Page 62 - ASME InterPACK 2017 Program
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Technical Sessions THURSDAY, AUGUST 31
SUB-DIFFRACTION THERMOREFLECTANCE IMAGING OF RELIABILITY ASSESSMENT OF SOLDER JOINT USING BGA
NANOSCALE METAL INTERCONNECTS PACKAGE - MEGTRON 6 VERSUS FR4 PRINTED CIRCUIT
Poster Presentation. IPACK2017-74361 BOARDS
Poster Presentation. IPACK2017-74430
Amir Ziabari, Yi Xuan, Maryam Parsa, Kazuaki Yazawa, Ali Shakouri,
Purdue University, West Lafayette, IN, United States, Je-Hyeong Bahk, Mugdha Chaudhari, Unique Rahangdale, Pavan Rajmane, Aniruddha
University of Cincinnati, Cincinnati, OH, United States, Xavier Alvarez, Doiphode, Abel Misrak, Dereje Agonafer, University of Texas at
Universitat de Autonoma Barcelona, Barcelona, Spain Arlington, Arlington, TX, United States, Jeff Forbus, NetVia Group, LLC,
Irving, TX, United States
DEFORMATION AND WARPAGE OF THE DOUBLE-SIDED
FLEXIBLE PRINTED CIRCUIT BGA ASSEMBLIES THROUGH RACK LEVEL STUDY OF HYBRID COOLED SERVERS USING
REFLOW USING DIC WARM WATER COOLING WITH VARIABLE PUMPING FOR
Poster Presentation. IPACK2017-74267 CENTRALIZED COOLANT SYSTEM
Poster Presentation. IPACK2017-74431
Pradeep Lall, Kartik Goyal, Auburn University, Auburn, AL, United States
Chinmay Kshirsagar, Mathan Kumar Kaliappan, Manasa Sahini, Dereje
POINT OF CARE MICRO BIOCHIP FOR HEALTH CARE MONI- Agonafer, University of Texas at Arlington, Arlington, TX, United States,
TORING Pat McGinn, CoolIT Systems, Calgary, AB, Canada
Poster Presentation. IPACK2017-74297
EXPERIMENTAL AND COMPUTATIONAL STUDY OF
Bharath Babu Nunna, New Jersey Institute of Technology, Randolph, NJ, MULTI-LEVEL COOLING SYSTEMS AT HIGH AMBIENT
United States, Shiqiang Zhuang, NJIT, Harrison, NJ, United States, Eon COOLANT TEMPERATURES
Soo Lee, New Jersey Institute of Technology (NJIT), Newark, NJ, United Poster Presentation. IPACK2017-74432
States
Manasa Sahini, Dereje Agonafer, University of Texas at Arlington,
THIN FILM EVAPORATION WITHIN MICROSCALE PORES Arlington, TX, United States
Poster Presentation. IPACK2017-74368
TEMPERATURE DEPENDENCY OF ADHESION STRENGTH OF
Kimia Montazeri, Yoonjin Won, University of California Irvine, Irvine, CA, RESIN/CU INTERFACE AND ITS DEGRADATION MECHANISM
United States, Hyoungsoon Lee, Chung-Ang University, Seoul, Korea UNDER AGING
(Republic) Poster Presentation. IPACK2017-74032
CFD SIMULATION AND OPTIMIZATION OF THE COOLING OF Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Gunma University, Kiryu,
OPEN COMPUTE MACHINE LEARNING “BIG SUR” SERVER Gunma, Japan, Hiroaki Hokazono, Fuji Electric Corporation, Hino, Tokyo,
Poster Presentation. IPACK2017-74370 Japan
Mangesh M. Dhadve, Jimil M. Shah, Dereje Agonafer, University of RAPID PROTOTYPING OF HIGH-TEMPERATURE MULTI-FUNC-
Texas at Arlington, Arlington, TX, United States TIONAL ALGAN/GAN SENSORS USING LASER ABLATION AND
DIRECT WIRE BONDING
VOIDING EFFECTS ON THE THERMAL RESPONSE OF METAL- Poster Presentation. IPACK2017-74315
LIC PHASE CHANGE MATERIALS UNDER PULSED POWER
LOADING Karen Dowling, Hongyun So, Stanford University, Stanford, CA, United
Poster Presentation. IPACK2017-74419 States, Debbie Senesky, Stanford University, Berkeley, CA, United States
David Gonzalez-Nino, Pedro O. Quintero, University of Puerto Rico - May- ANALYSIS OF COLOR SHIFT AND LIFE-MODELING OF HIGH
aguez Campus, Mayaguez, PR, United States, Lauren M. Boteler, POWER WARM WHITE PC-LED OPERATING IN HIGH TEMPERA-
Nicholas R. Jankowski, Dimeji Ibitayo, U.S. Army Research Laboratory, TURE-HUMIDITY
Adelphi, MD, United States Poster Presentation. IPACK2017-74259
A COMPUTATIONAL APPROACH TO STUDY THE IMPACT OF Pradeep Lall, Hao Zhang, Auburn University, Auburn, AL, United States,
PCB THICKNESS ON QFN ASSEMBLY UNDER DROP TESTING Lynn Davis, RTI International, Research Triangle Park, NC, United States
WITH PACKAGE POWER SUPPLY
Poster Presentation. IPACK2017-74425
Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer,
University of Texas at Arlington, Arlington, TX, United States
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