Page 82 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Hamann Hendrik 3-3-1 Monitoring Fugitive Methane Gas Emission from Natural Gas Pads IPACK2017-74191

Hamann Hendrik 3-3-2 A Robust Low-cost Particulate Sensing System IPACK2017-74225

Hamann Hendrik 8-3-1 Big Data Gets Physical: Structural and Physical Health Monitoring During the Age IPACK2017-74365
Hamasha Sa'd 1-3-1 of IoT IPACK2017-74263

Effects of Fatigue Cycling on the Microstructure of SAC305 Lead Free Solder

Han Bongtae 1-3-3 Effect of Underfill on Thermo-Mechanical Behavior of Fan-out WLP: An Experi- IPACK2017-74048

mental Study by Advanced Moiré Interferometry

Han Bongtae 1-3-3 Statistical Model Calibration for Semiconductor Packages with a Large Number of IPACK2017-74071

Input Variables by Approximate Integration Method with Advanced Objective

Function

Han Bongtae 3-3-2 Piezoresistive Silicon Stress Sensor as a Tool To Monitor Health of an Electronic IPACK2017-74058

System

Han Bongtae 5-5-1 Tail-End Probability Prediction of Solder Joint Reliability for Semiconductor IPACK2017-74070

Packages with a Large Number of Input Variables by Advanced Approximate

Integration Method

Han Bongtae 5-7-2 Crack Detection in Flexible Cables Using Time-Domain Reflectometry IPACK2017-74047

Han Bongtae 9-5-1 Next-Generation Automotive Electronics: Reliability Challenges IPACK2017-74396

Han Chang Woo 4-1-4 Design of the Cooling Device with Heat Pipes For Power Electronics Cooling IPACK2017-74164

Han Chang Woo 4-1-4 Performance Enhancement of a Heat Pipe for Power Electronics Cooling with a IPACK2017-74095
Han Ru 5-5-2 Partially Applied Hybrid Wick IPACK2017-74194
Hao Menglong 5-4-1 IPACK2017-74305
Hassan Km Rafidh 5-7-1 BGA Temperature Cycling Reliability in Automotive Applications: Knowledge IPACK2017-74272
Based Qualification

Regulating Battery Temperature Using a Passive Thermal Switch Based on Shape
Memory Alloys

The Poisson's Ratio of Lead Free Solder and its Effect on Solder Joint Reliability

Hassan Km Rafidh 6-1-1 Finite Element and Experimental Study of the Influence of Poisson?s Ratio on the IPACK2017-74238
Hata Hanae 6-1-1 Reliability of SAC Lead Free Solders IPACK2017-74036
Hatao Takuya 1-3-3 IPACK2017-74041
Hauck Torsten 5-4-1 Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point IPACK2017-74096
Hauck Torsten 5-7-2 Joint Using Sn-57Bi-1Ag IPACK2017-74073
Hayama Yutaka 4-1-3 IPACK2017-74176
Hayashibe Shingo 6-2-1 Reliability Evaluation of an Interface between Encapsulation Resin and Substrate IPACK2017-74428
for Power Devices During Thermal Cycle Test

Electro-Thermal Simulation of Interconnected Systems at Transient Operating
Conditions

Methods for Theoretical Assessment of Delamination Risks in Electronic
Packaging

Effect of Material Non-linearity on Thermal Fatigue Reliability for Aluminum Wire
Bonds of Power Module

POL-kw Modules for High Power Applications

He Zhizhu 4-4-1 Numerical Investigation of Low Melting Point Metal Based Latent Thermal Energy IPACK2017-74103
He Zhizhu 6-1-1 Storage System IPACK2017-74102
Hedge Alan 1-7-3 IPACK2017-74179
Experimental Evaluation on Cooling Capacity of Electrically Driven Hybrid Liquid
Metal and Water Cooling

The Effect of Surface Texture on Thermal Sensation and Comfort

Hegde Sudarshan 2-2-1 Mechanical behavior of Thermal Interface Materials in electronic components IPACK2017-74021
Herrlin Magnus 8-2-1 under dynamic loading conditions IPACK2017-74384

Immersion Cooling of Electronics and Related Data Center Research at LBNL

Hersam Mark 1-2-2 Processing and Applications of Two-Dimensional Nanomaterial Inks IPACK2017-74166

Hesketh Peter 3-3-1 Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas IPACK2017-74069
Sensors
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