Page 53 - ASME InterPACK 2017 Program

THURSDAY, AUGUST 31 Technical Sessions

OPTIMIZATION OF GRAPHITE COMPOSITE LATENT HEAT 1-2
STORAGE SYSTEMS ADVANCED MATERIALS AND INTERFACES FOR EMERGING
Technical Paper Publication. IPACK2017-74244
ELECTRONIC PACKAGING PARADIGMS
Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Oak Ridge National
Laboratory, Oak Ridge, TN, United States, Samuel Graham, Georgia 1-2-2 9:15am – 10:45am
Institute of Technology, Lithonia, GA, United States NEW FRONTIERS IN MATERIALS I
Second Floor, Montgomery

TRACK 7 KEYNOTES Session Chair: Ganpati Ramanath, RPI, Troy, NY, United States
Session Co-Chair: Kaushik Mysore, AMD, Austin, TX, United States

7-1 PROCESSING AND APPLICATIONS OF TWO-DIMENSIONAL
TRACK 1 - KEYNOTE NANOMATERIAL INKS
Keynote Presentation. IPACK2017-74166
7-1-1
Mark Hersam, Northwestern University, Evanston, IL, United States
INNOVATION AND INTEGRATION: INDUSTRY - UNIVERSITY
RATIONAL COMPUTATION-GUIDED DESIGN OF POLYMER
COLLABORATION DIELECTRICS
Keynote Presentation. IPACK2017-74335
Second Floor, Jackson 8:00am – 9:00am
Rampi Ramprasad, University of Connecticut, Storrs, CT, United States
Session Chair: Kaushik Mysore, AMD, Austin, TX, United States
TRACK 5 TRANSPORTATION: AUTONOMOUS &
INNOVATION AND INTEGRATION: INDUSTRY - UNIVERSITY ELECTRIC VEHICLES
COLLABORATION
Keynote Presentation. IPACK2017-74353

Gilroy Vandentop, Intel, Chandler, AZ, United States

TRACK 7 KEYNOTES Track Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
States

7-4 Track Co-Chairs: Przemyslaw Gromala, Robert Bosch Gmbh, Reutlingen,
TRACK 4 - KEYNOTE Germany, Ercan M. Dede, Toyota Research Institute of North America, Ann
Arbor, MI, United States, Pradeep Lall, Auburn University, Auburn, AL,
7-4-1 United States

PACKAGING SOLUTIONS TO ENABLE HIGH POWER RF GALLIUM 5-7
SIMULATION AND TEST METHODS
NITRIDE PRODUCTS AND ADVANCED TECHNOLOGIES

Second Floor, Mason II 9:15am – 10:15am

Session Chair: Sreekant Narumanchi, National Renewable Energy 5-7-1
Laboratory, Golden, CO, United States SIMULATION AND TEST METHODS, SESSION 1
Second Floor, Washington
9:15am – 10:45am

Session Co-Chair: Martin Kuball, HH Wills Physics Laboratory, Bristol, Session Chair: Fabian Welschinger, Robert Bosch GmbH, Renningen,
United Kingdom Germany

PACKAGING SOLUTIONS TO ENABLE HIGH POWER RF Session Co-Chair: Ilko Schmadlak, NXP Semiconductors Germany GmbH,
GALLIUM NITRIDE PRODUCTS AND ADVANCED TECHNOLO- Munich, Germany
GIES
Keynote Presentation. IPACK2017-74346 APPLICATION DRIVEN RELIABILITY RESEARCH OF NEXT
GENERATION FOR AUTOMOTIVE ELECTRONICS: CHALLENG-
Quinn Martin, MACOM, Morrisville, NC, United States ES AND APPROACHES

TRACK 1 HETEROGENEOUS INTEGRATION: MICRO- Technical Paper Publication. IPACK2017-74208
SYSTEMS WITH DIVERSE FUNCTIONALITY
Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek, Fraunhofer
Track Chair: Kaushik Mysore, AMD, Austin, TX, United States ENAS, Chemnitz, Germany

Track Co-Chair: Winston Zhang, Novark Technology Inc., Shenzhen, 5533
Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
TX, United States