Page 87 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
komasu yuichiro 1-5-1 IPACK2017-74010
Kong Daeyoung 6-1-1 Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for IPACK2017-74091
Kothari Nakul 3-3-1 Bump-Wafer IPACK2017-74269
Kothari Nakul 6-1-1 IPACK2017-74271
Kousaka Tasuku 6-1-1 Thermal Performance Evaluation and Design Optimization of Full Geometries of IPACK2017-74094
Koyama Shinji 6-1-1 Manifold Microchannel Heat Sinks IPACK2017-74032
Koyama Shinji 6-1-1 IPACK2017-74036
Koyama Shinji 6-1-1 Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock IPACK2017-74035
Koyama Shinji 6-1-1 using X-ray Digital Volume Correlation IPACK2017-74038
Kshirsagar Chinmay 2-1-4 IPACK2017-74260
Kshirsagar Chinmay 6-1-1 Finite Element Modeling Creation from X-ray Micro-CT Data for Fuze Assemblies IPACK2017-74431
Kuczynska Marta 5-7-1 IPACK2017-74416
A Study on Low Cycle Fatigue Test with Hourglass Test Piece for Lead-Free Solder
Kulkarni Devdatta 2-1-2 Material IPACK2017-74055
Kumar Satish 3-3-1 IPACK2017-74069
Kumar Satish 6-1-1 Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its IPACK2017-74049
Kwak Joon Seop 4-1-4 Degradation Mechanism under Aging IPACK2017-74155
Kwak Joon Seop 5-7-2 IPACK2017-74156
Kwon Heungdong 5-7-2 Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point IPACK2017-74056
Kwon Heungdong 6-1-1 Joint Using Sn-57Bi-1Ag IPACK2017-74120
Lakhera Nishant 5-7-2 IPACK2017-74073
Lalau Keraly Christopher 3-3-2 Change in Chemical Structure of Structural Adhesive under High Temperature and IPACK2017-74150
Lall Pradeep 1-3-1 Humidity Conditions IPACK2017-74233
Lall Pradeep 1-3-1 IPACK2017-74263
Lall Pradeep 1-1-1 Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene IPACK2017-74252
Lall Pradeep 1-2-1 Glycol with Rust Inhibitor IPACK2017-74121
Lall Pradeep 1-2-1 IPACK2017-74261
Lall Pradeep 1-5-1 Rack-Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With IPACK2017-74266
Lall Pradeep 1-5-1 Variable Pumping For Centralized Coolant System IPACK2017-74270
Lall Pradeep 3-2-1 IPACK2017-74232
Rack Level Study Of Hybrid Cooled Servers Using Warm Water Cooling With
Variable Pumping For Centralized Coolant System

Towards Improvement of Lifetime Prediction of Solder Joints under Field
Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic
BGA-Geometry

Improvement in Server Compute Performance Using Advanced Air Cooled
Thermal Solutions

Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas
Sensors

Effect of Environment on Carbon Nanotube Thin Film Transistors based Gas
Sensors

Thermal Management of Large Periphery Gallium Nitride Power Electronics Using
3-D Multi-Metallization Structures

Integrated Temperature Mapping of Gallium Nitride Micro-LED Arrays

Three-dimensional Flow and Heat Transfer Simulation of a MEMS-based Thermal
Accelerometer

CFD Modeling and Optimization of Fin Array Packaging Solutions for MicroTher-
moelectric Generator (µTEG) Devices

Methods for Theoretical Assessment of Delamination Risks in Electronic
Packaging

RF Energy Harvesting Peel-and-Stick Sensors

Effect of Alloy Composition and Aging on the Survivability of Lead Free Solders in
High Temperature Vibration in Automotive Environments

Effects of Fatigue Cycling on the Microstructure of SAC305 Lead Free Solder

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and
Performance of MEMS microphone

Effects of Aging on the Microstructural Evolution of Lead Free SACN05 and
Doped SAC Alloys

Mechanical Characterization of Solder Mask at Different Temperatures

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead
Free Solder

Measurement of Elevated Temperature Mechanical Properties of Intermetallic
Compounds in SAC Solder Joints

Design and Development of Biometric Sensor Wearable Band using Flexible
Electronics

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