Page 54 - ASME InterPACK 2017 Program

Technical Sessions THURSDAY, AUGUST 31

ANAND PARAMETERS FOR SAC305 ALLOYS AFTER PRO- 9 -2 -1 9:15am – 10:45am
LONGED STORAGE UP TO 1-YEAR SERVERS OF THE FUTURE
Technical Paper Publication. IPACK2017-74300 Second Floor, Jackson

Pradeep Lall, Di Zhang, Jeffrey Suhling, Auburn University, Auburn Session Chair: Michael Patterson, Intel, Hillsboro, OR, United States
University, AL, United States, David Locker, US Army RDECOM, Huntsville,
AL, United States Session Co-Chair: Reza Khiabani, Google, Mountain View, CA, United
States

THE POISSON’S RATIO OF LEAD FREE SOLDER AND ITS Keynote Presentation. IPACK2017-74402
EFFECT ON SOLDER JOINT RELIABILITY
Technical Presentation. IPACK2017-74272 Steve Branton, Data Center Solution at Asetek, San José, CA, United
States
Km Rafidh Hassan, Munshi Basit, Jeffrey Suhling, Pradeep Lall, Auburn
University, Auburn, AL, United States Keynote Presentation. IPACK2017-74404

CHARACTERIZATION OF DIE STRESSES IN PLASTIC BALL Mukesh Khattar, EPRI, Palo Alto, CA, United States
GRID ARRAY PACKAGES SUBJECTED TO VARIOUS MOISTURE Keynote Presentation. IPACK2017-74403
CONDITIONS Sukhvinder Kang, Aavid Thermalloy, Laconia, NH, United States
Technical Presentation. IPACK2017-74312
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO-
Jun Chen, Quang Nguyen, Jordan Roberts, Auburn University, Auburn, SYSTEMS WITH DIVERSE FUNCTIONALITY
AL, United States, Jeffrey Suhling, Auburn University, Auburn, AL, United
States, Richard Jaeger, Pradeep Lall, Auburn University, Auburn, AL, Track Chair: Kaushik Mysore, AMD, Austin, TX, United States
United States
Track Co-Chair: Winston Zhang, Novark Technology Inc., Shenzhen,
IMPROVED FINITE ELEMENT SIMULATION STRATEGY WITH Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
SUBMODELING FOR BGA PACKAGES SUBJECTED TO TX, United States
THERMAL CYCLING
Technical Presentation. IPACK2017-74258 1-2
ADVANCED MATERIALS AND INTERFACES FOR EMERGING
Chienchih Chen, Jeffrey Suhling, Pradeep Lall, Auburn University, ELECTRONIC PACKAGING PARADIGMS
Auburn, AL, United States
1-2-3 11:00am – 12:30pm
TOWARDS IMPROVEMENT OF LIFETIME PREDICTION OF NEW FRONTIERS IN MATERIALS II
SOLDER JOINTS UNDER FIELD CONDITIONS: ACCELERATED Second Floor, Montgomery
THERMO-MECHANICAL FATIGUE MEASUREMENT ON REALIS-
TIC BGA-GEOMETRY Session Chair: Ganpati Ramanath, RPI, Troy, NY, United States
Technical Presentation. IPACK2017-74416
Session Co-Chair: Kaushik Mysore, AMD, Austin, TX, United States
Marta Kuczynska, Natalja Schafet, Ulrich Becker, Robert Bosch GmbH,
Schwieberdingen, Germany, René Metasch, Mike Roellig, Fraunhofer HEAT AND INTERFACES IN ELECTRONIC MATERIALS
Institute for Ceramic Technologies and Systems, IKTS, Dresden, Sachsen, Keynote Presentation. IPACK2017-74204
Germany, Alexander Kabakchiev, Robert Bosch GmbH, Renningen, BW,
Germany, Alexander Hobt, MPA University Stuttgart, Stuttgart, Germany, Pawel Keblinski, RPI, Troy, NY, United States
Stefan Weihe, Materials Testing Institute (MPA) University of Stuttgart,
Stuttgart, Germany ADDRESSING THERMAL CHALLENGES IN GAN DEVICE
INTEGRATION
TRACK 9 PANELS Keynote Presentation IPACK2017-74455

9 -2 Samuel Graham, Mechanical Engineering, Georgia Institute of Technolo-
TRACK 2 - PANEL gy, GA, USA

1-5
ADVANCED PACKAGING, INTERCONNECTS AND
SUBSTRATE TECHNOLOGIES

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