Page 52 - ASME InterPACK 2017 Program
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Technical Sessions                                                              THURSDAY, AUGUST 31

THERMO-OPTIC TUNING EFFICIENCY OF MICRO RING                                    INTEGRATED SUBSTRATE - COLD PLATE FOR COMPACT
RESONATORS ON LOW THERMAL RESISTANCE SILICON                                    POWER ELECTRONICS MODULES
PHOTONICS SUBSTRATES                                                            Technical Presentation. IPACK2017-74235
Technical Paper Publication. IPACK2017-74181
                                                                                Darshan Pahinkar, Waylon Puckett, Georgia Institute of Technology,
Shenghui Lei, Nokia Bell Labs, Dublin, Ireland, Alexandre Shen, Nokia           Atlanta, GA, United States, Samuel Graham, Georgia Institute of Technol-
Bell Labs, Marcoussis, France, Ryan Enright, Bell Labs Ireland, Dublin,         ogy, Lithonia, GA, United States
Ireland
                                                                                DECOUPLED HIERARCHICAL STRUCTURES FOR HIGH-HEAT
RACK-LEVEL STUDY OF HYBRID COOLED SERVERS USING                                 FLUX COOLING SYSTEMS
WARM WATER COOLING WITH VARIABLE PUMPING FOR                                    Technical Presentation. IPACK2017-74139
CENTRALIZED COOLANT SYSTEM
Technical Paper Publication. IPACK2017-74260                                    Nazanin Farokhnia, Seyed Mohammad Sajadi, Peyman Irajizad, Hadi
                                                                                Ghasemi, University of Houston, Houston, TX, United States
Chinmay Kshirsagar, Mathan Kumar Kaliappan, Manasa Sahini, Dereje
Agonafer, University of Texas at Arlington, Arlington, TX, United States,       INTEGRATED VAPOR CHAMBER HEAT SPREADER FOR
Pat McGinn, CoolIT Systems, Calgary, AB, Canada                                 POWER MODULE APPLICATIONS
                                                                                Technical Paper Publication. IPACK2017-74132
EXPERIMENTALLY VALIDATED COMPUTATIONAL FLUID
DYNAMICS MODEL FOR DATA CENTER WITH ACTIVE TILES                                Clayton Hose, Advanced Cooling Technologies, Inc., Lancaster, PA,
Technical Paper Publication. IPACK2017-74108                                    United States, Dimeji Ibitayo, Lauren M. Boteler, U.S. Army Research
                                                                                Laboratory, Adelphi, MD, United States, Jens Weyant, Bradley Richard,
Jayati Athavale, Georgia Institute of Technology, Atlanta, GA, United           Advanced Cooling Technologies, Inc., Lancaster, PA, United States
States, Yogendra Joshi, Georgia Inst Of Tech, Atlanta, GA, United States,
Minami Yoda, Georgia Institute of Technology, Atlanta, GA, United States        4-4
                                                                                BATTERIES AND STORAGE DEVICES

TRACK 4 ENERGY CONVERSION & STORAGE                                             4-4-2
                                                                                BATTERIES AND ENERGY STORAGE - II
Track Chair: Sreekant Narumanchi, National Renewable Energy Labora-             Second Floor, Washington           7:30am – 9:00am
tory, Golden, CO, United States
                                                                                Session Chair: Kyle Gluesenkamp, Oak Ridge National Laboratory, Oak
Track Co-Chairs: Lauren M. Boteler, U.S. Army Research Laboratory,              Ridge, TN, United States
Adelphi, MD, United States, Patrick McCluskey, University of Maryland,
College Park, College Park, MD, United States, Martin Kuball, HH Wills          Session Co-Chair: Ayyoub Momen, Oak Ridge National Laboratory, Oak
Physics Laboratory, Bristol, United Kingdom                                     Ridge, TN, United States

4-1                                                                             PUSHING THE ENVELOPE ON BATTERIES: NEW ADVANCED
POWER ELECTRONICS WIDE BAND GAP                                                 CATHODE MATERIALS AND THEIR PROBLEMS
SEMICONDUCTORS, PACKAGING, MODULE ASSEMBLY                                      Keynote Presentation. IPACK2017-74197
AND THERMAL MANAGEMENT
                                                                                Claus Daniel, Jianlin Li, David Wood, III Oak Ridge National Laboratory,
                                                                                Knoxville, TN, United States

4-1-5                                                                           MINIMIZING CAPACITY FADE THROUGH OPTIMAL MOD-
                                                                                EL-BASED CONTROL - THEORY AND EXPERIMENTAL VALIDA-
POWER ELECTRONICS THERMAL MANAGEMENT - I                                        TION

Second Floor, Montgomery                                       7:30am – 9:00am  Technical Presentation. IPACK2017-74078

Session Chair: Ronald Warzoha, United States Naval Academy, Annapo-
lis, MD, United States

Session Co-Chair: Pingye Xu, ON Semiconductor, Phoenix, AZ, United              Manan Pathak, Neal Dawson-Elli, Chintan Pathak, Venkat Subramani-
States                                                                          an, University of Washington, Seattle, WA, United States, Shriram
                                                                                Santhanagopalan, National Renewable Energy Laboratory, Golden, CO,
ADVANCED SIC POWER PACKAGING AND THERMAL MAN-                                   United States
AGEMENT FOR INCREASED SYSTEM PERFORMANCE
Keynote Presentation. IPACK2017-74388                                           THERMAL TRANSPORT IN LITHIUM ION BATTERY CELLS
                                                                                Technical Presentation. IPACK2017-74236

        Ty McNutt, Wolfspeed, Fayetteville, AR, United States                   Amy Marconnet, Amulya Nimmagadda, Bhagyashree Ganore, Purdue
52                                                                              University, West Lafayette, IN, United States

                                                                                Aalok Gaitonde, 3D Systems, Charlotte, NC, United States
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