Page 67 - ASME InterPACK 2017 Program
P. 67
FRIDAY, SEPTEMBER 01 Technical Sessions
GEOMETRY EFFECTS ON TWO-PHASE FLOW REGIMES IN A DESIGN OF THE COOLING DEVICE WITH HEAT PIPES FOR
DIABATIC MANIFOLDED MICROGAP CHANNEL POWER ELECTRONICS COOLING
Technical Paper Publication. IPACK2017-74287 Technical Presentation. IPACK2017-74164
David Deisenroth, Avram Bar-Cohen, Michael Ohadi, University of Chang Woo Han, SeungBoong Jeong, Hyosung Corporation, Anyang-si,
Maryland, College Park, MD, United States Gyeonggi-di, Korea (Republic), Joon Hong Boo, Korea Aerospace
University, Goyang-Si, Gyoenggi-Do, Korea (Republic)
CAPILLARY EVAPORATION IN 4-LAYER COPPER MESH
STRUCTURE PERFORMANCE ENHANCEMENT OF A HEAT PIPE FOR POWER
Technical Presentation. IPACK2017-74292 ELECTRONICS COOLING WITH A PARTIALLY APPLIED HYBRID
WICK
Shanshan Xu, Rongfu Wen, Ryan Lewis, Y.C. Lee, Ronggui Yang, Technical Paper Publication. IPACK2017-74095
University of Colorado Boulder, Boulder, CO, United States, Luu Nguyen,
Texas Instruments Inc., Santa Clara, CA, United States Joon Hong Boo, Korea Aerospace University, Goyang-Si, Gyoenggi-Do,
Korea (Republic), Hyun Gon Kim, Apack, Inc., Daejeon, Korea (Republic),
TRACK 4 ENERGY CONVERSION & STORAGE Chang Woo Han, Hyosung Corporation, Anyang-si, Gyeonggi-di, Korea
(Republic)
Track Chair: Sreekant Narumanchi, National Renewable Energy Labora- FABRICATION AND CHARACTERIZATION OF METALLIC PASTE
tory, Golden, CO, United States AS HIGHLY CONDUCTIVE THERMAL INTERFACE MATERIAL
Technical Presentation. IPACK2017-74064
Track Co-Chairs: Lauren M. Boteler, U.S. Army Research Laboratory,
Adelphi, MD, United States, Patrick McCluskey, University of Maryland, Jianbo Tang, Jing Liu, Tsinghua University, Beijing, China, Xi Zhao,
College Park, College Park, MD, United States, Martin Kuball, HH Wills Yuan Zhou, Key Laboratory of Cryogenics, Technical Institute of Physics
Physics Laboratory, Bristol, United Kingdom and Chemistry, Chinese Academy of Sciences, Beijing, China
4-1 TRACK 8 TECHNOLOGY TALKS
POWER ELECTRONICS WIDE BAND GAP
SEMICONDUCTORS, PACKAGING, MODULE ASSEMBLY Track Chair: Samuel Graham, Georgia Institute of Technology, Lithonia,
AND THERMAL MANAGEMENT GA, United States
4-1-4 Track Co-Chair: Kaustubh Nagarkar, GE Global Research Center,
Niskayuna, NY, United States
POWER ELECTRONICS THERMAL MANAGEMENT - II
8-1
Second Floor, Montgomery 7:30am – 9:00am TRACK 1 - TECHNOLOGY TALKS
Session Chair: Chirag Kharangate, Stanford, Stanford, CA, United States
Session Co-Chair: Douglas DeVoto, National Renewable Energy 8-1-1
Laboratory, Golden, CO, United States
THERMAL MANAGEMENT OF LARGE PERIPHERY GALLIUM ENHANCING THERMAL TRANSPORT AT MATERIAL INTERFACES
NITRIDE POWER ELECTRONICS USING 3-D MULTI-METALLIZA-
TION STRUCTURES Second Floor, Washington 7:30am – 9:00am
Technical Presentation. IPACK2017-74155 Session Chair: Samuel Graham, Georgia Institute of Technology, Lithonia,
GA, United States
James Spencer Lundh, Bikramjit Chatterjee, James Dallas, Sukwon Session Co-Chair: Kaushik Mysore, Advanced Micro Devices, Austin, TX, 6677
Choi, Pennsylvania State University, University Park, PA, United States, United States
Tae Kyoung Kim, Moon Uk Cho, Joon Seop Kwak, Sunchon National
University, Suncheon, Korea (Republic) MANIPULATING INTERFACIAL THERMAL TRANSPORT USING
SURFACE CHEMISTRY
THERMOFLUIDIC CHARACTERIZATION OF AN “EMBEDDED Keynote Presentation. IPACK2017-74389
MICROCHANNEL-3D MANIFOLD” COOLING MODULE FOR
HIGH HEAT FLUX (1 KW/CM2) POWER ELECTRONICS APPLICA- Ravi Prasher, Lawrence Berkeley National Lab, Berkeley, CA, United
TION States
Technical Presentation. IPACK2017-74008
INTERFACIAL IMPERFECTION EFFECTS ON THERMAL
Ki Wook Jung, Mehdi Asheghi, Kenneth Goodson, Chirag Kharangate, BOUNDARY RESISTANCE IN ELECTRONIC MATERIALS AND
James Palko, Stanford University, Menlo Park, CA, United States, DEVICES
Hyoungsoon Lee, Chung-Ang University, Seoul, Korea (Republic), Feng Keynote Presentation. IPACK2017-74390
Zhou, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States Patrick Hopkins, University of Virginia, Charlottesville, VA, United States
