Page 74 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Battaglia Vince 4-4-1 In-Situ Thermal Characterization of Lithium-Ion Batteries IPACK2017-74418

Beausoleil Raymond 2-1-4 Concurrent DWDM Silicon Photonic Interconnect Driven by a Quantum Dot Comb IPACK2017-74337
Becker Ulrich 5-7-1 Laser IPACK2017-74416

Benedict Michael 4-3-1 Towards Improvement of Lifetime Prediction of Solder Joints under Field IPACK2017-74147
Bennion Kevin 5-5-2 Conditions: Accelerated Thermo-Mechanical Fatigue Measurement on Realistic IPACK2017-74215
BGA-Geometry

High Performance Microchannels Development Using Magnetic Stabilizationliza-
tion

Continuous Lifetime Estimation of Vehicle Power Electronics

Benyeda Jason 6-1-1 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74375
Berrigan John D. 3-4-1 Systems IPACK2017-74311

Printed Electronics for Aerospace Applications

BEYNE Eric 9-1-1 Eric Beyne IPACK2017-74439

Bhavnani Sushil 2-3-1 Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid IPACK2017-74025
Bhavnani Sushil 6-1-1 Immersion Cooled Server Model IPACK2017-74340

Liquid Immersion Cooling: A Smarter Path to Data Center Thermal Management

Birbarah Patrick 2-3-2 Steerable Jumping-Droplet Phase-Change Electronics Cooling IPACK2017-74154

Boo Joon Hong 4-1-4 Design of the Cooling Device with Heat Pipes for Power electronics cooling IPACK2017-74164

Boo Joon Hong 4-1-4 Performance Enhancement of a Heat Pipe for Power Electronics Cooling with a IPACK2017-74095
Booth Samuel 4-3-2 Partially Applied Hybrid Wick IPACK2017-74248

Role of Packaging in Enabling High Specific Power and Flexible Photovoltaics

Borca-Tasci- Theodorian 1-2-3 Novel Approaches to Measuring and Controlling the Thermal Properties of IPACK2017-74330
uc David A. 6-1-1 Nanomaterials IPACK2017-74375
Borton Lauren M. 4-4-1 IPACK2017-74118
Lauren M. 4-1-5 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74132
Boteler Systems

Boteler Voiding Effects on the Thermal Response of Metallic Phase Change Materials
Under Pulsed Power Loading

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Boteler Lauren M. 4-1-2 Power Packaging Thermal and Stress Model for Quick Parametric Analyses IPACK2017-74130

Boteler Lauren M. 6-1-1 Voiding Effects on the Thermal Response of Metallic Phase Change Materials IPACK2017-74419
Bougher Thomas 4-1-3 Under Pulsed Power Loading IPACK2017-74163
Bougher Thomas 6-1-1 IPACK2017-74167
Branton Steve 2-1-2 Investigation of the Heterogeneous Thermal Conductivity Bulk CVD Diamond for IPACK2017-74028
Branton Steve 9-2-1 use in Electronics Thermal Management IPACK2017-74402

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond
for use in Power Electronics

Characterization of an Isolated Hybrid Cooled Server with Failure Scenarios Using
Warm Water Cooling

Panel - Track 2

Braun Jeffrey 1-7-1 Thermal Boundary Resistance-limited Performance of High-frequency Photodi- IPACK2017-74309
Jeffrey 1-7-2 odes IPACK2017-74310
Braun Douglas 2-3-1 IPACK2017-74122
Thomas 2-3-1 Thermal Conductivity Measurements of Non-metals via Combined Time- and IPACK2017-74122
Bremner Andrew 2-2-2 Frequency-domain Thermoreflectance without a Metal Film Transducer IPACK2017-74105

Brunschwil- Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with
er Embedded Fluid Channels
Calder
Dual-Side Heat Removal by Micro-Channel Cold Plate and Silicon-Interposer with
Embedded Fluid Channels

Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi-
ronment

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