Page 65 - ASME InterPACK 2017 Program
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THURSDAY, AUGUST 31 Technical Sessions
HIGH STRAIN-RATE STRESS-STRAIN BEHAVIOR OF SAC305 CFD MODELING AND OPTIMIZATION OF FIN ARRAY PACKAG-
SOLDERS OPERATING AT AUTOMOTIVE UNDERHOOD ING SOLUTIONS FOR MICROTHERMOELECTRIC GENERATOR
TEMPERATURES (ΜTEG) DEVICES
Poster Presentation. IPACK2017-74247 Poster Presentation. IPACK2017-74120
Pradeep Lall, Di Zhang, Jeffrey Suhling, Auburn University, Auburn, AL, Qizhan Tam, Heungdong Kwon, Rahul Kini, Mehdi Asheghi, Kenneth
United States, David Locker, US Army RDECOM, Huntsville, AL, United Goodson, Stanford University, Stanford, CA, United States, Marc Dunham,
States Analog Devices, San Jose, CA, United States, Jane Cornett, Baoxing
Chen, Analog Devices, Wilmington, MA, United States
MEASUREMENTS OF CU-AL INTERMETALLIC POLARIZATION
CURVES FOR MODELING OF CORROSION MULTIPHYSICS IN INVESTIGATION OF THE HETEROGENEOUS THERMAL
COPPER-ALUMINUM WIREBONDS CONDUCTIVITY IN BULK CVD DIAMOND FOR USE IN POWER
Poster Presentation. IPACK2017-74326 ELECTRONICS
Poster Presentation. IPACK2017-74167
Pradeep Lall, Yihua Luo, Auburn University, Auburn, AL, United States,
Luu Nguyen, Texas Instruments Inc., Santa Clara, CA, United States Luke Yates, Zhe Cheng, Thomas Bougher, Georgia Institute of Technolo-
gy, Atlanta, GA, United States, Ramez Cheaito, Aditya Sood, Mehdi
FINITE ELEMENT AND EXPERIMENTAL STUDY OF THE INFLU- Asheghi, Kenneth Goodson, Stanford University, Stanford, CA, United
ENCE OF POISSON’S RATIO ON THE RELIABILITY OF SAC States, Mark Goorsky, University of California, Los Angeles, Los Angeles,
LEAD FREE SOLDERS CA, United States, Firooz Faili, Daniel Twitchen, Element Six Technolo-
Poster Presentation. IPACK2017-74238 gies, Santa Clara, CA, United States, Samuel Graham, Georgia Institute of
Technology, Lithonia, GA, United States
Km Rafidh Hassan, Jeffrey Suhling, Pradeep Lall, Auburn University,
Auburn, AL, United States CFD OPTIMIZATION OF 3D MANIFOLDS FOR ENHANCED
PERFORMANCE OF FORCED AIR COOLING SYSTEMS
OVERCOMING CHALLENGES IN MICROFABRICATION OF SI Poster Presentation. IPACK2017-74189
AND SIC-BASED “EMBEDDED MICROCHANNEL-3D MANI-
FOLD” COOLING MODULE FOR HIGH HEAT FLUX (1 KW/CM2) William Libeer, Chirag Kharangate, Srilakshmi Lingamneni, James
POWER ELECTRONICS APPLICATION Palko, Mehdi Asheghi, Kenneth Goodson, Stanford University, Stanford,
Poster Presentation. IPACK2017-74009 CA, United States
Ki Wook Jung, Chirag Kharangate, James Palko, Mehdi Asheghi, CFD OPTIMIZATION OF THE COOLING OF YOSEMITE OPEN
Kenneth Goodson, Stanford University, Stanford, CA, United States, COMPUTE SERVER
Hyoungsoon Lee, Chung-Ang University, Seoul, Korea (Republic), Feng Poster Presentation. IPACK2017-74433
Zhou, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States Aditya Gupta, Dereje Agonafer, University of Texas at Arlington,
Arlington, TX, United States, Ananthavijayan Sridhar, Future Facilities Inc.,
THERMAL CONDUCTANCE OF ULTRATHIN COFEB AND MGO San Jose, CA, United States
FILMS IN MAGNETIC TUNNEL JUNCTION CHARACTERIZED BY
PICOSECOND TIME-DOMAIN THERMOREFLECTANCE IMPACT OF STATIC PRESSURE DIFFERENTIAL BETWEEN
Poster Presentation. IPACK2017-74050 SUPPLY AIR AND RETURN EXHAUST ON SERVER LEVEL
PERFORMANCE
Noriyuki Sato, Ramez Cheaito, Robert M White, Mehdi Asheghi, , Poster Presentation. IPACK2017-74434
Kenneth Goodson, Shan Wang, Stanford University, Stanford, CA, United
States Ashwin Siddarth, Richard Eiland, John Edward Fernandes, Dereje
Agonafer, University of Texas at Arlington, Arlington, TX, United States
ENHANCED BOILING PERFORMANCE IN HIERARCHICAL
BI-POROUS SURFACES LIQUID IMMERSION COOLING: A SMARTER PATH TO DATA
Poster Presentation. IPACK2017-74089 CENTER THERMAL MANAGEMENT
Poster Presentation. IPACK2017-74340
Hyoungsoon Lee, Chung-Ang University, Seoul, Korea (Republic),
Tanmoy Maitra, University College London, London, United Kingdom, Sriram Chandrasekaran, Sushil Bhavnani, Auburn University, Auburn, AL,
James Palko, Chi Zhang, Mehdi Asheghi, Kenneth Goodson, Stanford United States
University, Stanford, CA, United States, Michael T. Barako, NG Next,
Northrop Grumman Aerospace Systems, Redondo Beach, CA, United
States
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