Page 72 - ASME InterPACK 2017 Program

Authors Index

LAST NAME FIRST NAME SESSION PAPER TITLE PAPER NUMBER
Ahmed Sudan 6-1-1 IPACK2017-74228
Ahmed Sudan 6-1-1 Effects of Test Temperature and Prior Aging Conditions on the Creep Properties of IPACK2017-74237
SAC305 Solder Joints
Characterization of IMCs in Sn-Ag-Cu Solder Joints using Nanoindentation

Ahuja Nishi 2-1-2 An Advanced Energy Efficient Rack Server Design with Distributed Battery IPACK2017-74033
Ahuja Sandeep 2-1-2 Subsystem IPACK2017-74055
aizawa kazuto 1-5-1 IPACK2017-74010
Akinsinde Lewis 6-2-1 Improvement in Server Compute Performance Using Advanced Air Cooled IPACK2017-74217
Alam Mohammad 5-2-1 Thermal Solutions IPACK2017-74253

Investigation of peeling behavior of UV curable pressure sensitive adhesive for
bump-wafer

Integrated Micro-Thermoelectric Cooling for Silicon Photonics: Modeling and
Fabrication by Template-Assisted Electrochemical Deposition

High Temperature Mechanical Behavior of Lead Free Solders

Alam Mohammad 6-1-1 Mechanical Behavior of Lead Free Solders at High Temperatures IPACK2017-74229

ALAPATI RAMA 9-1-1 Rama Alapati IPACK2017-74440

Aleksov Aleksandar 6-2-1 Mechanical Testing for Stretchable Electronics IPACK2017-74185

Alissa Husam A. 2-1-1 Transient Thermal Performance of Rear Door Heat Exchanger with Local IPACK2017-74148
Husam A. 2-2-2 Contained Cold Aisle During Water Side Failures IPACK2017-74105
Alissa Sami 2-1-2 IPACK2017-74174
Sami 2-3-1 Comparison and Evaluation of Different Monitoring Methods in a Data Center Envi- IPACK2017-74180
Alkharab- Andrew 4-1-2 ronment IPACK2017-74110
sheh Andrew 6-1-1 IPACK2017-74427
Alkharab- Fatima 9-6-1 Cooling Failure in Direct Liquid Cooling System (DLCS) IPACK2017-74423
sheh
Allerman Experimental Characterization of Cold Plates used in Cooling Multi Chip Server
Modules (MCM)
Allerman
Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
Alleyne High Electron Mobility Transistor

Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel
High Electron Mobility Transistor

Women in STEM Education Panel (Fatima Alleyne)

Alvarez Xavier 1-7-3 Quasi Ballistic Thermal Transport in InGaAs Alloy IPACK2017-74360

Alvarez Xavier 6-1-1 Sub-diffraction Thermoreflectance Imaging ofNnanoscale Metal Interconnects IPACK2017-74361

Amalfi Raffaele Luca 2-1-1 Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for IPACK2017-74020
Amalfi Raffaele Luca 2-1-1 Electronics: Experimental Analysis IPACK2017-74030
Amberg Mark 5-4-1 IPACK2017-74344
Ando Tetsuya 6-1-1 Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, IPACK2017-74038
Antoniadis Homer 3-4-1 Modeling and Simulations IPACK2017-74382

Phase Change Material (PCM) Based Thermal Management for Lithium Ion
Batteries

Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene
Glycol with Rust Inhibitor

Printed Metallization for Consumer Electronic Applications

Arai Tadashi 6-2-1 POL-kw Modules for High Power Applications IPACK2017-74428

Arakere Guru 1-3-1 Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in IPACK2017-74082
BGA Components

Armstrong Andrew 4-1-2 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74110
High Electron Mobility Transistor

Armstrong Andrew 6-1-1 Thermal Characterization and Modeling of an Ultra-Wide Bandgap AlGaN Channel IPACK2017-74427
High Electron Mobility Transistor

Ashe Jeffrey M. 6-1-1 Micro-Packaging Platform For Hermetic, Wireless, Implantable Neural Recording IPACK2017-74375
Systems

Asheghi Mehdi 1-2-1 Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer IPACK2017-74090

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