Page 59 - ASME InterPACK 2017 Program

THURSDAY, AUGUST 31 Technical Sessions

EFFECT OF MATERIAL NON-LINEARITY ON THERMAL AN INVESTIGATION OF MOISTURE-INDUCED INTERFACIAL
FATIGUE RELIABILITY FOR ALUMINUM WIRE BONDS OF DELAMINATION IN PLASTIC IC PACKAGE DURING SOLDER
POWER MODULE REFLOW

Technical Presentation. IPACK2017-74176 Technical Paper Publication. IPACK2017-74017

Nobuyuki Shishido, Noriyuki Miyazaki, Yutaka Hayama, Green Jing Wang, Yuling Niu, Seungbae Park, State University of New York at
Electronics Research Institute, Kitakyushu, Kitakyushu, Japan Binghamton, Vestal, NY, United States

TRACK 8 TECHNOLOGY TALKS RELIABILITY EVALUATION OF AN INTERFACE BETWEEN
ENCAPSULATION RESIN AND SUBSTRATE FOR POWER
Track Chair: Samuel Graham, Georgia Institute of Technology, Lithonia, DEVICES DURING THERMAL CYCLE TEST
GA, United States Technical Presentation. IPACK2017-74041

Track Co-Chair: Kaustubh Nagarkar, GE Global Research Center, Toru Ikeda, Kotaro Inoue, Masaaki Koganemaru, Kagoshima University,
Niskayuna, NY, United States Kagoshima, Japan, Takuya Hatao, Hiroshi Nakaido, Sumitomo Bakelite
Co., Ltd., Utsunomiya, Tochigi, Japan
8-4
TRACK 4 - TECHNOLOGY TALKS EFFECT OF UNDERFILL ON THERMO-MECHANICAL BEHAV-
IOR OF FAN-OUT WLP: AN EXPERIMENTAL STUDY BY AD-
8-4-1 VANCED MOIRÉ INTERFEROMETRY
Technical Presentation. IPACK2017-74048
PACKAGING CHALLENGES AND OPPORTUNITIES FOR
Bulong Wu, Bongtae Han, University of Maryland, College Park, MD,
PHOTOVOLTAICS AND THERMOELECTRICS United States

Second Floor, Jackson 2:15pm – 3:45pm STATISTICAL MODEL CALIBRATION FOR SEMICONDUCTOR
PACKAGES WITH A LARGE NUMBER OF INPUT VARIABLES BY
Session Chair: Matthew Reese, National Renewable Energy Laboratory, APPROXIMATE INTEGRATION METHOD WITH ADVANCED
Golden, CO, United States OBJECTIVE FUNCTION
Technical Presentation. IPACK2017-74071
Session Co-Chair: John Reifenberg, Alphabet Energy Inc., Hayward, CA,
United States Hsiu-Ping Wei, Bongtae Han, University of Maryland, College Park, MD,
United States
PACKAGING NEEDS AND CONSIDERATIONS FOR PHOTOVOL-
TAIC MODULES STRESS-BASED DESIGN STANDARD FOR 3216 TYPE OF
Keynote Presentation. IPACK2017-74343 MULTILAYER CERAMIC CAPACITOR
Technical Paper Publication. IPACK2017-74099
Michael Kempe, NREL, Golden, CO, United States
Takahiro Kinoshita, Takashi Kawakami, Toyama Prefectural University,
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- Imizu, Japan, Tadaharu Adachi, Masahiro Funaki, Toyohashi University of
SYSTEMS WITH DIVERSE FUNCTIONALITY Technology, Aichi, Japan

Track Chair: Kaushik Mysore, AMD, Austin, TX, United States 1-7
THERMAL MANAGEMENT FOR HETEROGENEOUS
Track Co-Chair: Winston Zhang, Novark Technology Inc., Shenzhen, INTEGRATION
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
TX, United States 1-7-3

1-3 THERMAL MANAGEMENT FOR HETEROGENEOUS INTEGRATION
FRACTURE, FATIGUE, AND THERMOMECHANICAL
RELIABILITY OF DEVICES & PACKAGES - III

Second Floor, Washington 4:15pm – 5:45pm

1-3-3 Session Chair: Jaime Sanchez, Intel Corporation, Hillsboro, OR, United
States
FRACTURE, FATIGUE AND THERMOMECHANICAL RELIABILITY - III

Second Floor, Montgomery 4:15pm – 5:45pm

Session Co-Chair: Fahad Mirza, GlobalFoundries, Clifton Park, NY, United Session Co-Chair: Sruti Chigullapalli, Intel, Phoenix, AZ, United States
States, Yuan Zhang, Intel Corporation, Folsom, CA, United States

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