics for Harsh
Environment
Development of Multi-chip Power Package Supported by Simulation Driven
Design
Modeling Thermo-Mechanically Driven Fracture Processes in Bulk Mold Material
of Electro Mechanical Components
Aerosol-Jet Printed Fillets for Well-Formed Electrical connections Between
Different Leveled Surfaces
Thermal Mixing of Ambient Air and Return Air Streams In A Mixing Chamber for
Data Center Cooling
CFD Optimization of the Cooling of Yosemite Open Compute Server

CFD Optimization of the cooling of Yosemite Open Compute Server

Preload Effect of Ultrasonic Wire Bonding Transducers with Impedance Analysis
Using Butterworth-van Dyke Circuit Model and Finite Element Method
Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

State of the Art of Electronics Cooling for Radar Antenna Applications

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