Page 49 - ASME InterPACK 2017 Program

WEDNESDAY, AUGUST 30 Technical Sessions

AEROSPACE PERSPECTIVE ON CHALLENGES AND OPPORTU- TRACK 7 KEYNOTES
NITIES RELATED TO FLEXIBLE HYBRID ELECTRONICS
Keynote Presentation. IPACK2017-74409 7-5
TRACK 5 - KEYNOTE
Benjamin Leever, Air Force Research Laboratory, Wright-Patterson AFB,
OH, United States 7-5-1

OPPORTUNITIES FOR APPLICATIONS OF BIOSENSING IN TRENDS IN AUTOMOTIVE ELECTRONICS AND SENSORS
WEARABLE FORM FACTORS
Keynote Presentation. IPACK2017-74410 Second Floor, Jackson 4:15pm – 5:15pm

Ramune Nagisetty, Intel Corporation, Portland, OR, United States Session Chair: Milena Vujosevic, Intel Corporation, San Jose, CA, United
States
COMPUTATIONAL MODELING OF MULTI-FUNCTIONAL
STRUCTURES Session Chair: Ercan M. Dede, Toyota Research Institute of North
Keynote Presentation. IPACK2017-74412 America, Ann Arbor, MI, United States

Fu-Kuo Chang, Stanford University, Stanford, CA, United States TRENDS IN AUTOMOTIVE ELECTRONICS AND SENSORS
Keynote Presentation. IPACK2017-74356
MANUFACTURING CAPABILITIES FOR EMERGING FLEXIBLE
TECHNOLOGIES Jiri Marek, Bosch, Palo Alto, CA, United States
Keynote Presentation. IPACK2017-74413
TRACK 1 HETEROGENEOUS INTEGRATION: MICRO-
Anwar Mohammed, Flex, Milpitas, CA, United States SYSTEMS WITH DIVERSE FUNCTIONALITY

9-6 Track Chair: Kaushik Mysore, AMD, Austin, TX, United States
WOMEN IN STEM EDUCATION PANEL

9-6-1 2:15pm – 3:45pm Track Co-Chairs: Winston Zhang, Novark Technology Inc., Shenzhen,
WOMEN IN STEM EDUCATION PANEL Guangdong, China, Ankur Jain, University of Texas at Arlington, Arlington,
Fourth Floor, Columbus I-III TX, United States

Session Chair: Debbie Senesky, Stanford University, Berkeley, CA, United 1-3
States FRACTURE, FATIGUE, AND THERMOMECHANICAL
RELIABILITY OF DEVICES & PACKAGES
Session Co-Chair: Amy Marconnet, Purdue University, West Lafayette, IN,
United States 1-3-2

WOMEN IN STEM EDUCATION PANEL (TSU-JAE KING LIU) FRACTURE, FATIGUE AND THERMOMECHANICAL RELIABILITY - II
Keynote Presentation. IPACK2017-74443
Second Floor, Mason I 4:15pm – 5:45pm

Tsu-Jae King Liu, University of California at Berkeley, Berkeley, CA, United Session Chair: Emre Armagan, Intel Corporation, Chandler, AZ, United
States States

WOMEN IN STEM EDUCATION PANEL (SARAH PARIKH) Session Co-Chair: Jingshi Meng, Apple Inc., Cupertino, CA, United States,
Keynote Presentation. IPACK2017-74421 Helia Rahmani, Apple Inc., Cupertino, CA, United States

Sarah Parikh, Foothill College, Los Altos, CA, United States THE MECHANISM OF THE LOW-K STRESS REDUCTION BY
SHORTER SOLDER BUMP HEIGHT IN CHIP ASSEMBLY
WOMEN IN STEM EDUCATION PANEL (FATIMA ALLEYNE) Technical Paper Publication. IPACK2017-74097
Keynote Presentation. IPACK2017-74423
Keiji Matsumoto, IBM Research-Tokyo, Tokyo, Japan, Keishi Okamoto,
Fatima Alleyne, Contra Costa County Board of Education, Contra Costa Hiroyuki Mori, IBM Research-Tokyo, Kawasaki-shi, Kanagawa-ken, Japan
County, CA, United States
IN-SITU MONITORING VIA SYNCHROTRON RADIATION
WOMEN IN STEM EDUCATION PANEL (COURTENAY CARR LAMINOGRAPHY OF THERMAL FATIGUE CRACKS AT DIE-AT-
HEUER) TACHED JOINTS UNDER CYCLIC ENERGIZATION LOADING
Keynote Presentation. IPACK2017-74420
Technical Paper Publication. IPACK2017-74177

Courtenay Carr Heuer, Scientific Adventures for Girls, Oakland, CA, Hiroyuki Tsuritani, Toshihiko Sayama, Toyama Industrial Technology 4499
United States Center, Toyama-Shi Toyama, Japan, Yoshiyuki Okamoto, Takeshi
Takayanagi, Cosel Co., LTD., Toyama-Shi Toyama, Japan, Masato
Hoshino, Kentaro Uesugi, Japan Synchrotron Radiation Research