Page 79 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Elzouka Mahmoud 6-1-1 IPACK2017-74429
Enright Ryan 2-1-4 Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across IPACK2017-74184
Enright Ryan 2-1-4 Variable Nano/Micro Gap IPACK2017-74181
Enright Ryan 6-2-1 Thermo-Mechanical Study of AlN Thin Films as Heat Spreaders in III-V Photonic IPACK2017-74217
Erdem E. Yegan 3-2-1 Devices IPACK2017-74178
Fahim Abdullah 1-5-1 Thermo-optic Tuning Efficiency of Micro Ring Resonators on Low Thermal IPACK2017-74270
Fahim Abdullah 6-1-1 Resistance Silicon Photonics Substrates IPACK2017-74237
Faili Firooz 4-1-3 Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74163
Faili Firooz 6-1-1 Fabrication by Template-Assisted Electrochemical Deposition IPACK2017-74167
Farokhnia Nazanin 4-1-5 Silica Nanoparticle Formation by Using Droplet-Based Microreactor IPACK2017-74139
Fernandes John Edward 2-1-3 IPACK2017-74288
Fernandes John Edward 6-1-1 Measurement of Elevated Temperature Mechanical Properties of Intermetallic IPACK2017-74434
Fiorentino Marco 2-1-4 Compounds in SAC Solder Joints IPACK2017-74337
Foong Chee S 1-6-1 Characterization of IMCs in Sn-Ag-Cu Solder Joints using Nanoindentation IPACK2017-74173
FORBUS JEFF 1-3-2 IPACK2017-74265
FORBUS JEFF 6-1-1 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74430
Foulkes Thomas 2-3-2 use in Electronics Thermal Management IPACK2017-74154
Freitag Karl 1-7-3 Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond IPACK2017-74080
Fresne David 1-6-1 for use in Power Electronics IPACK2017-74222
Fried Simon 3-4-1 Decoupled Hierarchical Structures for High-Heat Flux Cooling Systems IPACK2017-74358
Frizzell Ronan 6-2-1 IPACK2017-74217
Fu Nianjun 1-3-1 Impact of Static Pressure Differential between Supply Air and Return Exhaust on IPACK2017-74263
Fu Nianjun 1-2-1 Server Level Performance IPACK2017-74121
Fu Nianjun 1-5-1 Impact of Static Pressure Differential Between Supply Air and Return Exhaust on IPACK2017-74266
Fu Nianjun 6-1-1 Server Level Performance IPACK2017-74231
Fu Nianjun 6-1-1 Concurrent DWDM Silicon Photonic Interconnect Driven by a Quantum Dot Comb IPACK2017-74241
Fu Yanbao 4-4-1 Laser IPACK2017-74418
Fujisaki Kazuhiro 1-4-1 Preliminary Results on the Fabrication of Interconnect Structures Using Microscale IPACK2017-74059
Fujisaki Kazuhiro 1-4-1 Selective Laser Sintering IPACK2017-74092
Funaki Masahiro 1-3-3 Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4 IPACK2017-74099
Printed Circuit Boards
Reliability Assessment of Solder Joint Using BGA Package - Megtron 6 Versus FR4
Printed Circuit Boards
Steerable Jumping-Droplet Phase-Change Electronics Cooling

State of the Art of Electronics Cooling for Radar Antenna Applications

Numerical and Experimental Determination of Temperature Distribution in 3D
Stacked Power Devices
Accelerating development of PCBs by 3D printing circuits.

Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition
Effects of Fatigue Cycling on the Microstructure of SAC305 Lead Free Solder

Effects of Aging on the Microstructural Evolution of Lead Free SACN05 and
Doped SAC Alloys
Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead
Free Solder
The Effects of Aging on the Cyclic Stress-Strain Behavior and Hysteresis Loop
Evolution of SAC+X Solder Materials
Quantitative Analysis of Aging Induced Evolution of IMCs in SAC305 Lead Free
Solder
In-Situ Thermal Characterization of Lithium-Ion Batteries

Analysis for Evaluation of Threshold Current Density of Electromigration Damage
in Taper-shaped Metal Line
Relationship between threshold current density of electromigration damage
considering void and hillock formation and reservoir shape in interconnect line
Stress-based Design Standard for 3216 type of Multilayer Ceramic Capacitor

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