Page 80 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Gaitonde Aalok 4-4-2 Thermal Transport in Lithium Ion Battery Cells IPACK2017-74236

Galligan Craig P. 6-1-1 Micro-Packaging Platform for Hermetic, Wireless, Implantable Neural Recording IPACK2017-74375
Ganore Bhagyashree 4-4-2 Systems IPACK2017-74236

Thermal Transport in Lithium Ion Battery Cells

García Javier 6-2-1 Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and IPACK2017-74217
Fernández Jacquelynn 1-4-1 Fabrication by Template-Assisted Electrochemical Deposition IPACK2017-74306

Garofano Challenges in 3D Printing of High Conductivity Copper

Gaskins John 1-7-1 Thermal Boundary Resistance-Limited Performance of High-Frequency IPACK2017-74309
Vadim 2-3-1 Photodiodes IPACK2017-74180
Gektin Patricia 10-3-1 Experimental Characterization of Cold Plates used in Cooling Multi Chip Server IPACK2017-74445
Hadi 4-1-5 Modules (MCM) IPACK2017-74139
Gharago- Dr. Patricia E. Gharagozloo - Sandia National Laboratories
zloo
Ghasemi Decoupled Hierarchical Structures for High-Heat Flux Cooling Systems

Giri Ashutosh 1-7-1 Thermal Boundary Resistance-Limited Performance of High-Frequency IPACK2017-74309
Ashutosh 1-7-2 Photodiodes IPACK2017-74310
Giri Kyle 4-4-2 Thermal Conductivity Measurements of Non-metals via Combined Time- and IPACK2017-74244
Kyle 4-3-2 Frequency-domain Thermoreflectance without a Metal Film Transducer IPACK2017-74243
Gluesen- Stephen 4-3-2 Optimization of Graphite Composite Latent Heat Storage Systems IPACK2017-74248
kamp
Gluesen- Thermoelectric clothes dryer development and performance evaluation
kamp
Glynn Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

GONZALEZ DAVID 1-7-3 Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Tempera- IPACK2017-74224
CUADRADO David 4-4-1 ture Sensor Location in Microchips IPACK2017-74118
David 6-1-1 IPACK2017-74419
Gonza- Kenneth 1-2-1 Voiding Effects on the Thermal Response of Metallic Phase Change Materials IPACK2017-74090
lez-Nino Under Pulsed Power Loading

Gonza- Voiding Effects on the Thermal Response of Metallic Phase Change Materials
lez-Nino Under Pulsed Power Loading

Goodson Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Goodson Kenneth 1-7-2 Micron Scale Spatial Resolution of the Thermal Conductivity across Grain IPACK2017-74175
Goodson Kenneth 2-2-1 Boundaries of Bulk Diamond Using Time-Domain Thermoreflectance IPACK2017-74088

Comprehensive Modeling of Single Bubble Evaporation in Microchannel

Goodson Kenneth 2-2-2 CFD Optimization of 3D Manifolds for Enhanced Performance of Forced Air IPACK2017-74188
Goodson Kenneth 2-3-2 Cooling Systems IPACK2017-74014
Goodson Kenneth 4-1-3 IPACK2017-74163
Goodson Kenneth 4-1-4 Experimental Study of Single/Two-Phase Heat Transfer for 3D-Chip Embedded IPACK2017-74008
Goodson Kenneth 5-7-2 Cooling with Micro-Pin-Fin Arrays IPACK2017-74056
Goodson Kenneth 6-1-1 IPACK2017-74009
Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for
Goodson Kenneth 6-1-1 use in Electronics Thermal Management IPACK2017-74050
Goodson Kenneth 6-1-1 IPACK2017-74089
Thermofluidic Characterization of An "Embedded Microchannel-3D manifold"
Cooling Module for High Heat Flux (1 kW/cm2) Power Electronics Application

Three-dimensional Flow and Heat Transfer Simulation of a MEMS-based Thermal
Accelerometer

Overcoming Challenges in Microfabrication of Si and SiC-based ?Embedded
Microchannel-3D manifold? Cooling Module for High Heat Flux (1 kW/cm2) Power
Electronics Application

Thermal Conductance of Ultrathin CoFeB and MgO films in Magnetic Tunnel
Junction Characterized by Picosecond Time-domain Thermoreflectance

Enhanced Boiling Performance in Hierarchical bi-Porous Surfaces

Goodson Kenneth 6-1-1 CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher- IPACK2017-74120
moelectric Generator (µTEG) Devices

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