Page 55 - ASME InterPACK 2017 Program
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THURSDAY, AUGUST 31 Technical Sessions
1-5-2 COMPREHENSIVE MODELING OF SINGLE BUBBLE EVAPORA-
TION IN MICROCHANNEL
ADVANCES IN PACKAGING, INTERCONNECTS AND SUBSTRATE Technical Presentation. IPACK2017-74088
TECHNOLOGIES - II Eunho Cho, Hyoungsoon Lee, Chung-Ang University, Seoul, Korea
(Republic), James Palko, Mehdi Asheghi, Kenneth Goodson, Stanford
Second Floor, Washington 11:00am – 12:30pm University, Stanford, CA, United States
Session Chair: Jay Prakash Gupta, INTEL Corporation, Hillsboro, OR, DIVERSION OF HEAT FLOW IN SUPPORTED GRAPHENE
United States NANOMESHES
Technical Presentation. IPACK2017-74113
IS THE HETEROGENEOUS MICROSTRUCTURE OF SNAGCU
(SAC) SOLDERS GOING TO POSE A CHALLENGE FOR HETERO- Ali Yousefzadi Nobakht, Seungha Shin, University of Tennessee,
GENEOUS INTEGRATION? Knoxville, TN, United States
Technical Paper Publication. IPACK2017-74133 MECHANICAL BEHAVIOR OF THERMAL INTERFACE MATERI-
ALS IN ELECTRONIC COMPONENTS UNDER DYNAMIC
Qian Jiang, Abhijit Dasgupta, University of Maryland, College Park, MD, LOADING CONDITIONS
United States, Abhishek Deshpande, Center for Advanced Life Cycle Technical Paper Publication. IPACK2017-74021
Engineering (CALCE), University of Maryland, College Park, MD, United
States Emad A. Poshtan, Bosch, Reutlingen, Germany, Sudarshan Hegde, Bosch
Company, Bangalore, India, Andreas Roessle, Robert Bosch Gmbh,
JOINING OF CU-AG CORE-SHELL NANOPARTICLES AND Reutlingen, Germany
NANOWIRES AT ROOM TEMPERATURE: A MOLECULAR
DYNAMICS STUDY EFFECTS OF BUILD-UP MATERIAL PROPERTIES ON WARPAGE
DISPERSION OF ORGANIC SUBSTRATES CAUSED BY MANU-
Technical Presentation. IPACK2017-74115 FACTURING VARIATIONS
Technical Paper Publication. IPACK2017-74098
Jiaqi Wang, Seungha Shin, University of Tennessee, Knoxville, TN, United
States Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori, IBM Research-Tokyo,
Kawasaki-shi, Kanagawa-ken, Japan
SINTERING DYNAMICS AND SINTERED STRUCTURE PROPER-
TIES OF MULTIPLE Cu-Ag CORE-SHELL NANOPARTICLES ESTIMATION OF EFFECTIVE THERMAL AND MECHANICAL
Technical Presentation. IPACK2017-74114 PROPERTIES OF PARTICULATE THERMAL INTERFACE MATERI-
ALS (TIMS) BY A RANDOM NETWORK MODEL
Jiaqi Wang, Seungha Shin, University of Tennessee, Knoxville, TN, United Technical Paper Publication. IPACK2017-74129
States
Pavan Kumar Vaitheeswaran, Ganesh Subbarayan, Purdue University,
A MOLECULAR DYNAMICS STUDY OF GEOMETRICAL AND West Lafayette, IN, United States
TEMPERATURE EFFECTS ON SINTERING OF TWO CU-AG
CORE-SHELL NANOPARTICLES
Technical Presentation. IPACK2017-74111
Jiaqi Wang, Seungha Shin, Anming Hu, The University of Tennessee,
Knoxville, TN, United States
TRACK 2 SERVERS OF THE FUTURE TRACK 4 ENERGY CONVERSION & STORAGE
Track Chair: Reza Khiabani, Google, Mountain View, CA, United States Track Chair: Sreekant Narumanchi, National Renewable Energy Labora-
tory, Golden, CO, United States
Track Co-Chairs: Sandeep Ahuja, Intel, Hillsboro, OR, United States,
Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, United Track Co-Chair: Lauren M. Boteler, U.S. Army Research Laboratory,
States, Ryan Enright, Bell Labs Ireland, Dublin, Ireland Adelphi, MD, United States, Patrick McCluskey, University of Maryland,
College Park, College Park, MD, United States, Martin Kuball, HH Wills
2-2 Physics Laboratory, Bristol, United Kingdom
MODELING AND SIMULATION
4-1
2-2-1 POWER ELECTRONICS WIDE BAND GAP
SEMICONDUCTORS, PACKAGING, MODULE ASSEMBLY
MODELING AND SIMULATION AT THE CHIP LEVEL AND THERMAL MANAGEMENT
Second Floor, Mason I 11:00am – 12:30pm
Session Chair: Kourosh Nemati, Future Facilities, SAN JOSE, CA, United
States
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Session Co-Chair: Zhimin Wan, Intel Corp., Chandler, AZ, United States
